Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: A circuit system includes a support device that has first and second conductors. The circuit system also includes first, second, and third integrated circuits that are coupled to the support device. The second integrated circuit includes a peripheral region. The peripheral region includes a third conductor coupled between the first and the second conductors. The circuit system is configured to transmit a signal from the first integrated circuit through the first conductor, the third conductor, and the second conductor to the third integrated circuit.

Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.

Abstract: Systems or methods of the present disclosure may provide high-bandwidth, low-latency connectivity for inter-die and/or intra-die communication of a modularized integrated circuit system. Such an integrated circuit system may include a first die of fabric circuitry sector(s), a second die of modular periphery intellectual property (IP), a passive silicon interposer coupling the first die to the second die, and a modular interface that includes a network-on-chip (NOC). The modular interface may provide high-bandwidth, low-latency communication between the first die and the second, between the fabric circuitry sector(s), and between the first die and a third die.

Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.

Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: Systems and method include one or more die coupled to an interposer. The interposer includes interconnection circuitry configured to electrically connect the one or more die together via the interposer. The interposer also includes translation circuitry configured to translate communications as they pass through the interposer. For instance, in the interposer, the translation circuitry translates communications, in the interposer, from a first protocol of a first die of the one or more die to a second protocol of a second die of the one or more die.

Abstract: Systems and methods related to multi-die integrated circuits that may include dies having high-speed core interconnects. The high-speed core interconnects may be used to directly connect two adjacent dies.

Abstract: An integrated circuit die includes input buffer circuits that are enabled during an input mode of operation in response to first control signals to transmit input signals into the integrated circuit die from conductive bumps. Each of the input buffer circuits is coupled to one of the conductive bumps. The integrated circuit die also includes output buffer circuits that are each coupled to one of the conductive bumps. The output buffer circuits are enabled during an output mode of operation in response to second control signals to transmit output signals from the integrated circuit die to the conductive bumps. The input buffer circuits are disabled from transmitting signals during the output mode of operation in response to the first control signals. The output buffer circuits are disabled from transmitting signals during the input mode of operation in response to the second control signals.

Abstract: Systems or methods of the present disclosure may provide an integrated circuit system. The integrated circuit system may implement a circuit design. Design software models a circuit design for the integrated circuit system and the circuit design is agnostic of physical layer circuitry of the integrated circuit system. The design software may generate configuration data based on the circuit design and transfer the configuration data to the integrated circuit system to cause programmable logic of the integrated circuit system to implement the circuit design.

Abstract: A die includes one or more power delivery layers to deliver power within the die. Additionally, the die also includes one or more transistor layers to at least partially implement a programmable fabric for the die. Furthermore, the die further includes one or more signal routing layers to transmit signals for use by the programmable fabric. Moreover, the one or more transistor layers physically separate the one or more power delivery layers from the one or more signal routing layers.

Abstract: A system includes a first die having a first side with first die-to-die circuitry and first input output circuitry. The system also includes a second die comprising a second side with second die-to-die circuitry and second input output circuitry. The first and second sides are adjacent to each other in the electronic package device. The system also includes a semiconductor interconnect including multiple connections to interconnect the first and second die-to-die circuitries. The semiconductor interconnect also includes multiple through-silicon-vias to transmit data to or from the first and second input output circuitries through the semiconductor bridge.

Abstract: An IC, operable at a first clock phase, includes first and second IOs and a PLL. The PLL includes a control circuit, an input to receive a first clock signal, an output to output a second clock signal, and a first detector to generate a first phase difference signal from the first and second clock signals. The IC includes a second phase detector that is coupled to the PLL's output to receive the second clock signal and is coupled to the first IO to receive a third clock single from a second IC, which is operable at a second clock phase. The second detector generates a second phase difference signal from the second and third clock signals. If the PLL uses the second phase difference signal to generate the second clock signal, then the second clock signal is synchronized with the third clock signal for synchronous data transfer.

Abstract: A circuit system includes an interposer that has a first clock network and first and second integrated circuit dies that are mounted on the interposer. The first integrated circuit die includes a phase detector circuit, an adjustable delay circuit that generates a second clock signal in response to a first clock signal received from the first clock network, and a second clock network that generates a third clock signal in response to the second clock signal. The second integrated circuit die comprises a third clock network that generates a fourth clock signal in response to the first clock signal received from the first clock network. The phase detector circuit controls a delay provided by the adjustable delay circuit to the second clock signal based on a phase comparison between phases of the third and fourth clock signals.

Abstract: This disclosure is directed to methods of disaggregating columnar IO operations from a programmable logic fabric using 3-D packaging technology. More specifically, methods of 3-D programmable fabric arrangements that include one or more IO chiplets stacked in a 3-D orientation on a programmable logic fabric main die that includes one or more D2D drivers to enable communication between the one or more IO chiplets and the programmable logic fabric main die. The IO chiplets may be coupled to the programmable fabric main die through connection to the one or more D2D drivers arranged on the programmable fabric main die.

Abstract: Systems and methods are provided for a modular die-to-die interconnect for integrated circuits in a three-dimensional arrangement. An integrated circuit system may include a first chiplet that includes a grid-based interconnect field and a second chiplet that includes a complementary grid-based interconnect field. A number of interconnects of the complementary grid-based interconnect field of the second chiplet are connected to a corresponding number of interconnects of the grid-based interconnect field of the first chiplet.

Abstract: Systems, methods, and devices are provided for configurable die-to-die communication between dies of an integrated circuit system using a programmable routing bridge. Such an integrated circuit system may include a first die on a substrate, a second die on the substrate, and a programmable routing bridge embedded in the substrate. The programmable routing bridge may be mounted to the first die and the second die and is configurable to transfer data between selectable points of the first die and selectable points of the second die.

Abstract: Systems and methods are provided for system circuitry disaggregation into an integrated circuit system with multiple chiplets having disaggregated components. A system may include a first programmable logic fabric die that includes programmable logic circuitry and a number of supporting chiplets that include disaggregated field programmable gate array (FPGA) circuitry. The chiplets are connected to the first programmable logic fabric die in a three-dimensional arrangement.

Abstract: Systems or methods of the present disclosure may provide a programmable logic device including one or more power monitors and one or more thermal sensors. The programmable logic device may include control circuitry that may receive power data and thermal data for multiple die of the programmable logic device, and may implement one or more response based on the thermal and power data.

Abstract: Systems or methods of the present disclosure may provide a semiconductor device including a die of a multi-die package including encryption circuitry to receive data and to encrypt the data to generate encrypted data; and a connection interface to transmit the encrypted data over a die-to-die interconnect to a second die.