Patents by Inventor Larry Duane KINSMAN
Larry Duane KINSMAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240167873Abstract: A package includes an optical sensor die, a support grid structure disposed on the optical sensor die, and an optically transparent cover attached to the support grid structure. A surface of the optical sensor die includes an optically active surface area (OASA) and an edge surface portion lying outside a perimeter of the OASA. The support grid structure disposed on the surface of the optical sensor die includes at least one pillar disposed within the OASA and an edge block disposed on the edge surface portion lying outside the perimeter of the OASA. The optically transparent cover is supported by the support grid structure at a height above the optical sensor die while maintaining an air gap between the optically transparent cover and the OASA.Type: ApplicationFiled: November 17, 2022Publication date: May 23, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Brian Anthony VAARTSTRA, Larry Duane KINSMAN
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Publication number: 20240145515Abstract: An integrated circuit package (34, 34?, 34?) may be implemented by stacked first, second, and third integrated circuit dies (40, 50, 60). The first and second dies (40, 50) may be bonded to each other using corresponding inter-die connection structures (74-1, 84-1) at respective interfacial surfaces facing the other die. The second die (50) may also include a metal layer (84-2) for connecting to the third die (60) at its interfacial surface with the first die (40). The metal layer (84-2) may be connected to a corresponding inter-die connection structure (64) on the side of the third die (60) facing the second die (50) through a conductive through-substrate via (84-2) and an additional metal layer (102) in a redistribution layer (96) between the second and third dies (50, 60). The third die (60) may have a different lateral outline than the second die (50).Type: ApplicationFiled: April 27, 2022Publication date: May 2, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Swarnal BORTHAKUR, Mario M. PELELLA, Chandrasekharan KOTHANDARAMAN, Marc Allen SULFRIDGE, Yusheng LIN, Larry Duane KINSMAN
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Patent number: 11728360Abstract: An image sensor package may include a semiconductor wafer having a pixel array, a color filter array (CFA) formed over the pixel array, and one or more lenses formed over the CFA. A light block layer may couple over the semiconductor wafer around a perimeter of the lenses and an encapsulation layer may be coupled around the perimeter of the lenses and over the light block layer. The light block layer may form an opening providing access to the lenses. A mold compound layer may be coupled over the encapsulation layer and the light block layer. A temporary protection layer may be used to protect the one or more lenses from contamination during application of the mold compound and/or during processes occurring outside of a cleanroom environment.Type: GrantFiled: January 14, 2022Date of Patent: August 15, 2023Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Duane Kinsman, Swarnal Borthakur, Marc Allen Sulfridge, Scott Donald Churchwell, Brian Vaartstra
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Publication number: 20230064356Abstract: A package includes an interposer substrate having at least one through-substrate via (TSV) electrically connecting a top surface of the interposer substrate to a bottom surface of the interposer substrate. The package further includes at least one semiconductor die having a top side, a bottom side, and a sidewall. The at least one semiconductor die is disposed on the interposer substrate with the bottom side electrically coupled to the top surface of the interposer substrate. A molding material is disposed on at least on a portion of the at least one semiconductor die, and an array of conductive material is disposed on the bottom surface of the interposer substrate. The array of conductive material forms the external contacts of the package.Type: ApplicationFiled: August 25, 2022Publication date: March 2, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yusheng LIN, Swarnal BORTHAKUR, Larry Duane KINSMAN
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Publication number: 20220223641Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, at least one conductor connected to the image sensor die and the substrate, and a light-transmitting member including a substrate member, a first leg member extending from a first edge portion of the substrate member, and a second leg member extending from a second edge portion of the substrate member, the first leg member being coupled to the substrate, the second leg member being coupled to the substrate.Type: ApplicationFiled: January 14, 2021Publication date: July 14, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Duane KINSMAN, Yu-Te HSIEH
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Patent number: 11342369Abstract: An image sensor package may include a semiconductor wafer having a pixel array, a color filter array (CFA) formed over the pixel array, and one or more lenses formed over the CFA. A light block layer may couple over the semiconductor wafer around a perimeter of the lenses and an encapsulation layer may be coupled around the perimeter of the lenses and over the light block layer. The light block layer may form an opening providing access to the lenses. A mold compound layer may be coupled over the encapsulation layer and the light block layer. A temporary protection layer may be used to protect the one or more lenses from contamination during application of the mold compound and/or during processes occurring outside of a cleanroom environment.Type: GrantFiled: February 22, 2019Date of Patent: May 24, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Duane Kinsman, Swarnal Borthakur, Marc Allen Sulfridge, Scott Donald Churchwell, Brian Vaartstra
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Publication number: 20220139982Abstract: An image sensor package may include a semiconductor wafer having a pixel array, a color filter array (CFA) formed over the pixel array, and one or more lenses formed over the CFA. A light block layer may couple over the semiconductor wafer around a perimeter of the lenses and an encapsulation layer may be coupled around the perimeter of the lenses and over the light block layer. The light block layer may form an opening providing access to the lenses. A mold compound layer may be coupled over the encapsulation layer and the light block layer. A temporary protection layer may be used to protect the one or more lenses from contamination during application of the mold compound and/or during processes occurring outside of a cleanroom environment.Type: ApplicationFiled: January 14, 2022Publication date: May 5, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Duane KINSMAN, Swarnal BORTHAKUR, Marc Allen SULFRIDGE, Scott Donald CHURCHWELL, Brian VAARTSTRA
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Patent number: 10490588Abstract: Various embodiments of the present technology may comprise a method and apparatus for an image sensor with a thermal equalizer for distributing heat. The method and apparatus may comprise a thermal equalizer disposed between a sensor die and a circuit die to prevent uneven heating of the pixels in the sensor die. The method and apparatus may comprise a thermal equalizer integrated within the circuit die.Type: GrantFiled: September 16, 2016Date of Patent: November 26, 2019Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Duane Kinsman, Swarnal Borthakur, Marc Allen Sulfridge
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Patent number: 10388684Abstract: An image sensor package may include a semiconductor wafer having a pixel array, a color filter array (CFA) formed over the pixel array, and one or more lenses formed over the CFA. A light block layer may couple over the semiconductor wafer around a perimeter of the lenses and an encapsulation layer may be coupled around the perimeter of the lenses and over the light block layer. The light block layer may form an opening providing access to the lenses. A mold compound layer may be coupled over the encapsulation layer and the light block layer. A temporary protection layer may be used to protect the one or more lenses from contamination during application of the mold compound and/or during processes occurring outside of a cleanroom environment.Type: GrantFiled: October 4, 2016Date of Patent: August 20, 2019Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Duane Kinsman, Swarnal Borthakur, Marc Allen Sulfridge, Scott Donald Churchwell, Brian Vaartstra
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Publication number: 20190189662Abstract: An image sensor package may include a semiconductor wafer having a pixel array, a color filter array (CFA) formed over the pixel array, and one or more lenses formed over the CFA. A light block layer may couple over the semiconductor wafer around a perimeter of the lenses and an encapsulation layer may be coupled around the perimeter of the lenses and over the light block layer. The light block layer may form an opening providing access to the lenses. A mold compound layer may be coupled over the encapsulation layer and the light block layer. A temporary protection layer may be used to protect the one or more lenses from contamination during application of the mold compound and/or during processes occurring outside of a cleanroom environment.Type: ApplicationFiled: February 22, 2019Publication date: June 20, 2019Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Duane KINSMAN, Swarnal BORTHAKUR, Marc Allen SULFRIDGE, Scott Donald CHURCHWELL, Brian VAARTSTRA
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Publication number: 20190189663Abstract: An image sensor package may include a semiconductor wafer having a pixel array, a color filter array (CFA) formed over the pixel array, and one or more lenses formed over the CFA. A light block layer may couple over the semiconductor wafer around a perimeter of the lenses and an encapsulation layer may be coupled around the perimeter of the lenses and over the light block layer. The light block layer may form an opening providing access to the lenses. A mold compound layer may be coupled over the encapsulation layer and the light block layer. A temporary protection layer may be used to protect the one or more lenses from contamination during application of the mold compound and/or during processes occurring outside of a cleanroom environment.Type: ApplicationFiled: February 22, 2019Publication date: June 20, 2019Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Duane KINSMAN, Swarnal BORTHAKUR, Marc Allen SULFRIDGE, Scott Donald CHURCHWELL, Brian VAARTSTRA
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Patent number: 9947705Abstract: An image sensor may include an infrared radiation-blocking layer. The infrared radiation-blocking layer may block infrared radiation from reflecting off of metal layers formed beneath pixel structures in the image sensor so that the reflected light does not reach the photodiodes. The infrared radiation-blocking layer may be formed between a backside redistribution layer and an epitaxial silicon layer in which pixel structures such as photodiodes and transistors are formed. The infrared radiation-blocking layer may be formed from a pre-existing metal layer between the backside redistribution layer and the epitaxial silicon layer. The infrared radiation-blocking layer may prevent the image sensor from generating inadvertent photocurrents in response to reflected infrared light.Type: GrantFiled: September 26, 2016Date of Patent: April 17, 2018Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Swarnal Borthakur, Larry Duane Kinsman
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Publication number: 20180097028Abstract: An image sensor package may include a semiconductor wafer having a pixel array, a color filter array (CFA) formed over the pixel array, and one or more lenses formed over the CFA. A light block layer may couple over the semiconductor wafer around a perimeter of the lenses and an encapsulation layer may be coupled around the perimeter of the lenses and over the light block layer. The light block layer may form an opening providing access to the lenses. A mold compound layer may be coupled over the encapsulation layer and the light block layer. A temporary protection layer may be used to protect the one or more lenses from contamination during application of the mold compound and/or during processes occurring outside of a cleanroom environment.Type: ApplicationFiled: October 4, 2016Publication date: April 5, 2018Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Duane KINSMAN, Swarnal BORTHAKUR, Marc Allen SULFRIDGE, Scott Donald CHURCHWELL, Brian VAARTSTRA
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Publication number: 20180090532Abstract: An image sensor may include an infrared radiation-blocking layer. The infrared radiation-blocking layer may block infrared radiation from reflecting off of metal layers formed beneath pixel structures in the image sensor so that the reflected light does not reach the photodiodes. The infrared radiation-blocking layer may be formed between a backside redistribution layer and an epitaxial silicon layer in which pixel structures such as photodiodes and transistors are formed. The infrared radiation-blocking layer may be formed from a pre-existing metal layer between the backside redistribution layer and the epitaxial silicon layer. The infrared radiation-blocking layer may prevent the image sensor from generating inadvertent photocurrents in response to reflected infrared light.Type: ApplicationFiled: September 26, 2016Publication date: March 29, 2018Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Swarnal BORTHAKUR, Larry Duane KINSMAN
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Publication number: 20180083058Abstract: Various embodiments of the present technology may comprise a method and apparatus for an image sensor with a thermal equalizer for distributing heat. The method and apparatus may comprise a thermal equalizer disposed between a sensor die and a circuit die to prevent uneven heating of the pixels in the sensor die. The method and apparatus may comprise a thermal equalizer integrated within the circuit die.Type: ApplicationFiled: September 16, 2016Publication date: March 22, 2018Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Duane KINSMAN, Swarnal BORTHAKUR, Marc Allen SULFRIDGE