Abstract: A system is provided for mounting a connector assembly to a mounting surface of an electrical apparatus through the use of a vacuum-suction nozzle. The connector assembly includes a dielectric housing adapted to be positioned adjacent the mounting surface. The housing has a plurality of terminal-receiving through passages. A plurality of electrical terminals are mounted in the passages and include tail portions projecting from first open ends of the through passages for interconnection to circuitry of the electrical apparatus. A film is secured to the housing covering second open ends of at least some of the through passages to provide a smooth surface area for engagement by the vacuum-suction nozzle for manipulating and positioning the connector assembly. Preferably, the film has an adhesive on one side thereof for securing to the housing.

Abstract: A header assembly includes an insulating block having a given thickness and a plurality of pin-receiving passages therethrough. A plurality of terminal pins are received in the passages and project from the insulator block for insertion into holes in a printed circuit board and for solder connection to circuit traces on the circuit board. The terminal pins are interference-fit in the passages in the insulator block to allow the block to be slid off the pins after soldering to the printed circuit board. The area of the inference-fit between the terminal pins and the pin-receiving passages is less than the thickness of the insulator block to reduce the amount of force required to slide the block off of the pins while affording the block to be of a substantial thickness. The pin-receiving passages are provided with chamfered mouths to facilitate insertion of terminal pins into the passages.