Patents by Inventor Larry A. Norris

Larry A. Norris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Techniques for creating optimized pad geometries for soldering
    Patent number: 7416106
    Abstract: A technique for processing a circuit board involves placing a mask layer on the circuit board, where the mask layer defines a set of pad profiles for a component mounting location. Each pad profile has a set of rounded corners. The technique further involves forming, for each pad profile, a soldering pad having a set of radii corresponding to the set of rounded corners of that pad profile to create a set of soldering pads for the component mounting location. Each soldering pad is configured for a high bond strength solder joint. The technique further involves removing the mask layer from the circuit board and soldering a component to the component mounting location. This technique is well-suited for robustly mounting the component to the circuit board at solder joints with relatively high solder joint bond strengths.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: August 26, 2008
    Assignee: EMC Corporation
    Inventors: Stuart D. Downes, Jin Liang, Larry Norris
  • Circuit board processing techniques using solder fusing
    Patent number: 7159758
    Abstract: A circuit board processing system has a circuit board fabrication stage configured to fabricate a circuit board having a set of circuit board pads, and a solder fusing stage coupled to the circuit board fabrication stage. The solder fusing stage is configured to (i) apply flux and solder concurrently to the set of circuit board pads, and (ii) activate the flux and melt the solder to form a set of substantially flat solder coatings which is fused to the set of circuit board pads. The circuit board processing system further includes a washing stage coupled to the solder fusing stage. The washing stage is configured to remove contamination from a surface of the circuit board having the circuit board pads and from the set of substantially flat solder coatings which is fused to the set of circuit board pads. Such a system is well-suited for lead-free solder.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: January 9, 2007
    Assignee: EMC Corporation
    Inventors: Stuart D. Downes, Larry Norris, Jin Liang
  • Lo-pro sling swivel
    Patent number: 6536154
    Abstract: A quick-detachable sling swivel comprises a body and a shift/swing gate mounted on the body through an elongated plunger. The gate, through manipulation of the plunger, is adjustable between open and closed positions relative to the body to enable mounting, demounting and securing of the swivel relative to an external structure.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: March 25, 2003
    Assignee: Michaels of Oregon Co.
    Inventor: Larry A. Norris
  • LO-PRO SLING SWIVEL
    Publication number: 20030046853
    Abstract: A quick-detachable sling swivel comprises a body and a shift/swing gate mounted on the body through an elongated plunger. The gate, through manipulation of the plunger, is adjustable between open and closed positions relative to the body to enable mounting, demounting and securing of the swivel relative to an external structure.
    Type: Application
    Filed: September 7, 2001
    Publication date: March 13, 2003
    Inventor: Larry A. Norris
  • Sling swivel
    Patent number: D460799
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: July 23, 2002
    Assignee: Michaels of Oregon Co.
    Inventor: Larry A. Norris