Abstract: A flexible mirror assembly is provided. The mirror assembly includes a mold line structure unit having a flexible mirror surface secured to a flexible panel. An actuator induces deformation of the flexible mirror surface such that it alters an angle at which the mirror surface reflects light.

Abstract: A vent assembly that can be concealed when in a closed configuration is provided In one embodiment, the vent assembly comprises a base member and a guide member secured to a mounting surface of a duct or other passageway. A flexible rod is fixedly attached to the base member and slideably disposed within a channel defined by the guide member. A panel is disposed on or around the flexible rod and between the base and guide members. An actuator is able to deform the rod such that the panel moves away from the terminal opening of the duct, thereby opening the vent A fluid distribution system incorporating vent assemblies in accordance with the present invention is also provided.

Abstract: A container holder for receiving and securing a container is provided. In a preferred embodiment, the container holder comprises a base surface, at least one moldline structure unit, and a sensor. The sensor detects the presence of the container in the holder and induces deformation in the moldline structure unit such that the container is secured in the holder.

Abstract: A vehicle jack adapted to be mounted to a vehicle chassis is provided. In one embodiment, the jack comprises a base member, a guide member, a flexible rod, and an actuator. One end of the rod is fixedly attached to the base member while a second end is slideably disposed within a passageway defined by the guide member. The actuator forces the flexible rod to deform by causing the second end of the rod to move with respect to the passageway. When mounted to a vehicle chassis, the jack is operated by deforming the flexible rod until a support surface, such as the ground, is encountered, and subsequently continuing to deform the rod until the vehicle becomes elevated. A vehicle jacking system incorporating the jacks of the invention is also provided.

Abstract: A nozzle assembly 10 including a first inlet aperture 12 which receives material 14 which is to be selectively emitted from assembly 10. Assembly 10 includes an outlet aperture 16 having several apertures 18, 20, 22, 24, and 26 which are respectively separated by substantially identical elements 28, 30, 32, and 34. Elements 28-34 cooperatively form a plurality of passages or channels 40-50 through assembly 10. A centrally disposed channel 44 is relatively narrower than the other channels 40, 42, 46, and 50, and channels 42, 46 are relatively narrower than outermost channels 46, 50, thereby causing material 14 to be emitted at a substantially similar and/or uniform velocity at each point or location within outlet aperture 16.

Abstract: A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.

Abstract: A nozzle 10 including a member 12 which selectively receives a first material 18 and a second material 22, and which selectively atomizes the second material 22 by use of the first material 18. The nozzle 10 further includes a diffuser member 50 which receives the atomized second material 22 and which diffuses the received and atomized second material 22 while substantially, concomitantly, and tangentially applying the first material 18 to the diffused second material 22, thereby allowing the atomized second material 22 to be desirably deposited upon a target location 7 and/or object 9.

Abstract: A multi-layer circuit board with a thermoelectric or “Peltier” cooler and a method forming a multi-layer circuit board with a thermoelectric or “Peltier” cooler is disclosed. The circuit board includes a thermoelectric cooler which is integrally formed within the circuit board and which is effective to efficiently absorb and dissipate heat from the circuit board.

Abstract: An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly.

Abstract: There is disclosed herein a tri-metal-layer precircuit 50 which may be selectively etched to provide a multilayer electronic circuit 60 having air bridge crossovers 49. The enlarged ends 44 of the upper air bridge elements 42, and/or the top pads 41 of the tower elements 43, are specially designed such that undercutting of the ends 44 and/or top pads 41 is minimized, thereby minimizing the risk of air bridge/top pad delamination.

Abstract: A multilayer circuit board having strengthened air bridge crossover structures, and additive and subtractive methods for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit. A preferred embodiment includes air bridge structures having generally T-shaped cross-sections, which provide strengthened, mechanically robust air bridges which are especially resistant to damage from flexure and displacement due to physical impact, bending, thermal excursions, and the like.

Abstract: There is disclosed herein a multilayer circuit board having air bridge crossover structures and a subtractive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers which provide mechanical and/or electrical fortification to the circuit.

Abstract: A multilayer circuit board having strengthened air bridge crossover structures, and additive and subtractive methods for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit. A preferred embodiment includes air bridge structures having generally T-shaped cross-sections, which provide strengthened, mechanically robust air bridges which are especially resistant to damage from flexure and displacement due to physical impact, bending, thermal excursions, and the like.

Abstract: An etched tri-metal-layer air bridge circuit board specially designed for fine-pitch applications, comprising: an electrically insulative substrate surface, a plurality of tri-metal-layer bond pads arranged in a generally straight row on the substrate surface wherein the row defines a width direction therealong, and a circuit trace arranged on the substrate surface, wherein the circuit trace runs between two adjacent ones of the plurality of tri-metal-layer bond pads. Each bond pad comprises: (1) a bottom layer attached to the substrate surface, the bottom layer being made of a first metal and having an overall width W1 as measured along the width direction; (2) a top layer disposed above and generally concentric with the bottom layer, the top layer being made of the first metal and having an overall width W2 as measured along the width direction; and (3) a middle layer made of a second metal connecting the bottom layer and the top layer.

Abstract: A flux formulation without a surfactant is available for use in the assembly of electronic circuit boards as a no-clean formulation. The formulation includes a flux solution having a fluxing agent consisting essentially of one or more weak organic acids and a solvent consisting essentially of water. The flux solution serves to transport the fluxing agent before deposition thereof upon a soldering site for reliability improvement engendered by a lack of hygroscopic residue and for avoidance of environmental degradation engendered by a lack of volatile organic chemicals (VOC's). The method includes the steps of heating the flux solution and dispersing it as a fine spray.

Abstract: An an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof including: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrier 16 having an outer periphery 18 thereabout, the outer periphery being sealably attached to the top surface 12 of the substrate so as to define a closed pocket 20 between the top surface 12 and the barrier 16 within which the electronic component 14 is enclosed; and a desiccant element 50.

Abstract: A flux formulation without a surfactant is used in the assembly of electronic circuit boards as a no-clean formulation. The formulation includes a flux solution having a fluxing agent consisting essentially of one or more weak organic acids and a solvent consisting essentially of water. The flux solution serves to transport the fluxing agent before deposition thereof upon a soldering site for reliability improvement engendered by a lack of hygroscopic residue and for avoidance of environmental degradation engendered by a lack of volatile organic chemicals (VOC's). The method comprises the step of heating the flux solution and dispersing it as a fine spray.

Abstract: An apparatus is provided for cleaning a workpiece with solid CO.sub.2 particles. A flow channel member includes a flow channel therein having an exhaust nozzle at a distal end thereof. A source of pressurized air is provided in selective fluid communication with the flow channel. A phase separator includes first and second portions, with the first portion being in selective fluid communication with the flow channel. A source of liquid CO.sub.2 is provided in selective fluid communication with the phase separator. A liquid flow line includes first and second ends, with the first end being in fluid communication with the second portion of the phase separator, and the second end includes an injector nozzle positioned with the flow channel. The phase separator is operative to separate CO.sub.2 vapor from the liquid CO.sub.2 such that the vapor travels to the first portion for selective communication with the flow channel and the liquid remains in the second portion for injection through the injector nozzle.

Abstract: A method is provided for cleaning an electronic circuit board having first and second opposing surfaces. The method includes directing a stream of carbon dioxide particles against the first surface. Steam is sprayed toward the first and second surfaces such that condensation of the steam caused by cooling from the CO.sub.2 particles forms a thin film of water on the first surface for conducting electrostatic charge away from the first surface. The CO.sub.2 particles substantially remove residue present on the first surface, thereby cleaning the circuit board.

Abstract: A fluid spray nozzle that mixes a pressurized gaseous propellant and paint composition prior to being applied to a workpiece. The nozzle includes an upstream section for receiving the pressurized gaseous propellant. The nozzle directs the gaseous propellant and the fluid composition into a recirculation cavity. The gaseous propellant and fluid composition are received in a downstream section after mixing in the recirculation cavity. The recirculation cavity has lobes on opposite sides of a flow path defined in a region in the recirculation cavity between an inlet opening and the recirculation cavity. The recirculation cavity is formed by silicon micromachining the upstream section, fluid injection section, recirculation cavity and downstream section. The gaseous propellant may be accelerated to supersonic speeds prior to entering the recirculation cavity.