Patents by Inventor Kyung Yoon Jeon

Kyung Yoon Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6491862
    Abstract: Disclosed is a method for producing an SiC preform of a high volume fraction used for the manufacture of a metal matrix composite. The method involves the steps of mixing SiC particles of different particle sizes each selected from a range of 0.2 to 48 &mgr;m with an organic binder, an inorganic binder, an aggregating agent, and distilled water, thereby producing a mixture, and stirring the mixture in accordance with a ball milling process, thereby producing a slurry containing the SiC particles, pouring the slurry containing the SiC particles into a mold having upper and lower molds respectively provided with absorbent bodies, and squeezing the slurry in the mold, thereby reducing a residual moisture content of the slurry, completely drying the slurry reduced in residual moisture content, thereby producing an SiC preform, and calcinating the SiC preform. The preform is impregnated with a metal matrix while maintaining a high reinforcement volume fraction of 70 vol % or more.
    Type: Grant
    Filed: October 17, 2000
    Date of Patent: December 10, 2002
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Soon Hyung Hong, Hyo Soo Lee, Kyung Yoon Jeon
  • Patent number: 6190604
    Abstract: The present invention relates to a method of preparing a preform with a high volume fraction of SiC particles. A slurry containing SiC particles and binders is ball-milled and pressed in an apparatus to give a primary preform. This primary preform is dried at room temperature and then, at a high temperature. The dried primary preform is subjected to calcination to prepare the preform. In the apparatus, which comprises a bottom die; a top mold with a cavity, placed on the bottom die, an upper punch for pressing a material for the preform in the cavity; and two water-absorbers, one being inserted between the bottom die and the top mold, the other being placed on the top mold, the slurry is introduced in the cavity and pressed by the punch while the water is absorbed in the absorbers or drained through a gap between the bottom die and the top mold, thereby improving the volume fraction of SiC particles.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: February 20, 2001
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Soon Hyung Hong, Hyo Soo Lee, Kyung Yoon Jeon