Abstract: A heat sink buffer 10 is provided, including a backplate 20 defining a heat transfer passage 24. A thermally conductive buffer element 22 is positioned within and secured to the heat transfer passage 24 to provide a thermal conduit through the backplate 20.

Abstract: A heat sink buffer 10 is provided, including a backplate 20 defining a heat transfer passage 24. A thermally conductive buffer element 22 is positioned within and secured to the heat transfer passage 24 to provide a thermal conduit through the backplate 20.

Abstract: A process of cleaning a component following a forming operation that has left a residue on the component surface. The process comprises a thermal treatment during which the surface of the component is subjected to a controlled open flame, preferably in the presence of a limited amount of excess oxygen. Residues can be removed by the open flame to the extent that adhesion of a coating to the component surface can be greatly enhanced. Surface residue levels prior to the thermal treatment can be reduced by the use of lubricants prepared by diluting with de-ionized water or reverse osmosis water, thereby further increasing the likelihood of a residue-free surface having optimal adhesion properties. Under some circumstances, residue levels can be sufficiently reduced with the use of lubricants diluted with de-ionized or reverse osmosis water such that the thermal treatment can be omitted.