Patents by Inventor KYOKO NISHIDONO

KYOKO NISHIDONO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip-encapsulating resin composition containing epoxy resin, and semiconductor package including a cured product of the semiconductor-chip-encapsulating resin composition
    Patent number: 11244878
    Abstract: A semiconductor-chip-encapsulating resin composition according to the present disclosure contains: an epoxy resin; a curing agent; and a low-valent titanium oxide, of which a titanium atom has an oxidation number less than +IV. A semiconductor package according to the present disclosure includes: a semiconductor chip; and an encapsulation resin which covers the semiconductor chip and which is a cured product of the semiconductor-chip-encapsulating resin composition.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: February 8, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kyoko Nishidono, Takahiro Akashi
  • SEMICONDUCTOR-CHIP-ENCAPSULATING RESIN COMPOSITION AND SEMICONDUCTOR PACKAGE
    Publication number: 20210183719
    Abstract: A semiconductor-chip-encapsulating resin composition according to the present disclosure contains: an epoxy resin; a curing agent; and a low-valent titanium oxide, of which a titanium atom has an oxidation number less than +IV. A semiconductor package according to the present disclosure includes: a semiconductor chip; and an encapsulation resin which covers the semiconductor chip and which is a cured product of the semiconductor-chip-encapsulating resin composition.
    Type: Application
    Filed: October 31, 2018
    Publication date: June 17, 2021
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kyoko NISHIDONO, Takahiro AKASHI
  • Sealing epoxy resin composition, hardened product, and semiconductor device
    Patent number: 9633922
    Abstract: A sealing epoxy resin composition contains a phosphonium salt shown in Formula (1), an epoxy resin, a hardening agent, and an inorganic filler. In Formula (1), R1-R3 each represent an aryl group having 6 to 12 carbon atoms, R4 represents an alkyl group having 1 to 4 carbon atoms, R6 and R8 each represent either a carboxyl group or a hydroxyl group, R5 and R7 each represent either hydrogen or an alkyl group having 1 to 4 carbon atoms, R9 and R11 represent hydrogen, R10 represents either a carboxyl group or a hydroxyl group, and the relation of r?1 is satisfied.
    Type: Grant
    Filed: May 14, 2016
    Date of Patent: April 25, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuto Ogawa, Kyoko Nishidono, Emi Iwatani, Keigo Takagi
  • SEALING EPOXY RESIN COMPOSITION, HARDENED PRODUCT, AND SEMICONDUCTOR DEVICE
    Publication number: 20160260645
    Abstract: A sealing epoxy resin composition contains a phosphonium salt shown in Formula (1), an epoxy resin, a hardening agent, and an inorganic filler. In Formula (1), R1-R3 each represent an aryl group having 6 to 12 carbon atoms, R4 represents an alkyl group having 1 to 4 carbon atoms, R6 and R8 each represent either a carboxyl group or a hydroxyl group, R5 and R7 each represent either hydrogen or an alkyl group having 1 to 4 carbon atoms, R9 and R11 represent hydrogen, R10 represents either a carboxyl group or a hydroxyl group, and the relation of r?1 is satisfied.
    Type: Application
    Filed: May 14, 2016
    Publication date: September 8, 2016
    Inventors: KAZUTO OGAWA, KYOKO NISHIDONO, EMI IWATANI, KEIGO TAKAGI