Patents by Inventor Larry Huang

Larry Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11981740
    Abstract: Provided herein are BAFF-R antibodies as well as compositions and methods of making and using the same. The antibodies provided herein are, inter alia, useful for the treatment of cancer and autoimmune diseases.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: May 14, 2024
    Assignees: CITY OF HOPE, BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM
    Inventors: Hong Qin, Larry W. Kwak, Jingxing Li, Kexin Huang
  • Publication number: 20240096548
    Abstract: An electronic device is disclosed. The electronic device can include a core having a top core section and a bottom core section, a laminate substrate, where the laminate substrate having a void through which the top and bottom core sections are connected, and the laminate substrate having conductive traces. The electronic device can further include a base having a first side including a recess and a second side opposite the first site, at least one of the core and the laminate substrate disposed in the recess of the base, where the base has one or more terminals on the second side to electrically connect to an external device.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Inventors: IAN YAN, WINDY HUANG, LARRY GAO, BOHR WAN
  • Patent number: 6629813
    Abstract: Within a method for operating a fabrication tool which requires transfer of a series substrates from a storage carrier to a process carrier when fabricating the series of substrates within the process carrier within the fabrication tool, a specific series of substrates is transferred from a storage carrier to a process carrier (and/or the reverse) simultaneously with fabricating a separate series of substrates within a process carrier within the fabrication tool. By employing the method, the fabrication tool may be operated more efficiently.
    Type: Grant
    Filed: April 18, 2001
    Date of Patent: October 7, 2003
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Yiau-Hweui Chen, Kerry Chiu, Raymond Chen, Larry Huang
  • Publication number: 20020154988
    Abstract: Within a method for operating a fabrication tool which requires transfer of a series substrates from a storage carrier to a process carrier when fabricating the series of substrates within the process carrier within the fabrication tool, a specific series of substrates is transferred from a storage carrier to a process carrier (and/or the reverse) simultaneously with fabricating a separate series of substrates within a process carrier within the fabrication tool. By employing the method, the fabrication tool may be operated more efficiently.
    Type: Application
    Filed: April 18, 2001
    Publication date: October 24, 2002
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yiau-Hweui Chen, Kerry Chiu, Raymond Chen, Larry Huang