Patents by Inventor Kyung Dong Ryu

Kyung Dong Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932725
    Abstract: The present invention relates to a biodegradable polyester resin, in which the first repeat unit comprising a first diol residue and an aromatic dicarboxylic acid residue and the second repeat unit comprising a second diol residue and an aliphatic dicarboxylic acid residue satisfy a ratio of the number of repeat units in a specific range, and the softness index of the resin satisfies a specific range, and to a process for preparing the same. Since the biodegradable polyester resin can provide a biodegradable polyester sheet or film that can be simultaneously enhanced in productivity, processability, and moldability and is excellent in tensile strength, tear strength, and friction coefficient and excellent in biodegradability and water degradability, it can be utilized in more diverse fields.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: March 19, 2024
    Assignee: Ecovance Co. Ltd.
    Inventors: Kyung Youn Kim, Hoon Kim, Seong Dong Kim, Ji Yeon Ryu, Hyung Mo Kim
  • Publication number: 20080271004
    Abstract: A computer-implemented method, system, and program product for optimizing a distributed (software) application are provided. Specifically, a configuration of a target computing environment, in which the distributed application is deployed, is discovered upon deployment of the distributed application. Thereafter, based on a set of rules and the discovered configuration, one or more optimization techniques are applied to optimize the distributed application. In a typical embodiment, the set of rules can be embedded in the distributed application, or they can be accessed from an external source such as a repository.
    Type: Application
    Filed: July 3, 2008
    Publication date: October 30, 2008
    Inventors: Jong-Deok Choi, Manish Gupta, Parviz Kermani, Kang-Won Lee, Kyung Dong Ryu, Dinesh C. Verma, Peng Wu