Patents by Inventor Kyung Mi Moon
Kyung Mi Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240130230Abstract: The present disclosure relates to a plurality of host materials, organic electroluminescent compounds, and organic electroluminescent devices comprising the same. By comprising specific combinations of compounds according to the present disclosure as the plurality of host materials or by comprising a compound according to the present disclosure, it is possible to provide organic electroluminescent devices having improved lifespan characteristics compared to conventional organic electroluminescent devices.Type: ApplicationFiled: August 8, 2023Publication date: April 18, 2024Inventors: Doo-Hyeon MOON, DaiKyu KIM, Hyo-Jung LEE, Yea-Mi SONG, Kyoung-Jin PARK, Hyun-Ju KANG, Ga-Won LEE, Mi-Ja LEE, Kyung-Hoon CHOI
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Patent number: 10678036Abstract: An optical device is provided. The optical device includes a first surface that defines a concave light incident surface facing a central axis and a light source; a second surface disposed opposite the first surface which is configured to reflect light incident on the concave light incident surface; and an inclined light exit surface between the first surface and the second surface. The second surface includes a concave first reflective portion curving toward the first surface, and a substantially flat second reflective portion which portion is interposed between a first reflective portion edge of the first reflective portion and an outer second surface edge of the second surface. The first reflective portion is configured to totally reflect light incident at a predetermined angle or more with respect to a top surface of the light source once to the light exit surface.Type: GrantFiled: June 28, 2018Date of Patent: June 9, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang Woo Ha, Tetsuo Ariyoshi, Kyung Mi Moon, Jong Sup Song, Jong Pil Won
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Publication number: 20190155009Abstract: An optical device is provided. The optical device includes a first surface that defines a concave light incident surface facing a central axis and a light source; a second surface disposed opposite the first surface which is configured to reflect light incident on the concave light incident surface; and an inclined light exit surface between the first surface and the second surface. The second surface includes a concave first reflective portion curving toward the first surface, and a substantially flat second reflective portion which portion is interposed between a first reflective portion edge of the first reflective portion and an outer second surface edge of the second surface. The first reflective portion is configured to totally reflect light incident at a predetermined angle or more with respect to a top surface of the light source once to the light exit surface.Type: ApplicationFiled: June 28, 2018Publication date: May 23, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang Woo HA, Tetsuo ARIYOSHI, Kyung Mi MOON, Jong Sup SONG, Jong Pil WON
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Patent number: 9897266Abstract: A light source module includes a light source, a light guide plate on the light source and including at least one recess portion in an upper surface thereof, and a filter sheet on an upper surface of the light guide plate and having a pattern. The pattern may be configured to partially reflect and partially transmit light emitted from the light source through the light guide plate.Type: GrantFiled: September 29, 2016Date of Patent: February 20, 2018Assignee: Samsung Electronics Co., Ltd.Inventors: Kyung Mi Moon, Sang Woo Ha, Jong Sup Song, Tetsuo Ariyoshi, Jun Cho, Won Soo Ji
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Publication number: 20170261161Abstract: A light source module includes a light source, a light guide plate on the light source and including at least one recess portion in an upper surface thereof, and a filter sheet on an upper surface of the light guide plate and having a pattern. The pattern may be configured to partially reflect and partially transmit light emitted from the light source through the light guide plate.Type: ApplicationFiled: September 29, 2016Publication date: September 14, 2017Applicant: Samsung Electronics Co., Ltd.Inventors: Kyung Mi MOON, Sang Woo HA, Jong Sup SONG, Tetsuo ARIYOSHI, Jun CHO, Won Soo JI
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Patent number: 9680069Abstract: A light emitting device package is provided. The package includes a light emitting device including a substrate, and a light emitting structure having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer stacked on the substrate; and a wavelength conversion film disposed in a path of light emitted by the light emitting device and having phosphor layers stacked on each other. A portion of the phosphor layers includes phosphor structures including a wavelength conversion material receiving light emitted from the light emitting device and converting a wavelength thereof and a binding resin binding the wavelength conversion material, and a transparent resin filling spaces between the phosphor structures.Type: GrantFiled: April 13, 2016Date of Patent: June 13, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Mi Moon, Won Soo Ji
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Publication number: 20160359089Abstract: A light emitting device package is provided. The package includes a light emitting device including a substrate, and a light emitting structure having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer stacked on the substrate; and a wavelength conversion film disposed in a path of light emitted by the light emitting device and having phosphor layers stacked on each other. A portion of the phosphor layers includes phosphor structures including a wavelength conversion material receiving light emitted from the light emitting device and converting a wavelength thereof and a binding resin binding the wavelength conversion material, and a transparent resin filling spaces between the phosphor structures.Type: ApplicationFiled: April 13, 2016Publication date: December 8, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Mi MOON, Won Soo JI
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Publication number: 20160131327Abstract: There is provided a light source module including a light emitting device, and an optical device including a first surface disposed above the light emitting device and having a hollow recessed in a light emitting direction in a central portion through which an optical axis passes, and a second surface disposed to be opposite to the first surface and configured to refract light incident through the hollow to be emitted to the outside. The optical device includes a plurality of ridges disposed on the second surface and periodically arranged in a direction from the optical axis to an edge connected to the first surface.Type: ApplicationFiled: August 12, 2015Publication date: May 12, 2016Inventors: Kyung Mi MOON, Tetsuo ARIYOSHI, Jong Pil WON, Seung Gyun JUNG, Jun CHO, Won Soo JI, Sung A CHOI
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Patent number: 9166120Abstract: There are provided a light emitting diode (LED) device including an LED chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the LED chip, and a color conversion layer formed to be spaced apart from the LED chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the LED chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 K.Type: GrantFiled: August 16, 2011Date of Patent: October 20, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Mi Moon, Jung Hye Chae, Hyung Kun Kim, Se Hwan An
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Patent number: 9153759Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.Type: GrantFiled: June 20, 2014Date of Patent: October 6, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hak Hwan Kim, Min Jung Kim, Kyung Mi Moon, Jong Sup Song, Jae Sung You, Ill Heoung Choi, Cheol Jun Yoo
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Patent number: 9099332Abstract: Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.Type: GrantFiled: December 20, 2013Date of Patent: August 4, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung-mi Moon, Young-hee Song, Ill-heung Choi, Jeong-wook Lee, Young-jin Lee
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Patent number: 8960984Abstract: A backlight unit (BLU) is disclosed. The BLU may include a light emitting diode (LED) module including at least one LED chip mounted on a substrate in a chip-on-board (COB) type, and a light guide panel including an incidence surface configured to receive light emitted from an emission surface of the LED chip and to include at least one insertion recess disposed corresponding to the LED chip, such that the LED chip is bonded to the LED module to be inserted in the insertion recess.Type: GrantFiled: August 24, 2012Date of Patent: February 24, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Kyung Mi Moon, Hak Hwan Kim
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Publication number: 20140299898Abstract: A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.Type: ApplicationFiled: June 20, 2014Publication date: October 9, 2014Inventors: Hak Hwan KIM, Kyung Mi MOON, Ho Sun PAEK, Young Hee SONG
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Publication number: 20140299906Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.Type: ApplicationFiled: June 20, 2014Publication date: October 9, 2014Inventors: Hak Hwan KIM, Min Jung KIM, Kyung Mi MOON, Jong Sup SONG, Jae Sung YOU, Ill Heoung CHOI, Cheol Jun YOO
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Patent number: 8840265Abstract: An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.Type: GrantFiled: May 3, 2011Date of Patent: September 23, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Kyung-mi Moon, Young-hee Song, Ill-heung Choi, Jeong-wook Lee, Young-jin Lee
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Patent number: 8807786Abstract: An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.Type: GrantFiled: May 3, 2011Date of Patent: August 19, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Kyung-mi Moon, Young-hee Song, Ill-heung Choi, Jeong-wook Lee, Young-jin Lee
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Patent number: 8785953Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.Type: GrantFiled: March 23, 2012Date of Patent: July 22, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Hak Hwan Kim, Min Jung Kim, Kyung Mi Moon, Jong Sup Song, Jae Sung You, Ill Heoung Choi, Cheol Jun Yoo
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Publication number: 20140197443Abstract: There are provided a light emitting diode (LED) device including an LED chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the LED chip, and a color conversion layer formed to be spaced apart from the LED chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the LED chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 K.Type: ApplicationFiled: August 16, 2011Publication date: July 17, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Mi Moon, Jung Hye Chae, Hyung Kun Kim, Se Hwan An
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Publication number: 20140168965Abstract: An LED device according to an embodiment of the present invention may include a first LED light source unit including at least one first white LED and emitting white light of a first color temperature; a second LED light source unit including at least one second white LED and emitting white light of a second color temperature different from the first color temperature; and a variable resistor connected to at least one of the first LED light source unit and the second LED light source unit, being configured to control a current supplied to the at least one of the first LED light source unit and the second LED light source unit.Type: ApplicationFiled: August 16, 2011Publication date: June 19, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Mi Moon, Young Jin Lee, Jung Hye Chae, Hyung Kun Kim
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Patent number: 8736181Abstract: There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.Type: GrantFiled: August 23, 2011Date of Patent: May 27, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Young Jin Lee, Hyung Kun Kim, Kyung Mi Moon