Patents by Inventor Kyle T. TOBIAS

Kyle T. TOBIAS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170208
    Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
    Type: Application
    Filed: November 17, 2022
    Publication date: May 23, 2024
    Inventors: Douglas P. Riemer, Joseph D. Starkey, Gregory D. MacLeod, Kyle T. Tobias, Justin C. Nall
  • Patent number: 11441942
    Abstract: A radiometer probe for matching a spectral sensitivity of a dry-film resist is provided. The radiometer probe includes a light probe and a filter-diffuser assembly connected to the light probe. The filter-diffuser assembly includes a filter housing configured to receive an optical diffuser positioned on a filter. The optical diffuser and the filter are separated by a spacer.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: September 13, 2022
    Assignee: Hutchinson Technology Incorporated
    Inventors: Matthew S. Lang, Lawrence E. LaLonde, Kyle T. Tobias
  • Patent number: 10783908
    Abstract: Disk drive head suspension components having microstructured surfaces and a method for making the components. One embodiment of the method includes depositing a layer of photoimageable polymer having an associated set of process parameters including a minimum resolution and exposing the photoimageable polymer through a photomask having a microstructure-producing region with features below the minimum resolution for the photoimageable polymer. The exposed photoimageable polymer is developed to produce a layer of polymer having a thickness and a microstructured surface region with depressions that are less than the thickness of the polymer. In one embodiment the photomask has a microstructure-producing region with features sized and spaced between about 1 ?m and 10 ?m. Microstructured surfaces on structures such as flying leads, flying termination pads, cover coat layers and at insulating layer-trace interfaces and insulating layer-cover coat interfaces can be manufactured.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: September 22, 2020
    Assignee: Hutchinson Technology Incorporated
    Inventors: Kyle T. Tobias, Lawrence E. LaLonde, Darrell C. Sydlo
  • Publication number: 20190391007
    Abstract: A radiometer probe for matching a spectral sensitivity of a dry-film resist is provided. The radiometer probe includes a light probe and a filter-diffuser assembly connected to the light probe. The filter-diffuser assembly includes a filter housing configured to receive an optical diffuser positioned on a filter. The optical diffuser and the filter are separated by a spacer.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 26, 2019
    Inventors: Matthew S. Lang, Lawrence E. LaLonde, Kyle T. Tobias
  • Publication number: 20160329067
    Abstract: Methods for producing flexible circuits can include creating treating a surface of the flexible circuit with at least one of an atmospheric plasma and a beam of ions. The atmospheric plasma is formed by directing a flow of gas between an electrode and the surface of the flexible circuit and generating a voltage between the electrode and the flexible circuit to create a plasma from the gas. A mean ion energy of the ions in the ion beam ranges from about 500 electron volts to about 1,500 electron volts.
    Type: Application
    Filed: May 6, 2016
    Publication date: November 10, 2016
    Inventors: Kurt F. Fischer, Alex W. Haas, Matthew J. Horner, Peter F. Ladwig, Carl C. Minton, Paul V. Pesavento, David D. Smahel, Christopher J. Sperl, Darrell C. Sydlo, Ritesh K. Tiwari, Kyle T. Tobias, Maryam O. Yusuf
  • Patent number: 9361915
    Abstract: A method for making a disk drive head suspension component having a microstructured surface region includes depositing a layer of photoimageable polymer having an associated set of process parameters including a minimum resolution and exposing the photoimageable polymer through a photomask having a microstructure-producing region with features below the minimum resolution for the photoimageable polymer. The exposed photoimageable polymer is developed to produce a layer of polymer having a thickness and a microstructured surface region with depressions that are less than the thickness of the polymer.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: June 7, 2016
    Assignee: Hutchinson Technology Incorporated
    Inventors: Kyle T. Tobias, Lawrence E. LaLonde, Darrell C. Sydlo
  • Patent number: 9093117
    Abstract: Various embodiments concern an electrical interconnect of a head suspension. The electrical interconnect can comprise a spring metal layer and a dielectric layer having an aperture with a portion of the spring metal layer being exposed through the dielectric layer within the aperture. The electrical interconnect can further comprise a trace layer disposed on the dielectric layer and extending into the aperture to connect with the spring metal layer. Part of the spring metal layer within the aperture may not be covered by the trace layer. The exposure of the spring metal layer through the aperture can be due to the width of the trace layer being less than the width of the aperture and/or the exposure can be due to expected misregistration. A polymer covercoat can be applied over the aperture to protect the trace layer from corrosion.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: July 28, 2015
    Assignee: Hutchinson Technology Incorporated
    Inventor: Kyle T. Tobias
  • Publication number: 20130248231
    Abstract: Various embodiments concern an electrical interconnect of a head suspension. The electrical interconnect can comprise a spring metal layer and a dielectric layer having an aperture with a portion of the spring metal layer being exposed through the dielectric layer within the aperture. The electrical interconnect can further comprise a trace layer disposed on the dielectric layer and extending into the aperture to connect with the spring metal layer. Part of the spring metal layer within the aperture may not be covered by the trace layer. The exposure of the spring metal layer through the aperture can be due to the width of the trace layer being less than the width of the aperture and/or the exposure can be due to expected misregistration. A polymer covercoat can be applied over the aperture to protect the trace layer from corrosion.
    Type: Application
    Filed: March 21, 2013
    Publication date: September 26, 2013
    Applicant: Hutchinson Technology Incorporated
    Inventor: Kyle T. TOBIAS