Patents by Inventor Larry D. Creasy, JR.

Larry D. Creasy, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDS INCLUDING SEE-THROUGH PORTIONS
    Publication number: 20160113161
    Abstract: According to various aspects, exemplary embodiments are disclosed of EMI shields that include see-through portions. In an exemplary embodiment, an EMI shielding apparatus or assembly generally includes a cover, lid, or top. The cover includes at least a portion that is see-through. Also disclosed are exemplary embodiments of methods relating to making EMI shielding apparatus or assemblies. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.
    Type: Application
    Filed: December 12, 2014
    Publication date: April 21, 2016
    Inventors: Shelby Ball, Larry D. Creasy, JR.
  • METALLIZED FILM-OVER-FOAM CONTACTS
    Publication number: 20150382481
    Abstract: A contact suitable for circuit grounding of surface mount technology devices generally includes a resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.
    Type: Application
    Filed: September 3, 2015
    Publication date: December 31, 2015
    Inventors: Weifan Wang, Yi-Shen Lin, Larry D. Creasy, JR.
  • Metallized film-over-foam contacts
    Patent number: 9131616
    Abstract: A metallized film-over-foam contact suitable for circuit grounding of surface mount technology devices generally includes a silicone foam resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: September 8, 2015
    Assignee: Laird Technologies, Inc.
    Inventors: Weifan Wang, Yi-Shen Lin, Larry D. Creasy, Jr.
  • METALLIZED FILM-OVER-FOAM CONTACTS
    Publication number: 20140203069
    Abstract: A metallized film-over-foam contact suitable for circuit grounding of surface mount technology devices generally includes a silicone foam resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.
    Type: Application
    Filed: March 19, 2014
    Publication date: July 24, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: Weifan Wang, Yi-Shen Lin, Larry D. Creasy, JR.
  • EMI shielding heat shrinkable tapes
    Patent number: 8691393
    Abstract: Disclosed herein are various exemplary embodiments of electromagnetic interference (EMI) shielding heat shrinkable materials and articles (e.g., tapes, etc.). In an exemplary embodiment, an EMI shielding heat shrinkable tape includes a heat shrinkable layer and an EMI shielding layer. When heated to a shrink temperature of the heat shrinkable layer, the tape may shrink lengthwise.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: April 8, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Kelly G. Cook, Larry D. Creasy, Jr.
  • FLAME RETARDANT EMI SHIELDS
    Publication number: 20140023851
    Abstract: An electromagnetic interference shield generally includes a resilient core member and an electrically conductive layer. An adhesive bonds the electrically conductive layer to the resilient core member. The adhesive can include halogen-free flame retardant.
    Type: Application
    Filed: October 1, 2013
    Publication date: January 23, 2014
    Applicant: Laird Technologies, Inc.
    Inventor: Larry D. Creasy, Jr.
  • Flame retardant EMI shields
    Patent number: 8545974
    Abstract: An electromagnetic interference shield generally includes a resilient core member and an electrically conductive layer. An adhesive bonds the electrically conductive layer to the resilient core member. The adhesive can include halogen-free flame retardant. The electrically conductive layer can be provided with halogen-free flame retardant and/or a corrosion inhibitor.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: October 1, 2013
    Assignee: Laird Technologies, Inc.
    Inventor: Larry D Creasy, Jr.
  • EMI SHIELDING HEAT SHRINKABLE TAPES
    Publication number: 20130133941
    Abstract: Disclosed herein are various exemplary embodiments of electromagnetic interference (EMI) shielding heat shrinkable materials and articles (e.g., tapes, etc.). In an exemplary embodiment, an EMI shielding heat shrinkable tape includes a heat shrinkable layer and an EMI shielding layer. When heated to a shrink temperature of the heat shrinkable layer, the tape may shrink lengthwise.
    Type: Application
    Filed: January 22, 2013
    Publication date: May 30, 2013
    Applicant: Laird Technologies, Inc.
    Inventors: Kelly G. Cook, Larry D. Creasy, JR.
  • FLAME RETARDANT EMI SHIELDS
    Publication number: 20100258344
    Abstract: An example electromagnetic interference shield generally includes a resilient core member and an electrically conductive layer. An adhesive bonds the electrically conductive layer to the resilient core member. The adhesive may include halogen-free flame retardant.
    Type: Application
    Filed: June 23, 2010
    Publication date: October 14, 2010
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventor: Larry D. Creasy, JR.