Patents by Inventor Kyoung Hern HONG

Kyoung Hern HONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lamination apparatus and lamination method using the same
    Patent number: 10105943
    Abstract: Disclosed herein are a lamination apparatus which adheres substrates to a cover window having a curved surface and a lamination method using the same. The lamination apparatus includes a first jig on which a cover window is mounted, wherein a curved surface portion is formed in the cover window and a curvature center thereof is positioned behind the curved surface portion, a second jig on which a guide member is seated, wherein a substrate is mounted on the guide member and the guide member has a width greater than that of the substrate, and an interference member provided to interfere with both facing front surfaces of the guide member, wherein the interference member interferes with the guide member and the guide member is bent when the second jig approaches the first jig.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: October 23, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Do Hyung Kim, Dong-Hee Han, Do-Wan Kim, Byeong-Cheol Kim, Hak Rae Kim, Jung Hun Sung, Sung-Gwan Woo, Kyung Woon Jang, Chang Kyu Chung, Kyoung Hern Hong, Sung-Ju Hwang
  • LAMINATION APPARATUS AND LAMINATION METHOD USING THE SAME
    Publication number: 20160318293
    Abstract: Disclosed herein are a lamination apparatus which adheres substrates to a cover window having a curved surface and a lamination method using the same. The lamination apparatus includes a first jig on which a cover window is mounted, wherein a curved surface portion is formed in the cover window and a curvature center thereof is positioned behind the curved surface portion, a second jig on which a guide member is seated, wherein a substrate is mounted on the guide member and the guide member has a width greater than that of the substrate, and an interference member provided to interfere with both facing front surfaces of the guide member, wherein the interference member interferes with the guide member and the guide member is bent when the second jig approaches the first jig.
    Type: Application
    Filed: April 27, 2016
    Publication date: November 3, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Do Hyung KIM, Dong-Hee HAN, Do-Wan KIM, Byeong-Cheol KIM, Hak Rae KIM, Jung Hun SUNG, Sung-Gwan WOO, Kyung Woon JANG, Chang Kyu CHUNG, Kyoung Hern HONG, Sung-Ju HWANG