Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.

Abstract: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.

Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.

Abstract: A fixing device adapted to fix at least one needle-shaped member comprises a fixing base and a fixing mechanism. The fixing base has at least one positioning groove disposed at a front end of the fixing base. The needle-shaped member is adapted to be positioned in the positioning groove. The fixing mechanism has at least one pressing protrusion at a front end of the fixing mechanism. The pressing protrusion is adapted to press and hold the needle-shaped member in the positioning groove.

Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.

Abstract: A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.

Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device has at least one first positioning groove adapted to position at least one first elongated member and fixes the at least one first elongated member. The second fixing device has at least one second positioning groove adapted to position at least one second elongated member and fixes the at least one second elongated member. Each first positioning groove is aligned with a corresponding second positioning groove so that the first elongated member fixed in the first positioning groove is axially aligned with the second elongated member fixed in the corresponding second positioning groove.

Abstract: A welding system for welding a first elongated element and a second elongated element together by a laser beam that is emitted from a laser welding head after the ideal welding center point of the aligned first and second elongated elements has been positioned at a focal point of the laser beam that is emitted from the laser welding head.

Abstract: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.

Abstract: An assembly system includes a feeding mechanism configured to feed a heat shrinkable tube, a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube, a robot adapted to grip the segment of heat shrinkable tube, and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product.

Abstract: An assembly system includes a feeding mechanism adapted to feed a heat shrinkable tube, a cutting mechanism, a clamping mechanism, a robot, and a vision system. The cutting mechanism is adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism. The clamping mechanism is adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube with the cutting mechanism. The robot is adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube. The vision system is adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire of an electrical device.

Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.

Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.

Abstract: A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.

Abstract: A fixing device adapted to fix at least one needle-shaped member comprises a fixing base and a fixing mechanism. The fixing base has at least one positioning groove disposed at a front end of the fixing base. The needle-shaped member is adapted to be positioned in the positioning groove. The fixing mechanism has at least one pressing protrusion at a front end of the fixing mechanism. The pressing protrusion is adapted to press and hold the needle-shaped member in the positioning groove.

Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.

Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device has at least one first positioning groove adapted to position at least one first elongated member and fixes the at least one first elongated member. The second fixing device has at least one second positioning groove adapted to position at least one second elongated member and fixes the at least one second elongated member. Each first positioning groove is aligned with a corresponding second positioning groove so that the first elongated member fixed in the first positioning groove is axially aligned with the second elongated member fixed in the corresponding second positioning groove.

Abstract: A welding system for welding a first elongated element and a second elongated element together by a laser beam that is emitted from a laser welding head after the ideal welding center point of the aligned first and second elongated elements has been positioned at a focal point of the laser beam that is emitted from the laser welding head.