Patents by Inventor Larry C. Collins

Larry C. Collins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for improving the power dissipation of a semiconductor device
    Patent number: 5646373
    Abstract: An apparatus for improving the power dissipation of a semiconductor device surface mounted on a printed circuit board having at least a top printed circuit board layer and a bottom printed circuit board layer is provided. The apparatus includes a first pad of metallic material connected to a top surface of the top printed circuit board layer. The semiconductor device is connected to the first pad. A second pad of metallic material is connected a to the top surface of at least one of the top and bottom printed circuit board layers, wherein the second pad is electrically isolated from the semiconductor device. The apparatus also includes at least one thermal via for heat transfer through the printed circuit board layers thermally coupled to the thermal pad. A heat sink is thermally coupled to the at least one thermal via.
    Type: Grant
    Filed: October 5, 1995
    Date of Patent: July 8, 1997
    Assignee: Caterpillar Inc.
    Inventors: Larry C. Collins, James G. Cook, John P. Hoffman