Patents by Inventor Lakshmi Narayan Ramanathan

Lakshmi Narayan Ramanathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a component overlying a semiconductor substrate
    Patent number: 6803323
    Abstract: A passive integrated component (10) is formed overlying a semiconductor substrate by etching a composite conductive layer using a solution of sodium persulfate or ceric ammonium nitrate to remove a lower portion of the composite copper layer (64) exposed by an upper portion of the composite copper layer (74, 76, 78) to expose an underlying surface (62).
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: October 12, 2004
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Lakshmi Narayan Ramanathan, Douglas G. Mitchell, Varughese Mathew
  • Method of forming a component overlying a semiconductor substrate
    Publication number: 20030224613
    Abstract: A passive integrated component (10) is formed overlying a semiconductor substrate by etching a composite conductive layer using a solution of sodium persulfate or ceric ammonium nitrate to remove a lower portion of the composite copper layer (64) exposed by an upper portion of the composite copper layer (74, 76, 78) to expose an underlying surface (62).
    Type: Application
    Filed: May 30, 2002
    Publication date: December 4, 2003
    Inventors: Lakshmi Narayan Ramanathan, Douglas G. Mitchell, Varughese Mathew