Abstract: System, including methods and devices, for fixing bone. The system may include a bone plate having two or more plate members connected to one another with one or more movable joints. Each joint may permit the orientation of the plate members to be adjusted relative to one another in a single plane or two or more nonparallel planes. The joint may have a movable configuration and a fixed configuration. Methods of creating the bone plate are also provided.

Abstract: Decoupling capacitance is provided with negligible inductance in a high speed discrete wire logic panel by the use of SMT (surface mounting) capacitors that are mounted in holes in the circuit board. A hole is formed in the circuit board under each location where a dual-in-line IC (integrated circuit) is to be mounted, and an SMT capacitor is mounted in the hole, with the opposite terminals of the capacitor soldered to the conductive layers on opposite board surfaces. Each quantity of solder extends substantially in the plane of a corresponding conductive layer. Only one side of each capacitor terminal is soldered to a conductive layer, to permit flux washout. In the PGA (pin grid array) area of the circuit board, a capacitor is selectively mounted under an IC by removing a pin from a hole lying under the pin-free area in the center of the IC, and installing a capacitor in the hole.

Abstract: A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.

Abstract: A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.