Abstract: A bendable user terminal device provided with a flexible display controls the flexible display to display information on a first area while the user terminal device is maintained in a bent state based on a detected bending state of the user terminal device, and, in response to the user terminal device changing from the bent state to an unbent state, controls the flexible display not to display the information on the first area.

Abstract: A display apparatus includes a flexible display panel; an image processing board configured to output a video signal to the display panel; and a support member provided between the display panel and the image processing board and configured to support the display panel, the support member including: at least two plates arranged along one side of the display panel; and at least one artificial muscle connecting the at least two plates and configured to be deformed to change a shape of the support member in accordance with a voltage applied thereto.

Abstract: A display device for displaying an image and a method by which the display device operates to display an image are provided. The display device may include a display configured to output a screen image, an image sensor configured to acquire an image signal, a bending detection sensor configured to detect a bending motion or a bent state of the display device, and a control unit configured to control the display to display an image, which is generated based on the image signal, in a region according to a position at which the display is bent on the screen image if the bending detection sensor detects the bending motion or a bent state.

Abstract: A plurality of panels include: a display panel; and a protective panel that is disposed outside the display panel, and includes a transparent substrate and an outer hard coating layer and an inner hard coating layer that are respectively formed on an outer surface and an inner surface of the transparent substrate, and each have a hardness greater than a hardness of the transparent substrate. A thickness of the outer hard coating layer is greater than a thickness of the inner hard coating layer, and a stress neutral surface of the flexible display device is configured so that a compressive stress is applied to the inner hard coating layer when the flexible display device is bent.

Abstract: A flexible printed circuit board (PCB) has stretchability and durability. The flexible PCB includes: a first polymer substrate having flexibility, stretchability, or elasticity; a second polymer substrate having flexibility, stretchability, or elasticity; a conductive track disposed between the first and second polymer substrates and including metal nanowires; and a cured silane coupling agent which bonds the conductive track to at least one of the first and second polymer substrates.

Abstract: A foldable electronic device including: a first body; a second body; a connection part configured to connect the first body to the second body so that the first body and the second body are rotatable to a first state in which the first and second bodies are unfolded and to a second state in which the first and second bodies overlap each other; a flexible display element that passes over the connection part and is supported by the first and second bodies; and a roller that is rotatably installed at an end of the first body and connected to an end of the flexible display element, wherein the flexible display element is located at an outer circumference of the first body, the second body, and the connection part in the second state, and wherein a part of the flexible display element is rolled around the roller in the first state.

Abstract: Provided is a flexible display apparatus. A shape deformation sensor is formed in at least one of a first plurality of connection lines of a flexible display panel and a second plurality of connection lines of a touch screen panel. The shape deformation sensor is configured to sense a shape deformation of the flexible display panel.

Abstract: A foldable device includes: a flexible display device; and a first body and a second body that support the flexible display, are foldably connected to each other and configured to deform between a folded position and an unfolded position. A heating member is controlled to heat a portion of the flexible display disposed at a location between which the first body and the second body are connected. A controller is configured to drive the heating member to heat the portion in response to the deformation.

Abstract: A foldable device includes first and second bodies that respectively support a first part and a second part of a flexible display device and are foldably connected to each other between a folded position and an unfolded position, and a movable support member that continuously near-supports a third part of the flexible display device between the first part and the second part when the first body and the second body change from the folded position to the unfolded position.

Abstract: An apparatus and method for improving input position and pressure detection in a pressure detection touch screen. The method includes detecting a touch input on a touch screen; generating compensated pressure information for compensating for inaccurate pressure information detected from the touch input, when the touch input is detected in an outer area on the touch screen; and generating compensated location information using the compensated pressure information.

Abstract: A method and apparatus for processing a bending event of a touch screen in a portable terminal. The method includes counting a number of touch sensing values of the touch screen; comparing the number of the touch sensing values with a threshold; determining that a bending event occurs in the touch screen when the number of the touch sensing values is at least equal to the threshold; and performing at least one of correction of an error of the touch sensing values, a function of the portable terminal allocated to the bending event upon a determination that the bending event occurs.

Abstract: An apparatus and method for improving input position and pressure detection in a pressure detection touch screen. The method includes detecting a touch input on a touch screen; generating compensated pressure information for compensating for inaccurate pressure information detected from the touch input, when the touch input is detected in an outer area on the touch screen; and generating compensated location information using the compensated pressure information.

Abstract: A pressure sensitive touch panel is provided, which includes first sensor lines arranged along a first axis; second sensor lines arranged along a second axis that cross the first axis; a drive unit that sequentially applies a scan signal to the first sensor lines, and sequentially detects detection signals of the second sensor lines; and a controller that controls the drive unit to selectively apply the scan signal to one of the first sensor lines and to selectively detect a detection signal from one of the second sensor lines.

Abstract: An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.

Abstract: Disclosed is a pressure-sensing type touch panel including a plurality of sheets laminated to have a one-sheet structure, the touch panel being bonded to a rear surface of a flexible display. The pressure-sensing type touch panel has flexibility and stably recognizes the touch of an object even when incurring such deformations as bending, rolling or folding.

Abstract: An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.

Abstract: Provided is a System-In-Package (SIP) having embedded circuit boards in which boards are electrically connected and a plurality of chips are embedded in a board in a stacked manner. The SIP includes a first board on a surface of which a first circuit is formed, a second board which is provided on a top surface of the first board in a stacked manner and includes a plurality of chips embedded therein in a stacked manner, and a third board which is provided on a top surface of the second board in a stacked manner and on a surface of which a second circuit is formed.

Abstract: An electric circuit package includes: a printed circuit substrate having an insulating layer and conductive pattern layers formed on an upper surface of the insulating layer; at least one of electronic parts disposed on an upper surface of the printed circuit substrate; at least one of conductive pins electrically connected to an conductive pattern layer providing grounding among the conductive pattern layers; and a molding member formed on the insulating layer in such a manner that the conductive pins and the electric parts are buried in the molding member, wherein each conductive pin has an upper surface exposed to an upper part of the molding member.

Abstract: An embedded capacitor comprises a first substrate on which a plurality of electrically insulated electrode patterns and a ground pattern are formed, a second substrate separated from the first substrate, a plurality of dielectric layers stacked between the first and second substrates, a plurality of metal layers inserted between the dielectric layers and connected to the electrode patterns of the first substrate, and a plurality of ground layers inserted between the dielectric layers alternately with the metal layers.

Abstract: A multi-die package and a method of fabrication is discloses. The multi-die package includes a package substrate, a first semiconductor die bonded directly on the package substrate and connected electrically with the package substrate, and a second semiconductor die having a groove providing a receiving space, bonded directly on the package substrate so that the first semiconductor die is covered by the groove, and connected electrically with the package substrate.