Abstract: Disclosed are an uncut chip plate and a chip substrate. The uncut chip plate includes: conductive portions laminated in one direction to constitute the uncut chip plate; insulation portions alternately laminated with the conductive portions to electrically isolate the conductive portions; and cavities formed at a predetermined depth in a hemispherical concave shape in regions including each of the insulation portions in a corresponding relationship with unit chip substrates defined on an upper surface of the uncut chip plate. According to the present invention, an optical element chip package exhibiting a high illuminance in a central portion can be realized through the use of an easy-to-process planar lens. Furthermore, as compared with a case where a hemispherical lens is used, it is possible to reduce the thickness of the chip package. This makes it possible to reduce the thickness of a device to which the chip package is applied.