Patents by Inventor Kyou Tomikawa

Kyou Tomikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11739990
    Abstract: A heat transport system includes: a refrigerant circuit that seals therein a fluid including HFC-32 and/or HFO refrigerant as a refrigerant and that includes a refrigerant booster that boosts the refrigerant, an outdoor air heat exchanger that exchanges heat between the refrigerant and outdoor air, a medium heat exchanger that exchanges heat between the refrigerant and a heat transfer medium, and a refrigerant flow path switch that switches between a refrigerant radiation state and a refrigerant evaporation state; and a medium circuit that seals carbon dioxide therein as the heat transfer medium.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: August 29, 2023
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hiromune Matsuoka, Ryuusuke Fujiyoshi, Kyou Tomikawa, Yoshihiko Hagiwara
  • Publication number: 20220178591
    Abstract: A heat transport system includes: a refrigerant circuit that seals therein a fluid including HFC-32 and/or HFO refrigerant as a refrigerant and that includes a refrigerant booster that boosts the refrigerant, an outdoor air heat exchanger that exchanges heat between the refrigerant and outdoor air, a medium heat exchanger that exchanges heat between the refrigerant and a heat transfer medium, and a refrigerant flow path switch that switches between a refrigerant radiation state and a refrigerant evaporation state; and a medium circuit that seals carbon dioxide therein as the heat transfer medium.
    Type: Application
    Filed: February 22, 2022
    Publication date: June 9, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hiromune Matsuoka, Ryuusuke Fujiyoshi, Kyou Tomikawa, Yoshihiko Hagiwara
  • Patent number: 11293670
    Abstract: A heat transport system includes: a refrigerant circuit that seals therein a fluid including HFC-32 and/or HFO refrigerant as a refrigerant and that includes: a refrigerant booster that boosts the refrigerant; an outdoor air heat exchanger that exchanges heat between the refrigerant and outdoor air; a medium heat exchanger that exchanges heat between the refrigerant and a heat transfer medium; and a refrigerant flow path switch that switches between a refrigerant radiation state and a refrigerant evaporation state; and a medium circuit that seals carbon dioxide therein as the heat transfer medium.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: April 5, 2022
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hiromune Matsuoka, Ryuusuke Fujiyoshi, Kyou Tomikawa, Yoshihiko Hagiwara
  • Publication number: 20210333021
    Abstract: A heat transport system includes: a refrigerant circuit that seals therein a fluid including HFC-32 and/or HFO refrigerant as a refrigerant and that includes: a refrigerant booster that boosts the refrigerant; an outdoor air heat exchanger that exchanges heat between the refrigerant and outdoor air; a medium heat exchanger that exchanges heat between the refrigerant and a heat transfer medium; and a refrigerant flow path switch that switches between a refrigerant radiation state and a refrigerant evaporation state; and a medium circuit that seals carbon dioxide therein as the heat transfer medium.
    Type: Application
    Filed: June 19, 2018
    Publication date: October 28, 2021
    Applicants: DAIKIN INDUSTRIES, LTD., Daikin Applied Americas Inc.
    Inventors: Hiromune Matsuoka, Ryuusuke Fujiyoshi, Kyou Tomikawa, Yoshihiko Hagiwara