Abstract: Methods and apparatus for a predictive advertising engine may determine a user's likelihood to purchase an advertised item. Methods and apparatus for a predictive advertising engine may retrieve data associated with an advertisement, a content, and a user. The retrieved data may be enhanced, segmented, and sent to predictive modeling software. The predictive modeling software may calculate a score indicating the user's likelihood to purchase the advertised item. The scores may be stored in a first database. The first database may be referenced by the predictive advertising engine to determine which advertisement to deliver to the user. The predictive advertising engine may present a commercial to the user upon user selection of the advertisement, may present a questionnaire to the user upon the user viewing the commercial or selecting the advertisement, and may record the user's answers and interactions to further refine the predictive model.

Abstract: A method and apparatus for encapsulating optoelectronic components. An optical semiconductor die is attached to a lead frame or a substrate. A solid window transparent to light and no larger than the die area, excluding wire bond pads, is cut, scored, or otherwise singulated from glass or plastic. A transparent adhesive is applied to the optically-sensitive portion of the die, then the window is placed on the optically-sensitive portion of the die by a pick-and-place machine, forming a transparent aperture. Flexible support strips allow a die paddle to move during component assembly. Wires connect die circuitry to electrical leads on the lead frame or substrate. The assembly is encapsulated in molding material, leaving the upper surface of the window and the electrical leads exposed.

Abstract: A method for encapsulating optoelectronic components. An optical semiconductor die is attached to a lead frame or a substrate. A solid window transparent to light and no larger than the die area, excluding wire bond pads, is cut, scored, or otherwise singulated from glass or plastic. A transparent adhesive is applied to the optically-sensitive portion of the die, then the window is placed on the optically-sensitive portion of the die by a pick-and-place machine, forming a transparent aperture. Wires connect die circuitry to electrical leads on the lead frame or substrate. The assembly is encapsulated in molding material, leaving the upper surface of the window and the electrical leads exposed.