Patents by Inventor Lakhi Nandial Goenka

Lakhi Nandial Goenka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nozzle
    Patent number: 6394369
    Abstract: A nozzle 10 having a material outlet aperture 24 which causes received material 28 to be emitted in the form of a streaming sheet 30.
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: May 28, 2002
    Assignee: Visteon Global Tech., Inc.
    Inventors: Lakhi Nandial Goenka, Malgorzata M. Skender
  • Etched tri-metal with integrated wire traces for wire bonding
    Patent number: 6395994
    Abstract: A circuit component secured to a printed circuit board typically uses fine wires for completing the circuit from the printed circuit to the component. The component may be an integrated circuit having one or more pads thereon for receiving the wire. A device and method for making the device has the printed circuit formed on the PCB with one or more wire traces that are etched away from the printed circuit. The etchant removes a portion of the bottom layer and sometimes the middle layer of an etched tri-metal along with any lamination and adhesive. This forms a free end of the wire trace that is bonded to the component. Additional wires are not required.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: May 28, 2002
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Lakhi Nandial Goenka, Mohan R. Paruchuri
  • Nozzle assembly
    Patent number: 6318642
    Abstract: A nozzle assembly 12 having shroud members 26, 28 which selectively emit a material 21 along at least one edge of emitted material 25. The selectively emitted material 21 substantially prevents and/or eliminates the turbulent shear layer which is formed within the emitted material 25.
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: November 20, 2001
    Assignee: Visteon Global Tech., Inc
    Inventors: Lakhi Nandial Goenka, Malgorzata M. Skender
  • Nozzle
    Patent number: 6315221
    Abstract: A nozzle 10 having an outlet aperture 26, the outlet aperture 26 having at least one injector 40,42 which is disposed within the aperture 26 and which injects a material 17 within the aperture 26, effective to allow the material to be atomized and to be emitted from the aperture 26 at a substantially identical velocity at each point within the aperture 26.
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: November 13, 2001
    Assignee: Visteon Global Tech., Inc.
    Inventors: Lakhi Nandial Goenka, Marc Alan Straub
  • NOZZLE
    Publication number: 20010030250
    Abstract: A nozzle 10 having a material outlet aperture 24 which causes received material 28 to be emitted in the form of a streaming sheet 30.
    Type: Application
    Filed: December 22, 1999
    Publication date: October 18, 2001
    Inventors: LAKHI NANDIAL GOENKA, MAIGOZATA M. SKENDER
  • Molten solder dispensing system
    Patent number: 6000597
    Abstract: An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
    Type: Grant
    Filed: January 28, 1998
    Date of Patent: December 14, 1999
    Assignee: Ford Motor Company
    Inventors: Marc Alan Straub, Frank Burke DiPiazza, Vivek Amir Jairazbhoy, Lakhi Nandial Goenka, Randy Claude Stevenson
  • Molten solder dispensing system
    Patent number: 5746368
    Abstract: An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
    Type: Grant
    Filed: May 15, 1996
    Date of Patent: May 5, 1998
    Assignee: Ford Motor Company
    Inventors: Marc Alan Straub, Frank Burke DiPiazza, Vivek Amir Jairazbhoy, Lakhi Nandial Goenka, Randy Claude Stevenson