Patents by Inventor Lambertus P. Willemen

Lambertus P. Willemen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
    Patent number: 6168065
    Abstract: A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting, at a desired temperature which can be set using a heater and one or more thermo measuring devices, a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The tool comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board. The tool targets only those areas of the board where bridges or excess solder repeatedly form during the soldering process without disturbing solder joints where no bridges or excess solder form.
    Type: Grant
    Filed: February 12, 1999
    Date of Patent: January 2, 2001
    Assignee: Soltec B.V.
    Inventor: Lambertus P. Willemen
  • Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same
    Patent number: 6164515
    Abstract: A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The debridging tool, which comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board, targets only those areas of the board where bridges or excess solder repeatedly forms during the soldering process without disturbing solder joints where no bridges or excess solder form. More than one movable nozzle may be used where warranted.
    Type: Grant
    Filed: February 17, 1998
    Date of Patent: December 26, 2000
    Assignee: Soltec B.V.
    Inventors: James J. Andrus, Allan Lance Larrabee, John Norton, Lambertus P. Willemen