Patents by Inventor Laksmi Kusumawardhani

Laksmi Kusumawardhani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition and molding method thereof
    Patent number: 11807751
    Abstract: A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness and biodegradability is provided by using amorphous resin material components extracted from plant-derived wood. The resin composition includes a first resin including a hemicellulose or a hemicellulose derivative and a second resin including polymethylmethacrylate (PMMA, acrylic), polycarbonate (PC), cyclo olefin polymer (COP), cyclo olefin copolymer (COC), polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), or polystyrene (PS) and has excellent injection moldability.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: November 7, 2023
    Assignee: Hemicellulose Ltd.
    Inventors: Seiji Morita, Jin Nasukawa, Kenichi Sato, Laksmi Kusumawardhani
  • Resin composition and molding method thereof
    Patent number: 11767382
    Abstract: A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness, and biodegradability is provided by using an amorphous resin material component extracted from plant-derived wood. The resin composition is a hemicellulose monomer obtained by applying a methacrylation reaction or acrylation reaction to a hemicellulose or hemicellulose derivative and has a molecular structure in which a methacrylic group or acryloyl group is bonded to the hemicellulose or hemicellulose derivative. This hemicellulose monomer has excellent injection moldability.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: September 26, 2023
    Assignee: Hemicellulose Ltd.
    Inventors: Seiji Morita, Jin Nasukawa, Kenichi Sato, Laksmi Kusumawardhani
  • Resin Composition and Molding Method Thereof
    Publication number: 20200270379
    Abstract: A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness, and biodegradability is provided by using an amorphous resin material component extracted from plant-derived wood. The resin composition is a hemicellulose monomer obtained by applying a methacrylation reaction or acrylation reaction to a hemicellulose or hemicellulose derivative and has a molecular structure in which a methacrylic group or acryloyl group is bonded to the hemicellulose or hemicellulose derivative. This hemicellulose monomer has excellent injection moldability.
    Type: Application
    Filed: December 5, 2019
    Publication date: August 27, 2020
    Inventors: Seiji Morita, Jin Nasukawa, Kenichi Sato, Laksmi Kusumawardhani
  • Resin Composition and Molding Method Thereof
    Publication number: 20200270430
    Abstract: A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness and biodegradability is provided by using amorphous resin material components extracted from plant-derived wood. The resin composition includes a first resin including a hemicellulose or a hemicellulose derivative and a second resin including polymethylmethacrylate (PMMA, acrylic), polycarbonate (PC), cyclo olefin polymer (COP), cyclo olefin copolymer (COC), polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), or polystyrene (PS) and has excellent injection moldability.
    Type: Application
    Filed: December 5, 2019
    Publication date: August 27, 2020
    Inventors: Seiji Morita, Jin Nasukawa, Kenichi Sato, Laksmi Kusumawardhani