Abstract: A transistor package for use in common base linear, amplification applications includes a base flange member to which an insulating substrate is disposed wherein the bottom surface of the substrate is metalized to provide electrical contact to the flange member. Opposing ends of the substrate are edge metalized to conductively contact the bottom surface while the center portion of the top surface of the substrate has a selective metalized patterned formed therein and is isolated from the metalized opposing edges A metal bonding pad is formed centrally within the center portion and isolated therefrom to which the collector electrode of a transistor chip is die bonded. A lead frame comprising first and second opposing leads and a third lead adjacent to and parallel to the first lead is brazed to the center portion such that the first and second leads are insulated from the center portion while the third lead makes direct contact thereto.

Abstract: The ease of manufacture and performance of printed circuit board RF amplifier and other electronic apparatus requiring a high degree of internal shielding is improved by distributing DC or other signals through rigid conduits having at least one flat side and containing the desired power or signal wires. The rigid conduit is typically soldered, flat side down, at multiple locations to an AC ground plane. The wires exit the conduit through side exit holes and end holes. Side holes are desirably provided at regular intervals. The flat side prevents or reduces rolling or other misalignment of the conduit during assembly, thereby easing circuit board construction. Conduits with square cross-sections are preferred.

Abstract: An improved physical implementation of a high frequency impedance transformer circuit formed from three coaxial transmission line segments is described. In a preferred embodiment, each transmission line segment is in the form of a one and a half turn coil wrapped around a ferrite core. The ends of the coaxial transmission line segments extend through holes in a small PC board and planar conductors thereon. The ends of the transmission line shields are circumferentially soldered to some planar conductors on the board and the center conductors of the coaxial line segments are soldered to adjacent planar conductors on the board in such a way as to provide the desired circuit in a very compact and rugged arrangement.