Patents by Inventor Kyoung Sup CHOI

Kyoung Sup CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10475589
    Abstract: A tantalum capacitor includes a capacitor body; a tantalum wire protruding from one surface of the capacitor body; a molded part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the molded part; and a cathode lead frame disposed on an outer surface of the capacitor body and exposed to the outer surface of the molded part. The anode lead frame includes a bend portion.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: November 12, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Wan Suk Yang, Hong Kyu Shin, Kyoung Sup Choi, Woo Sung Lee
  • Publication number: 20180144875
    Abstract: A tantalum capacitor includes a capacitor body; a tantalum wire protruding from one surface of the capacitor body; a molded part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the molded part; and a cathode lead frame disposed on an outer surface of the capacitor body and exposed to the outer surface of the molded part. The anode lead frame includes a bend portion.
    Type: Application
    Filed: January 5, 2018
    Publication date: May 24, 2018
    Inventors: Wan Suk YANG, Hong Kyu SHIN, Kyoung Sup CHOI, Woo Sung LEE
  • Publication number: 20160133389
    Abstract: A tantalum capacitor includes a capacitor body; a tantalum wire disposed on a surface of the capacitor body; an encapsulant part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the encapsulant part; and a cathode lead frame disposed on a surface of the capacitor body and exposed to the outer surface of the encapsulant part. The anode lead frame includes a pillow head part connected to the tantalum wire and an electrode plate connected to the pillow head part and exposed to the outer surface of the encapsulant part, and the pillow head part includes an etched surface.
    Type: Application
    Filed: October 15, 2015
    Publication date: May 12, 2016
    Inventors: Wan Suk YANG, Hong Kyu SHIN, Kyoung Sup CHOI
  • Publication number: 20160133390
    Abstract: A tantalum capacitor includes a capacitor body; a tantalum wire protruding from one surface of the capacitor body; a molded part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the molded part; and a cathode lead frame disposed on an outer surface of the capacitor body and exposed to the outer surface of the molded part. The anode lead frame includes a bend portion.
    Type: Application
    Filed: October 16, 2015
    Publication date: May 12, 2016
    Inventors: Wan Suk YANG, Hong Kyu SHIN, Kyoung Sup CHOI, Woo Sung LEE
  • Publication number: 20160133388
    Abstract: A tantalum capacitor includes a capacitor body; a tantalum wire disposed on a surface of the capacitor body; an encapsulant part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the encapsulant part; and a cathode lead frame disposed on a surface of the capacitor body and exposed to the outer surface of the encapsulant part. The anode lead frame includes a plating part connected to the tantalum wire and an electrode plate connected to the plating part and exposed to the outer surface of the encapsulant part.
    Type: Application
    Filed: September 29, 2015
    Publication date: May 12, 2016
    Inventors: Wan Suk YANG, Hong Kyu SHIN, Kyoung Sup CHOI
  • Patent number: 9336956
    Abstract: A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: May 10, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Bum Cho, Kyoung Sup Choi, Hong Kyu Shin, Jeong Oh Hong, Wan Suk Yang, Hyun Sub Oh
  • Publication number: 20150116910
    Abstract: A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.
    Type: Application
    Filed: March 14, 2014
    Publication date: April 30, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Bum CHO, Kyoung Sup CHOI, Hong Kyu SHIN, Jeong Oh HONG, Wan Suk YANG, Hyun Sub OH