Abstract: A single event effects (SEE) immune linear voltage regulator includes an input node, an output node, a first transistor control logic, a second transistor control logic, a first transistor, and a second transistor. The regulator is configured such that when the first transistor is operating in linear regulation mode, the second transistor automatically operates in saturation mode, and the voltage at the output node is controlled by the first transistor and the first transistor control logic to be substantially equal to the first reference voltage. Conversely, when the second transistor is operating in linear regulation mode, the first transistor automatically operates in saturation mode, and the voltage at the output node is controlled by the second transistor and the second transistor control logic to be substantially equal to the second reference voltage.

Abstract: An assembly including a substrate that includes a plurality of conductive plane layers including a first group and a second group of common conductive plane layers, where electrically isolated first and second attach pads are on an edge surface of the substrate and at least thermally coupled to the first and second groups of common conductive plane layers, respectively. A surface mount technology (SMT) component, such as a thermal jumper, mounted on the first and second attach pads such that the SMT component is at least thermally coupled to the first and second groups of common conductive plane layers via the first and second attach pads, respectively. Methods of forming such an assembly also are disclosed.

Abstract: An assembly including a substrate that includes a plurality of conductive plane layers including a first group and a second group of common conductive plane layers, where electrically isolated first and second attach pads are on an edge surface of the substrate and at least thermally coupled to the first and second groups of common conductive plane layers, respectively. A surface mount technology (SMT) component, such as a thermal jumper, mounted on the first and second attach pads such that the SMT component is at least thermally coupled to the first and second groups of common conductive plane layers via the first and second attach pads, respectively. Methods of forming such an assembly also are disclosed.

Abstract: Systems and methods for an auto-ranging temperature sensor are provided. In at least one embodiment, a system for sensing and measuring temperature comprises at least one analog signal amplifier that generates an amplified analog signal output based on an analog signal from at least one of a biased thermistor circuit and a calibration circuit and a digital to analog converter that generates an analog offset signal as an input to the at least one analog signal amplifier, wherein the analog offset signal shifts the amplified analog signal within an analog to digital converter input operating range when the amplified analog signal is equal to or greater than a limit of the analog to digital converter input operating range, wherein the analog offset signal is determined based on the magnitude of the amplified analog signal.

Abstract: Example printed board assembly (PBA) interfaces are described. In some examples, the disclosure relates to a printed board (PB) including a conductive layer, where the PB defines a first surface and a recess in the first surface, where a surface defining the recess is at least one of electrically or thermally connected to the conductive layer, and an electrical component body mounted on the PB. The electrical component body may be mounted on the PB such that a surface of the electrical component body extends over at least a portion of the recess, where the recess extends beyond the electrical component body such that the recess defines an aperture for introducing an interface material between the surface of the electrical component body and the surface of the recess.

Abstract: A module for use with an expandable wedge clamp assembly in a chassis channel is provided. The module comprises a first side, a second side, a first extension attached to the first side, and a second extension attached to the second side. The first extension and the second extension are flexible. When the wedge clamp assembly is expanded, the first extension and the second extension flex from a first position to a second position. When the wedge clamp is returned from the expanded position to a relaxed position, the first extension and the second extension return from the second position to the first position.

Abstract: A module for use with an expandable wedge clamp assembly in a chassis channel is provided. The module comprises a first side, a second side, a first extension attached to the first side, and a second extension attached to the second side. The first extension and the second extension are flexible. When the wedge clamp assembly is expanded, the first extension and the second extension flex from a first position to a second position. When the wedge clamp is returned from the expanded position to a relaxed position, the first extension and the second extension return from the second position to the first position.

Abstract: A ducted test socket for thermally testing a device under test (DUT) is provided that can accommodate a large DUT and will improve the thermal transfer efficiency between a precision temperature forcing system (PTFS) and the DUT. The ducted test socket comprises a carrier and a base with opposing, mated cavities and holes. These cavities and holes channel airflow around the entire DUT body and out outlet ports.

Abstract: A thermal head adapter for testing a device under test is provided that can accommodate a large device and will improve the airflow through the thermal head to the device under test and out into the shroud. The thermal head adapter comprises a first section with a first perimeter and a second section with a second perimeter. The shroud is sealed onto an upper surface of first section, and the base of the second section attaches to a printed board. The perimeter of the first section is greater than the perimeter of the second section. The upper surface of the first section may comprise ridges that effectively form a moat-like structure to capture fallen condensation from the shroud walls. A drain may take the liquid within the boundary of the ridges to a desired location outside of the thermal head adapter.

Abstract: A ducted test socket for thermally testing a device under test (DUT) is provided that can accommodate a large DUT and will improve the thermal transfer efficiency between a precision temperature forcing system (PTFS) and the DUT. The ducted test socket comprises a carrier and a base with opposing, mated cavities and holes. These cavities and holes channel airflow around the entire DUT body and out outlet ports.