Abstract: A method for automatically recommending to a user of a software application one or more categories of a plurality of different categories of tax deductible expenses includes providing input data to a trained machine learning model and receiving output from the trained machine learning model based on the input data. The output includes a recommendation for the user that includes (i) one or more categories of the plurality of different categories of tax deductible expenses; and (ii) a plurality of examples of tax deductible expenses for each of the one or more categories. The method includes receiving feedback from the user on the recommendation and generating updated training data for the trained machine learning model based on the feedback.

Abstract: Disclosed are a cranial CT-based grading method and a corresponding system, which relate to the field of medical imaging. The cranial CT-based grading method as disclosed solves the problems of relatively great subjective disparities and poor operability in eye-balling ASPECTS assessment. The grading method includes: determining frames where target image slices are located from to-be-processed multi-frame cranial CT data; extracting target areas; performing infarct judgment on each target area included in the target areas to output an infarct judgment outcome regarding the target area; and outputting a grading outcome based on infarct judgment outcomes regarding all target areas.

Abstract: A semiconductor structure and a method for fabricating the semiconductor structure are provided. The method includes forming an epitaxial layer in a substrate. The epitaxial layer includes a first region having a first crystal plane and a second region having a second crystal plane, and indices of lattice planes of the first crystal plane and the second crystal plane are different. The method also includes forming a capping structure including one or more capping layers on the first region and the second region. Forming the capping layer includes forming an initial capping layer having different thicknesses on the first region and the second region; and etching the initial capping layer to reduce a thickness difference between the initial capping layer on the first region and the initial capping layer on the second region. Further, the method includes forming an electrode electrically connected to the capping structure.

Abstract: An arbitrarily shaped skeleton, comprising: a main frame body and limbs disposed on the main frame body; wherein the main frame body is formed with mounting holes for mounting the limbs, one end of the limb is mounted in the mounting hole, and the limb is made of a telescopic structure which can be arbitrarily bent and stretched. The doll made by the skeleton can make a variety of poses, and when the limbs are stretched, the limbs can have the sound of plastic deformation, it is more interesting. The main frame and limbs are made of plastic injection molding, and its cost is low and easy to assemble, simplifying the production process and having more market competitiveness.

Abstract: An arbitrarily shaped skeleton, comprising: a main frame body and limbs disposed on the main frame body; wherein the main frame body is formed with mounting holes for mounting the limbs, one end of the limb is mounted in the mounting hole, and the limb is made of a telescopic structure which can be arbitrarily bent and stretched. The doll made by the skeleton can make a variety of poses, and when the limbs are stretched, the limbs can have the sound of plastic deformation, it is more interesting. The main frame and limbs are made of plastic injection molding, and its cost is low and easy to assemble, simplifying the production process and having more market competitiveness.

Abstract: A method is provided for fabricating a semiconductor structure. The method includes providing a substrate including a first region for forming a first transistor and a second region for forming a second transistor. The method also includes forming a first stress layer in the substrate in the first region and a second stress layer in the substrate in the second region, wherein top surfaces of the first stress layer and the second stress layer are above a surface of the substrate. Further, the method includes forming a cover layer on each of the first stress layer and the second stress layer, and removing portions of the cover layer formed on adjacent side surfaces of the first stress layer and the second stress layer.

Abstract: A method is provided for fabricating a semiconductor structure. The method includes forming a base substrate including a substrate and a stress layer formed in the substrate, where a top surface of the stress layer is higher than a surface of the substrate. The method also includes forming a first cover layer, where a first growth rate difference exists between growth rates of the first cover layer on the top surface of the stress layer and the first cover layer on a side surface of the stress layer. Further, the method includes forming a second cover layer, where a second growth rate difference exists between growth rates of the second cover layer on the top surface of the stress layer and the second cover layer on the side surface of the stress layer, and the second growth rate difference is larger than the first growth rate difference.

Abstract: A semiconductor structure and a method for fabricating the semiconductor structure are provided. The method includes forming an epitaxial layer in a substrate. The epitaxial layer includes a first region having a first crystal plane and a second region having a second crystal plane, and indices of lattice planes of the first crystal plane and the second crystal plane are different. The method also includes forming a capping structure including one or more capping layers on the first region and the second region. Forming the capping layer includes forming an initial capping layer having different thicknesses on the first region and the second region; and etching the initial capping layer to reduce a thickness difference between the initial capping layer on the first region and the initial capping layer on the second region. Further, the method includes forming an electrode electrically connected to the capping structure.

Abstract: A method is provided for fabricating a semiconductor structure. The method includes providing a substrate including a first region for forming a first transistor and a second region for forming a second transistor. The method also includes forming a first stress layer in the substrate in the first region and a second stress layer in the substrate in the second region, wherein top surfaces of the first stress layer and the second stress layer are above a surface of the substrate. Further, the method includes forming a cover layer on each of the first stress layer and the second stress layer, and removing portions of the cover layer formed on adjacent side surfaces of the first stress layer and the second stress layer.

Abstract: A method is provided for fabricating a semiconductor structure. The method includes forming a base substrate including a substrate and a stress layer formed in the substrate, where a top surface of the stress layer is higher than a surface of the substrate. The method also includes forming a first cover layer, where a first growth rate difference exists between growth rates of the first cover layer on the top surface of the stress layer and the first cover layer on a side surface of the stress layer. Further, the method includes forming a second cover layer, where a second growth rate difference exists between growth rates of the second cover layer on the top surface of the stress layer and the second cover layer on the side surface of the stress layer, and the second growth rate difference is larger than the first growth rate difference.

Abstract: A magnetic actuator includes: a movable unit, movable between a first position and a second position, and including an integrally formed eddy-current component and first magnet yoke component; a second magnet yoke component to form a magnetic circuit with the first magnet yoke component; an electromagnetic coil capable of generating an exciting magnetic field when being energized, magnetic lines generated thereby being energized penetrating the magnetic circuit formed by the first and second magnet yoke components; an eddy-current coil to enable an eddy current to be generated in the eddy-current component, to produce an electromagnetic repulsive force to the movable unit; and a permanent magnetic holding component to hold the movable unit in the first position or the second position. The magnetic actuator can simplify the actuator, reduce the number of components and the size thereof, as well as reducing the energy consumption and improving the stability thereof.

Abstract: The present application presents a light emitting diode module comprising a substrate including a first insulating layer, a second insulating layer, and a metal layer between the first and the second insulating layers; a groove formed at the first insulating layer for exposing the metal layer; and a light emitting element disposed at the groove, and including an LED chip and body part surrounding the LED chip, wherein the LED chip contacts the metal layer for radiating heat.

Abstract: The present application presents a light emitting diode module comprising a substrate including a first insulating layer, a second insulating layer, and a metal layer between the first and the second insulating layers; a groove formed at the first insulating layer for exposing the metal layer; and a light emitting element disposed at the groove, and including an LED chip and body part surrounding the LED chip, wherein the LED chip contacts the metal layer for radiating heat.

Abstract: A vehicle covering device having a housing integral with an axle having a folding crank handle to utilize a reeling action useful in the withdrawing and retracting of a folding cover comprised of a sheet like material that when withdrawn can be expanded to cover a vehicles body by manipulation of an end rod attached to said folding covers end portion that is pulled through the jam of a trunk and over a vehicles forward body to effectively protect said vehicle. Additionally the device has base elements integral to its housing for providing support and if desired a secondary rear folding cover that may withdrawn in the same manner that may be utilized to cover the rear or trunk portion of a vehicle as well.