Abstract: Gain and bandwidth enhancement of a RF power amplifier package is effected by electrically coupling a power transistor to a RF signal source with an inductance, and further electrically coupling the input and common element terminals of the power transistor with a shunt inductance. The shunt inductance is chosen such that its reactance is the conjugate of the reactance of the power transistor's common-input capacitance. A similar conjugate matching output circuit is provided to electrically couple the transistor's output and common element terminals to a load. The shunt inductors are implemented on the package substrate by connecting the respective input and output transistor terminals to grounded shunt caps via bond wires.

Abstract: Gain and bandwidth enhancement of a RF power amplifier package is effected by electrically coupling a power transistor to a RF signal source with an inductance, and further electrically coupling the input and common element terminals of the power transistor with a shunt inductance. The shunt inductance is chosen such that its reactance is the conjugate of the reactance of the power transistor's common-input capacitance. A similar conjugate matching output circuit is provided to electrically couple the transistor's output and common element terminals to a load. The shunt inductors are implemented on the package substrate by connecting the respective input and output transistor terminals to grounded shunt caps via bond wires.

Abstract: An electrical assembly includes an IC package having a thermally conductive mounting flange in contact with a heat sink. A thermally conductive casing is secured to the heat sink, the casing at least partially enclosing the IC package. A resilient retaining member is disposed between the casing and IC package, the retaining member applying sufficient force on the IC package so as to maintain good thermal contact between the mounting flange and heat sink.

Abstract: A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposing sides of the package are positioned over corresponding conductive areas formed on the surface of the respective adjacent PC board section. The leads are electrically coupled with the conductive areas by respective tie-down screws fastened through dielectric isolating washers. The screws are tightened sufficiently against the isolating washers so as to press the respective package leads into solid electrical contact with the conductive areas. Portions of the respective leads and conductive areas surrounding the tie-down screws are cut-away to prevent electrical contact, in order to avoid shorting the leads and/or conductive areas to the heat sink via the tie-down screws.

Abstract: A plurality of transistor cells (36) formed on a semiconductor substrate (32) are connected to form a radio frequency power transistor device (30), whereby individual conductive paths (38) are formed on one side of the substrate (32) to connect respective common gate terminals (34) of adjacent transistor cells (36) in series. A further conductive path (40) is formed on an opposite side of the substrate connecting respective drain terminals (35) of the transistor cells (36) in parallel. A resistive element (42) is interposed in the conductive path (38) connecting each adjacent pair of gate terminals (34). The conductivity of the respective resistive elements (42) is selected so as to adequately provide a conductive pathway for connecting the respective gate terminal outputs, while being sufficiently resistive such that each gate terminal 34 "sees" an electrical circuit termination.

Abstract: A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposing sides of the package are positioned over corresponding conductive areas formed on the surface of the respective adjacent PC board section. The respective package leads are each connected to the corresponding PC board areas by one or more flexible bond wires. In addition to electrically connecting the package leads to the respective PC board sections, the bond wires collectively secure the package to the heat sink in a manner allowing for relative lateral movement between the respective flange and heat sink surfaces in response to thermal stresses.

Abstract: A semiconductor die is attached to a transistor package by a plurality of resilient clamping members, which are bonded at one end to a top surface of the semiconductor die and at another end to a stable surface, such as an emitter, collector, or base lead frame, of the transistor package. The shape and composition of the clamping members provides a resilient force that causes a bottom surface of the die to make and maintain substantially uniform and constant contact with the die attach area of the transistor package, e.g., a mounting flange or non-conductive substrate. The clamping members are preferably conductive and can conduct current from respective transistor cell locations on the die to the respective lead frames to which the clamping members are bonded.

Abstract: A top surface of a protective cover of an IC component package is provided with a centered-protrusion, e.g., such as a cylindrical peg, that extends above the cover. A retaining-spring is formed by twisting a resilient (e.g., metal) metal strip into a ribbon-like shape having opposing ends that extend from a curvelinear bottom surface. The bottom surface of the retaining-spring is provided with an opening configured to mate with the centered protrusion on the package cover, such that the opposing ends of the retaining-spring extend away from the package cover at substantially the same, albeit reverse angles. In order to mount the IC package to a heat sink, the bottom surface of the retaining-spring may be compressively mated onto the package cover at the same time the package is inserted between two substantially parallel walls protruding from the heat sink surface, wherein the walls are distanced from each other.