Abstract: An apparatus including a tube to encase a fluid, a first portion of the tube disposed in a base portion of a mobile computing device, a second portion of the tube disposed in a display portion of the mobile computing device, the second portion of the tube including metal and a pump coupled to the tube and operable to circulate the fluid in the tube. A mobile computing device including a base portion; a display portion; a tube to encase a fluid, a first portion of the tube disposed in the base portion, a second portion of the tube disposed in the display portion and including metal, the base portion and the display portion coupled by a hinge; and a pump coupled to the tube and operable to circulate the fluid in the tube.

Abstract: A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device.

Abstract: A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device.

Abstract: A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device.

Abstract: A method including sensing a temperature of an electronic component in a portable computing device; circulating a fluid between one of a first heat transfer plate and a second heat transfer plate in response to a threshold temperature being sensed; and stopping the circulating in response to sensing a temperature is below the threshold temperature. A heat exchanging system including a first heat transfer plate coupled to an electronic component and to a second heat transfer plate; and a fluid for circulating through one of the first heat transfer plate and the second heat transfer plate in response to a threshold temperature being sensed by a sensor. An apparatus including a heat generating element; a first heat transfer plate coupled to the heat generating element; a second heat transfer plate; and a fluid for circulating through a tube, the first part and the second part of the portable computing device in response to a threshold temperature being sensed by a sensor.

Abstract: A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device.

Abstract: A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device.

Abstract: A heat exchanging system that includes a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device, where the system includes a pump coupled to the tube, and a temperature sensor coupled to the tube and the pump.

Abstract: An improved memory module and method of manufacture are presented. The memory module takes on the same outer dimensions as conventional memory cards. The memory module includes an integrated circuit and a conductor encased within molded resin. The conductor can be taken from a tape or a lead frame, and can include bumps or wires extending from the conductor to corresponding bonding pads on the integrated circuit. The bonded integrated circuit can thereafter be placed within a cavity formed inside a mold housing, where resin may be injected to form the memory module. The conductor can also be shaped so as to extend on multiple planes from the connection point on or near the bonding pad to an edge connector residing near one edge only of the memory module. The conductor is thereby connected to the integrated circuit and provides slide-in, releasable coupling to a receptor.

Abstract: An integrated circuit (IC) package includes a substrate, a ground line, and an encoded region. The encoded region provides information based upon selective deposition of solder balls electrically coupled to the ground line.

Abstract: An integrated circuit (IC) package includes a substrate, a ground line, and an encoded region. The encoded region provides information based upon selective deposition of solder balls electrically coupled to the ground line.

Abstract: A signal coupler is comprised of a transmitting section and a receiving section. The receiving section includes a polymer pyroelectric film element having a greater than 1% by volume of a high thermal diffusivity material, such as aluminum nitride, to improve the thermal diffusivity of the polymer film. A preferred embodiment of the transmitting section includes a thin film resistive heater to generate thermal pulses which are coupled to the receiving section by a thin film of thermal grease disposed between the receiving section and the transmitting section.

Abstract: Modularly constructed multichip modules with are disclosed. A plurality of miniature capacitor substrates and/or miniature resistor substrates are assembled and attached to a base substrate, preferably in a regular pattern. Power supply substrates are preferably attached to the base substrate along with the miniature substrates. All of the attached components are preferably pretested and have thicknesses close to one another. The pretesting substantially increases the manufacturing yield. Gaps between the miniature substrates and power supply substrates are filled with a polymer material, such as a powder-filled polyimide precursor. Thereafter, dielectric layer is formed over the components to provide a more planar surface. The dielectric layer is preferably planarized, such as by a chemical mechanical polishing process, to provide for a more planar layer.

Abstract: An improved memory module and method of manufacture are presented. The memory module takes on the same outer dimensions as conventional memory cards. The memory module includes an integrated circuit and a conductor encased within molded resin. The conductor can be taken from a tape or a lead frame, and can include bumps or wires extending from the conductor to corresponding bonding pads on the integrated circuit. The bonded integrated circuit can thereafter be placed within a cavity formed inside a mold housing, where resin may be injected to form the memory module. The conductor can also be shaped so as to extend on multiple planes from the connection point on or near the bonding pad to an edge connector residing near one edge only of the memory module. The conductor thereby serves as an integrated signal carrier which receives connection to the integrated circuit and provides slide-in, releasable coupling to a receptor normally designed to receive conventional memory cards.

Abstract: A method of determining the most cost effective manner in which to provide a given number of memory or logic gates for a particular application. The method takes into consideration both the cost per memory bit of fabricating memory cells on a semiconductor chip as a function of the number of memory cells on the chip (i.e, the chip size), and the costs of assembling multiple memory chips into a larger memory device using different assembly and packaging configurations. By considering the fabrication and packaging costs together, the most economically efficient combination of memory chip size and packaging method to produce a desired memory capacity can be determined.

Abstract: Heatsink structures for integrated circuit chips, chip packages, printed wiring boards and the like are disclosed. The heatsink structures according to the present invention have thin flexible cooling fins which move and vibrate under the flow of a cooling fluid. In one embodiment, the fins comprise a thin metal film, such as copper or aluminum, which is laminated to a thin polymeric layer. The polymeric layer provides resilience and elasticity to the metal film and the cooling fins.

Abstract: A coupling such as a socket may couple one electronic device to another and may reduce differential thermal expansion between the two coupled devices. For example, a surface mount socket may differentially expand relative to a printed circuit board. By incorporating a structure having a coefficient of thermal expansion that matches the coefficient of thermal expansion of the printed circuit board, differential thermal expansion may be lessened and the possibility of mechanical damage may be reduced.

Abstract: A universal multi-chip interconnect system using a set of at least two types of standardized interconnect components is disclosed. One of the component types comprises a chip carrier capable of holding at least one IC chip in a first portion thereof and providing a plurality of standardized interconnections from the first portion to one or more second portions of the carrier, where one or more interconnect components of a different type may be connected. Another of the component types comprises a bridge connector which is capable of connecting to two or more chip carriers at their second portions. Each bridge connector has at least two interconnect portions which are capable of connecting to chip carriers at their second portions, and a standardized pattern of interconnect wires between the interconnect portions.

Abstract: An interposer substrate for mounting an integrated circuit chip to a substrate, and method of making the same, are shown. The interposer substrate comprises power supply paths and controlled impedance signal paths that are substantially isolated from each other. Power supply is routed through rigid segments and signals are routed through a thin film flexible connector that runs from the upper surface of the interposer substrate to the lower surface. Bypass capacitance is incorporated into the interposer substrate and connected to the power supply so that it is positioned very close to the integrated circuit chip. The interposer may be fabricated by forming a multilayered thin film structure including the signal paths over a rigid substrate having vias formed therein, removing the central portion of the substrate leaving the two end segments, and folding and joining the end segments such that the vias are connected.

Abstract: Heatsink structures for integrated circuit chips, chip packages, printed wiring boards and the like are disclosed. The heatsink structures according to the present invention have thin flexible cooling fins which move and vibrate under the flow of a cooling fluid. In one embodiment, the fins comprise a thin metal film, such as copper or aluminum, which is laminated to a thin polymeric layer. The polymeric layer provides resilience and elasticity to the metal film and the cooling fins.