Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: A robot end effector for automated processing facilitates wet wafer processing by improving the maintenance of the end effector. In particular, the end effector may be exposed to a variety of chemical conditions in the course of its operation. By making the end effector finger removable from the arm, maintenance of the end effector finger is facilitated. By providing alignment means between the end effector finger and the arm, one can insure that the finger is accurately positioned on the arm after such maintenance.

Abstract: A quartz tank for wet semiconductor wafer processing includes one or more ports extending through the tank for the exchange of fluids with the tank. The openings may be aligned with a T-shaped quartz stem having an enlarged end retained on the interior side of said quartz tank in sealing abutment therewith. The lower end of the quartz stem may have external threads to abut with a suitable union. The union may include a nut having a reduced diameter lower end to engage an enlarged end of the tubing member connected to the bottom of the quartz stem. An o-ring seal may be sandwiched between the tubing and the lower end of the quartz stem. The nut may be formed of a carbon-fiber reinforced fluorocarbon material such as perfluoroalkoxy.

Abstract: A quartz tank for wet semiconductor wafer processing includes one or more ports extending through the tank for the exchange of fluids with the tank. The openings may be aligned with a T-shaped quartz stem having an enlarged end retained on the interior side of said quartz tank in sealing abutment therewith. The lower end of the quartz stem may have external threads to abut with a suitable union. The union may include a nut having a reduced diameter lower end to engage an enlarged end of the tubing member connected to the bottom of the quartz stem. An o-ring seal may be sandwiched between the tubing and the lower end of the quartz stem. The nut may be formed of a carbon-fiber reinforced fluorocarbon material such as perfluoroalkoxy.

Abstract: An improved handle for attaching to and supporting a wafer carrier is described in which robotic fixtures of the wafer carrier are utilized. The locking mechanism of the handle engages the robotic fixtures and then a configuration of flanges and shaped voids attaches to the robotic fixtures in a manner which is secure, even at elevated temperatures common to semiconductor manufacturing processes. Manipulation of the handle conveniently detaches the locking mechanism.

Abstract: Improvements to an integrated circuit wafer rinsing and washing machine which include a streamlined housing for low turbulence air flow, improved rear maintenance capability, improved wafer carriers, foot operated switches and improved rotating part fastening means.