Patents by Inventor Larry R. Radloff

Larry R. Radloff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrode semiconductor workpiece holder and processing methods
    Publication number: 20040178065
    Abstract: A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip.
    Type: Application
    Filed: March 29, 2004
    Publication date: September 16, 2004
    Applicant: Semitool, Inc.
    Inventors: Martin Bleck, Kenneth C. Haugan, Larry R. Radloff, Harry Geyer
  • Electrochemical processing method
    Patent number: 6733649
    Abstract: A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: May 11, 2004
    Assignee: Semitool, Inc.
    Inventors: Martin Bleck, Kenneth C. Haugan, Larry R. Radloff, Harry Geyer
  • Electrode semiconductor workpiece holder and processing methods
    Publication number: 20020050452
    Abstract: A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip.
    Type: Application
    Filed: March 16, 2001
    Publication date: May 2, 2002
    Inventors: Martin Bleck, Kenneth C. Haugan, Larry R. Radloff, Harry Geyer
  • Electrode semiconductor workpiece holder
    Patent number: 6274013
    Abstract: A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip and forming a seal.
    Type: Grant
    Filed: April 27, 1999
    Date of Patent: August 14, 2001
    Assignee: Semitool, Inc.
    Inventors: Martin Bleck, Kenneth C. Haugan, Larry R. Radloff, Harry Geyer
  • Electrode semiconductor workpiece holder
    Patent number: 5980706
    Abstract: A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip.
    Type: Grant
    Filed: July 15, 1996
    Date of Patent: November 9, 1999
    Assignee: Semitool, Inc.
    Inventors: Martin Bleck, Kenneth C. Haugan, Larry R. Radloff, Harry Geyer