Patents by Inventor Lanyu Zhang

Lanyu Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230076442
    Abstract: A structured light 3D measurement device and method based on defocus-degree-based unwrapping. Binary fringes varying in fringe width are projected onto an object, and a corresponding fringe image is collected by a camera, and then subjected to phase demodulation to calculate a wrapped phase. The defocus degree is calculated according to modulation degrees of the binary fringes. The defocus degree is plugged into the defocusing phase function to obtain a normalized reference phase. The wrapped phase is subjected to phase unwrapping based on the normalized reference phase to obtain an absolute phase to reconstruct a 3D point cloud.
    Type: Application
    Filed: November 11, 2022
    Publication date: March 9, 2023
    Inventors: Zhuojun ZHENG, Jian GAO, Lanyu ZHANG, Haixiang DENG
  • Patent number: 11569762
    Abstract: The present disclosure relates to the technical field of mechanical precision manufacturing, in particular to a motor tracking error reduction method and an implementation device based on a micro-drive unit. A motor tracking error reduction method based on micro-drive unit includes: providing a motor mover as the working output end, and feeding back the position information of the motor mover to the micro-drive controller in real time by the sensor; controlling the micro-drive unit to compensate the displacement of the motor mover by the micro-drive controller; correcting the tracking error of the motor mover after the displacement compensation, and feeding back the tracking error information after correction to the motor controller. The error reduction method and implementation device in the present disclosure reduce the motor tracking error and solve the problem of coupling interference. In addition, the single position feedback is used to reduce the production cost.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: January 31, 2023
    Assignee: GUANGDONG UNIVERSITY OF TECHNOLOGY
    Inventors: Jian Gao, Jindi Zhang, Yuheng Luo, Lingwei Tan, Lanyu Zhang, Xin Chen
  • Patent number: 11365960
    Abstract: An XY macro-micro motion stage and a control method thereof based on end feedback. The XY macro-micro motion stage includes a fine-adjusting assembly, a macro-driving assembly and an XY position detecting device. The macro-driving assembly includes an X-direction macro-driving unit, a Y-direction macro-driving unit, an X-direction mounting plate and a Y-direction mounting plate. The XY position detecting device is configured to obtain its position on the X axis and Y axis.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: June 21, 2022
    Assignee: GUANGDONG UNIVERSITY OF TECHNOLOGY
    Inventors: Lanyu Zhang, Jian Gao, Junlang Liang, Yun Chen, Yunbo He, Xin Chen
  • Publication number: 20220060125
    Abstract: The present disclosure relates to the technical field of mechanical precision manufacturing, in particular to a motor tracking error reduction method and an implementation device based on a micro-drive unit. A motor tracking error reduction method based on micro-drive unit includes: providing a motor mover as the working output end, and feeding back the position information of the motor mover to the micro-drive controller in real time by the sensor; controlling the micro-drive unit to compensate the displacement of the motor mover by the micro-drive controller; correcting the tracking error of the motor mover after the displacement compensation, and feeding back the tracking error information after correction to the motor controller. The error reduction method and implementation device in the present disclosure reduce the motor tracking error and solve the problem of coupling interference. In addition, the single position feedback is used to reduce the production cost.
    Type: Application
    Filed: November 17, 2020
    Publication date: February 24, 2022
    Inventors: Jian GAO, Jindi ZHANG, Yuheng LUO, Lingwei TAN, Lanyu ZHANG, Xin CHEN
  • Patent number: 11211357
    Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: December 28, 2021
    Assignee: GUANGDONG UNIVERSITY OF TECHNOLOGY
    Inventors: Yun Chen, Shuquan Ding, Yunbo He, Maoxiang Hou, Xin Chen, Jian Gao, Ni Zhao, Lanyu Zhang, Zhengping Wang
  • Publication number: 20210233800
    Abstract: A decoupled XY parallel micro-positioning stage, including a central moving platform, fixed mechanisms, bridge-type micro-displacement amplification mechanisms, a four-bar symmetrical flexible guide mechanism and a piezoelectric ceramic. Each fixed mechanism is arranged between adjacent amplification mechanisms and is symmetrical about X and Y axes centered on the moving platform. The amplification mechanism is symmetrically arranged with respect to the X and Y axes, and includes two first and second longitudinal beams and multiple crossbeams. The two first longitudinal beams are provided in parallel and spaced apart. The two second longitudinal beams are arranged spaced apart between the two first longitudinal beams, and are connected to the two first longitudinal beams via the crossbeams. The crossbeams are connected to the longitudinal beams via a flexible hinge. The piezoelectric ceramic is arranged between the two first longitudinal beams.
    Type: Application
    Filed: April 13, 2021
    Publication date: July 29, 2021
    Inventors: Jian GAO, Wenxiu LAI, Guocong CHEN, Lanyu ZHANG, Yachao LIU, Yongbin ZHONG, Yuheng LUO, Huawen LIN
  • Publication number: 20210210461
    Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.
    Type: Application
    Filed: September 30, 2020
    Publication date: July 8, 2021
    Inventors: Yun CHEN, Shuquan DING, Yunbo HE, Maoxiang HOU, Xin CHEN, Jian GAO, Ni ZHAO, Lanyu ZHANG, Zhengping WANG
  • Publication number: 20210166981
    Abstract: The disclosure relates to a method for repairing an internal circuit break defect in a chip, including: S1, detecting the defect position of the chip and the type and performance parameters of a filling material; S2, positioning the chip on a two-dimensional motion platform; S3, setting parameters of two beams of laser; adjusting a focal length of the two beams of laser three-dimensional incident angle and a Z axis, so that a focus point of the two beams of laser irradiate any end of the circuit break of the chip; S4, the two-dimensional motion platform drives the chip to move, so that the focus point of the two beams of laser is moved to an other end of the circuit break, and an moving trajectory of the focus point of the two beams of laser feeds through the two ends of the circuit break of the chip.
    Type: Application
    Filed: September 30, 2020
    Publication date: June 3, 2021
    Inventors: Yun CHEN, Yao YAO, Shuquan DING, Junyu LONG, Maoxiang HOU, Dachuang SHI, Xin CHEN, Jian GAO, Qiang LIU, Lanyu ZHANG, Yunbo HE, Shenghui ZHANG, Zhengping WANG
  • Publication number: 20210081827
    Abstract: A fast clustering algorithm of kernel fuzzy C-means integrated with spatial constraints, including (1) applying the illumination processing algorithm, the preprocessed image affected by illumination is constructed; (2) After step (1), the original image and preprocessed image are mapped to the feature space using Gaussian kernel to cluster and segment. Providing a defect segmentation method for fluorescent glue which is robust to illumination to process and calculate the illuminated image, so as to complete the detection of foreign matters, bubbles and discoloration defects of fluorescent glue in lighting products. The disclosure provides a fast clustering algorithm of kernel fuzzy C-means integrated with spatial constraints.
    Type: Application
    Filed: November 3, 2020
    Publication date: March 18, 2021
    Inventors: Jian GAO, Ruirong LUO, Lanyu ZHANG, Haixiang DENG, Xin CHEN
  • Patent number: 10914575
    Abstract: A composite sine-trapezoidal fringe structured light 3D measurement method includes projecting trapezoidal fringe patterns onto a measured object and capturing fringe images; sorting the fringe images by brightness, resolving them into uniform light images and sinusoidal light images, and obtaining a sub-region ordinal number of each image; using the uniform light image to identify a strength response model of the captured fringe image, and obtaining a strength response model parameter; an actual projection strength, a sub-region phase of the sinusoidal light image according to the actual projection strength, a wrapped phase according to sub-region phase and sub-region ordinal number, an absolute phase according to the wrapped phase and sub-region ordinal number, a surface point of the measured object at the positions of a projector pixel and a camera pixel according to the absolute phase, and an object surface model of the measured object by a reconstruction by triangulation.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: February 9, 2021
    Assignee: Guangdong University of Technology
    Inventors: Jian Gao, Jianhua Mo, Lanyu Zhang, Zhuoyun Zheng, Xin Chen, Yun Chen, Yunbo He