Abstract: A circuit board includes an insulating portion and a pattern portion on the insulating portion. The insulating portion includes a first insulating region and a second insulating region outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween. The pattern portion includes a first pattern portion for signal transmission and a second pattern portion including a dummy pattern separated from the first pattern portion. The first pattern portion includes a first terminal portion on the first insulating region, a second terminal portion on the second insulating region, and a connection portion on the separation region and connecting between the first terminal portion and the second terminal portion. The second pattern portion includes a second-first pattern portion on the first insulating region and a second-second pattern portion on the second insulating region and separated from the second-first pattern portion.

Abstract: A circuit board according to an embodiment includes an insulating portion; and a pattern portion disposed on the insulating portion, wherein the insulating portion includes: a first insulating region, and a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween; wherein the pattern portion includes: a first pattern portion for signal transmission; and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connection portion disposed on the separation region and connecting between the first terminal portion and the second terminal portion, wherein the second pattern portion includes: a second-first pattern portion disposed on the first insulating region; and a second-second pattern portion d

Abstract: A method of manufacturing a biaxial-optical polynorbornene-based film is provided, including: preparing a polynorbornene-based polymer containing composition by dissolving a polynorbornene-based polymer in a mixed solvent containing a high-boiling solvent and a low-boiling solvent, with a difference in boiling points of the two solvents of 20° C. or greater and an amount of the high-boiling solvent being 0.1 to 15 wt % based on a weight of the polynorbornene-based polymer; casting and partially drying the composition to obtain a polynorbornene-based film containing 1 to 6 wt % of the mixed solvent based on a total weight of the polynorbornene-based film; and uniaxially stretching the partially dried film in one direction parallel with the surface of the film at a stretching temperature less than or equal to the boiling point of the high-boiling solvent +20° C. and drying the stretched film at a temperature greater than or equal to the boiling point of the high-boiling solvent.

Abstract: A catalyst system capable of producing a cyclic olefin polymer having a polar functional group and a high molecular weight with a high yield in which a catalyst is not deactivated due to polar functional groups of monomers, and a method of producing polymers using the same are provided. The catalyst system for polymerization of olefin according to the present invention has good thermal and chemical stability, and thus, in the method of preparing polyolefin using the catalyst system, the deactivation of a catalyst due to a polar functional group of the monomer can be prevented, and thus a high yield of the cyclic olefin polymer with a high molecular weight can be obtained when a ratio of the catalyst to the monomer is 1:5000, and the removal of a catalyst residue is not required.

Abstract: A polymer/ceramic composite paste for an embedded capacitor includes an organic solvent, a ceramic powder having a particle diameter of not more than 20 ?m dispersed in the organic solvent, a polymer and a hardener. The use of the polymer/ceramic composite paste enables the formation of a dielectric layer having a high dielectric constant. The polymer/ceramic composite paste can be applied by a screen printing technique and is planarized to locally form a polymer/ceramic composite dielectric layer having a thickness of, e.g., up to 20 ?m on a desired region. Accordingly, electrical parasitics resulting from the formation of a capacitor on unwanted regions can be reduced, and the capacitance error can be reduced.