Patents by Inventor Kyoko Ikeda
Kyoko Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20150073710Abstract: A method and system for determining and displaying lightning potential information is provided. The method includes receiving a radar data and temperature data for a grid location. If the radar data is above a radar threshold and the temperature data is below a temperature threshold a predictor field is computed. One or more predictor fields may be used to determine a lightning potential. Fuzzy logic may be used to combine predictor fields into a lightning potential. A grid of lightning potential values may be used to determine the lightning potential at a target location, or to indicate the lightning potential in a region outside an inner outlook region including the target location. A display may include an icon with an inner and outer portion displaying lightning potential in an inner and outer outlook region. A display may further include future lightning potential information.Type: ApplicationFiled: August 27, 2014Publication date: March 12, 2015Applicant: University Corporation for Atmospheric ResearchInventors: Wiebke Kristina Deierling, Kyoko Ikeda, Matthias Steiner
-
Publication number: 20140256157Abstract: A vaporizing unit, in supplying a gas material produced by vaporizing a liquid material onto a substrate to conduct a film forming process, can vaporize the liquid material with high efficiency to suppress generation of particles. With the vaporizing unit, positively or negatively charged bubbles, which have a diameter of 1000 nm or less, are produced in the liquid material, and the liquid material is atomized to form a mist of the liquid material. Further, the mist of the liquid material is heated and vaporized. The fine bubbles are uniformly dispersed in advance in the liquid material, so that very fine and uniform mist particles of the liquid material are produced when the liquid material is atomized, which makes heat exchange readily conducted. By vaporizing the mist of the liquid material, vaporization efficiency is enhanced, and generation of particles can be suppressed.Type: ApplicationFiled: May 19, 2014Publication date: September 11, 2014Applicant: Tokyo Electron LimitedInventors: Ikuo SAWADA, Sumie Nagaseki, Kyoko Ikeda
-
Patent number: 8100147Abstract: The present invention provides a particle measuring system which is provided in a processing system 40 which generates an atmosphere obtained by exhausting air or a gas in a processing chamber 48 by a vacuum pump 98 and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe 90 which connects an exhaust opening 86 of the processing chamber 48 with the vacuum pump 98, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: GrantFiled: July 24, 2007Date of Patent: January 24, 2012Assignee: Tokyo Electron LimitedInventors: Hayashi Otsuki, Tsukasa Matsuda, Kyoko Ikeda
-
Patent number: 7931945Abstract: The present invention provides a particle measuring system which is provided in a processing system 40 which generates an atmosphere obtained by exhausting air or a gas in a processing chamber 48 by a vacuum pump 98 and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe 90 which connects an exhaust opening 86 of the processing chamber 48 with the vacuum pump 98, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: GrantFiled: July 24, 2007Date of Patent: April 26, 2011Assignee: Tokyo Electron LimitedInventors: Hayashi Otsuki, Tsukasa Matsuda, Kyoko Ikeda
-
Patent number: 7894059Abstract: The present invention provides a particle measuring system which is provided in a processing system 40 which generates an atmosphere obtained by exhausting air or a gas in a processing chamber 48 by a vacuum pump 98 and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe 90 which connects an exhaust opening 86 of the processing chamber 48 with the vacuum pump 98, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: GrantFiled: October 31, 2007Date of Patent: February 22, 2011Assignee: Tokyo Electron LimitedInventors: Hayashi Otsuki, Tsukasa Matsuda, Kyoko Ikeda
-
Publication number: 20100297346Abstract: A vaporizing unit, in supplying a gas material produced by vaporizing a liquid material onto a substrate to conduct a film forming process, can vaporize the liquid material with high efficiency to suppress generation of particles. With the vaporizing unit, positively or negatively charged bubbles, which have a diameter of 1000 nm or less, are produced in the liquid material, and the liquid material is atomized to form a mist of the liquid material. Further, the mist of the liquid material is heated and vaporized. The fine bubbles are uniformly dispersed in advance in the liquid material, so that very fine and uniform mist particles of the liquid material are produced when the liquid material is atomized, which makes heat exchange readily conducted. By vaporizing the mist of the liquid material, vaporization efficiency is enhanced, and generation of particles can be suppressed.Type: ApplicationFiled: August 11, 2008Publication date: November 25, 2010Applicant: TOKYO ELECTRON LIMITEDInventors: Ikuo Sawada, Sumie Nagaseki, Kyoko Ikeda, Tatsuro Ohshita
-
Publication number: 20100139565Abstract: The present invention provides a particle measuring system which is provided in a processing system 40 which generates an atmosphere obtained by exhausting air or a gas in a processing chamber 48 by a vacuum pump 98 and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe 90 which connects an exhaust opening 86 of the processing chamber 48 with the vacuum pump 98, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: ApplicationFiled: February 16, 2010Publication date: June 10, 2010Inventors: Hayashi OTSUKI, Tsukasa MATSUDA, Kyoko IKEDA
-
Patent number: 7667840Abstract: The present invention provides a particle measuring system which is provided in a processing system that generates an atmosphere obtained by exhausting air or a gas in a processing chamber by a vacuum pump and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe which connects an exhaust opening of the processing chamber with the vacuum pump, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: GrantFiled: December 27, 2007Date of Patent: February 23, 2010Assignee: Tokyo Electron LimitedInventors: Hayashi Otsuki, Tsukasa Matsuda, Kyoko Ikeda
-
Patent number: 7515264Abstract: The present invention provides a particle measuring system which is provided in a processing system 40 which generates an atmosphere obtained by exhausting air or a gas in a processing chamber 48 by a vacuum pump 98 and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe 90 which connects an exhaust opening 86 of the processing chamber 48 with the vacuum pump 98, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: GrantFiled: December 18, 2002Date of Patent: April 7, 2009Assignee: Tokyo Electron LimitedInventors: Hayashi Otsuki, Tsukasa Matsuda, Kyoko Ikeda
-
Patent number: 7511814Abstract: The present invention provides a particle measuring system which is provided in a processing system 40 which generates an atmosphere obtained by exhausting air or a gas in a processing chamber 48 by a vacuum pump 98 and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe 90 which connects an exhaust opening 86 of the processing chamber 48 with the vacuum pump 98, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: GrantFiled: July 24, 2007Date of Patent: March 31, 2009Assignee: Tokyo Electron LimitedInventors: Hayashi Otsuki, Tsukasa Matsuda, Kyoko Ikeda
-
Publication number: 20080264338Abstract: The present invention provides a particle measuring system which is provided in a processing system that generates an atmosphere obtained by exhausting air or a gas in a processing chamber by a vacuum pump and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe which connects an exhaust opening of the processing chamber with the vacuum pump, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: ApplicationFiled: December 27, 2007Publication date: October 30, 2008Inventors: Hayashi OTSUKI, Tsukasa Matsuda, Kyoko Ikeda
-
Publication number: 20080069671Abstract: The present invention provides a particle measuring system which is provided in a processing system 40 which generates an atmosphere obtained by exhausting air or a gas in a processing chamber 48 by a vacuum pump 98 and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe 90 which connects an exhaust opening 86 of the processing chamber 48 with the vacuum pump 98, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: ApplicationFiled: October 31, 2007Publication date: March 20, 2008Applicant: TOKYO ELECTRON LIMITEDInventors: Hayashi OTSUKI, Tsukasa MATSUDA, Kyoko IKEDA
-
Publication number: 20080065340Abstract: The present invention provides a particle measuring system which is provided in a processing system 40 which generates an atmosphere obtained by exhausting air or a gas in a processing chamber 48 by a vacuum pump 98 and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe 90 which connects an exhaust opening 86 of the processing chamber 48 with the vacuum pump 98, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: ApplicationFiled: October 31, 2007Publication date: March 13, 2008Applicant: TOKYO ELECTRON LIMITEDInventors: Hayashi OTSUKI, Tsukasa Matsuda, Kyoko Ikeda
-
Publication number: 20070263217Abstract: The present invention provides a particle measuring system which is provided in a processing system 40 which generates an atmosphere obtained by exhausting air or a gas in a processing chamber 48 by a vacuum pump 98 and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe 90 which connects an exhaust opening 86 of the processing chamber 48 with the vacuum pump 98, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: ApplicationFiled: July 24, 2007Publication date: November 15, 2007Applicant: TOKYO ELECTRON LIMITEDInventors: Hayashi Otsuki, Tsukasa Matsuda, Kyoko Ikeda
-
Publication number: 20070261740Abstract: The present invention provides a particle measuring system which is provided in a processing system 40 which generates an atmosphere obtained by exhausting air or a gas in a processing chamber 48 by a vacuum pump 98 and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe 90 which connects an exhaust opening 86 of the processing chamber 48 with the vacuum pump 98, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: ApplicationFiled: July 24, 2007Publication date: November 15, 2007Applicant: TOKYO ELECTRON LIMITEDInventors: Hayashi Otsuki, Tsukasa Matsuda, Kyoko Ikeda
-
Publication number: 20070264444Abstract: The present invention provides a particle measuring system which is provided in a processing system 40 which generates an atmosphere obtained by exhausting air or a gas in a processing chamber 48 by a vacuum pump 98 and applies a process concerning semiconductor manufacture to a wafer W in the atmosphere, attached to an exhaust pipe 90 which connects an exhaust opening 86 of the processing chamber 48 with the vacuum pump 98, and measures the number of the particles in the exhaust gas, and a measuring method thereof, the system and method providing a processing system and a cleaning method which terminate etching process by determining an end point based on the number of the particles in the exhaust gas and perform cleaning of unnecessary films.Type: ApplicationFiled: July 24, 2007Publication date: November 15, 2007Applicant: TOKYO ELECTRON LIMITEDInventors: Hayashi Otsuki, Tsukasa Matsuda, Kyoko Ikeda
-
Patent number: 7290042Abstract: The present invention provides a server apparatus, which can fetch image data in a desired state and a system including the server apparatus. In the server apparatus, received designation information is analyzed. When specific profile data is designated by profile designation information, the designated profile data is fetched from profile DB. When “profile data is embedded” is designated by transmission method designation information of the designation information, after the fetched profile data is embedded in the image data and then transmitted to a terminal device. When “conversion is performed by profile” is designated by the transmission method designation information, the image data is subjected to color conversion, resolution conversion, or affine conversion based on the fetched profile data and then transmitted to the terminal device. When “only image” is designated by the transmission method designation information, the image data is directly transmitted to the terminal device.Type: GrantFiled: February 5, 2003Date of Patent: October 30, 2007Assignee: FUJIFILM CorporationInventors: Yoshiaki Kinoshita, Kyoko Ikeda
-
Publication number: 20070022954Abstract: A shower head formed by stacking a shower base, a gas diffusion plate, and a shower plate and supplying material gas and oxidizer gas to a wafer on a loading table through a first gas diffusion part and a second gas diffusion part formed in both faces of the gas diffusion plate, first gas outlets formed in the shower plate and communicating with a first gas diffusion space, and second gas outlets formed in the shower plate and communicating with a second gas diffusion space. A plurality of heat transfer columns fitted closely to the lower surface of the shower base are installed in the first gas diffusion part so that portions therebetween can form the first gas diffusion space, and radiant heat from the loading table is transmitted by the heat transfer columns in the thickness direction of the shower head.Type: ApplicationFiled: August 30, 2004Publication date: February 1, 2007Applicant: TOKYO ELECTRON LIMITEDInventors: Hachishiro Iizuka, Koichiro Kimura, Kyoko Ikeda, Tomoyuki Sakoda, Akira Yasumuro
-
Publication number: 20060238827Abstract: An image processing apparatus comprises an image data obtaining section that obtains image data, an image analyzing section that analyzes an image represented by the image data obtained by the image data obtaining section, an image processing section that applies image processing to the image data obtained by the image data obtaining section in accordance with an analyzing result analyzed by the image analyzing section and a processing parameter for introducing processing contents from the analyzing result, and a parameter adjusting section that adjusts, prior to the image processing by the image processing section, the processing parameter in accordance with an operation.Type: ApplicationFiled: April 20, 2006Publication date: October 26, 2006Inventors: Kyoko Ikeda, Shigeki Kawakami, Hirokazu Kameyama
-
Publication number: 20050190388Abstract: This invention provides a color conversion system, a color conversion apparatus and color conversion program storage medium which include a correction defining section that defines a range correction to correct a brightness range of a color according to an operation and a range correcting section that performs a range correction defined by the correction defining section to multiple conversion subjects to which the color conversion is performed, or include a gain defining section that defines a gain adjustment in at least one of a first device color space and a second device color space according to an operation apart from a first color conversion definition and a second color conversion definition and a gain adjustment section that performs the gain adjustment defined by the gain defining section to the multiple conversion subjects to which the color conversion is performed.Type: ApplicationFiled: February 9, 2005Publication date: September 1, 2005Inventors: Shigeki Kawakami, Kyoko Ikeda, Yoshiaki Kinoshita, Kiyomi Tamagawa