Patents by Inventor Kyoko OTSUKA

Kyoko OTSUKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11778749
    Abstract: To provide a mounting structure in which a connection unit is protected and a non-flexible region is small, the mounting structure includes a flexible wiring board, a non-flexible component, and a connection unit provided in a region smaller than a bottom face of the non-flexible component and connecting the flexible wiring board and the non-flexible component. The mounting structure includes a protection resin sealing the connection unit in such a way that the flexible wiring board and the non-flexible component are separable. The protection resin covers only a region where the connection unit is provided. To a face of the flexible wiring board, being on an opposite side to the connection unit, a reinforcing material is added. The reinforcing material covers a region where the connection unit is provided and being narrower than the bottom face of the non-flexible component.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: October 3, 2023
    Assignee: NEC CORPORATION
    Inventor: Kyoko Otsuka
  • Publication number: 20220160072
    Abstract: Provided is an insole-type electronic device wherein the electronic module is not susceptible to impact and/or load due to walking or running. The insole-type electronic device is an electronic device wherein an electronic module has been incorporated in the insole that is laid on the midsole of a shoe and contacts the sole of the foot. The insole-type electronic device has an insole body with the shape of a normal insole. Said insole body has a heel-protecting part that extends upward from the back end of the heel section of the insole body along the perimeter of the back end of the heel section. Additionally, the insole-type electronic device has an electronic module that is housed in the heel-protecting part.
    Type: Application
    Filed: February 19, 2020
    Publication date: May 26, 2022
    Applicant: NEC Corporation
    Inventors: Kyoko OTSUKA, Takeshi ITOU, Yuuki MOMOKAWA
  • Patent number: 11304295
    Abstract: In order to provide a mounting structure that has high reliability and easily follows a curved surface, the mounting structure includes a flexible circuit board, a non-flexible component, and a connection portion that is provided in a region smaller than a bottom surface of the non-flexible component and connects the flexible circuit board and the non-flexible component to each other. Further, a protection resin that seals the connection portion in such a way that the flexible circuit board and the non-flexible component are separable from each other outside of the connection portion, is provided. In this configuration, the protection resin covers only a region provided with the connection portion. Thus, the connection portion is mechanically reinforced by the protection resin, and is protected from moisture and dust. Further, on an outside of the connection portion, the flexible circuit board can be bent.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: April 12, 2022
    Assignee: NEC Corporation
    Inventor: Kyoko Otsuka
  • Publication number: 20220095460
    Abstract: To provide a mounting structure in which a connection unit is protected and a non-flexible region is small, the mounting structure includes a flexible wiring board, a non-flexible component, and a connection unit provided in a region smaller than a bottom face of the non-flexible component and connecting the flexible wiring board and the non-flexible component. The mounting structure includes a protection resin sealing the connection unit in such a way that the flexible wiring board and the non-flexible component are separable. The protection resin covers only a region where the connection unit is provided. To a face of the flexible wiring board, being on an opposite side to the connection unit, a reinforcing material is added. The reinforcing material covers a region where the connection unit is provided and being narrower than the bottom face of the non-flexible component.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 24, 2022
    Applicant: NEC Corporation
    Inventor: Kyoko OTSUKA
  • Publication number: 20210289620
    Abstract: In order to provide a mounting structure that has high reliability and easily follows a curved surface, the mounting structure includes a flexible circuit board, a non-flexible component, and a connection portion that is provided in a region smaller than a bottom surface of the non-flexible component and connects the flexible circuit board and the non-flexible component to each other. Further, a protection resin that seals the connection portion in such a way that the flexible circuit board and the non-flexible component are separable from each other outside of the connection portion, is provided. In this configuration, the protection resin covers only a region provided with the connection portion. Thus, the connection portion is mechanically reinforced by the protection resin, and is protected from moisture and dust. Further, on an outside of the connection portion, the flexible circuit board can be bent.
    Type: Application
    Filed: March 9, 2021
    Publication date: September 16, 2021
    Applicant: NEC Corporation
    Inventor: Kyoko OTSUKA
  • Publication number: 20210144668
    Abstract: In order to promptly specify, with low power consumption, a location of a wearable device departed from a group, the wearable terminal includes a short-distance radio communicator, a location information report request receiver, a location information acquisition unit, and a long-distance radio communicator. The short-distance radio communicator normally performs short-distance radio communication with another wearable terminal. The location information report request receiver receives an externally transmitted location information report request requesting a wearable terminal to report location information of the local terminal to a specified destination. When the location information report request receiver receives the location information report request, the location information acquisition unit acquires location information of the local terminal. The long-distance radio communicator transmits the acquired location information to a destination specified by the location information report request.
    Type: Application
    Filed: November 2, 2020
    Publication date: May 13, 2021
    Applicant: NEC Corporation
    Inventor: Kyoko OTSUKA