Abstract: The hip-or shoulder-joint endoprosthesis has a stem (10) and a ball head (20) that has an arched top side (21) and a closed underside (22). The longitudinal axis of the stem (10) forms an angle of at most 30° with the axis of the ball head (20). The stem (10) tapers with an overall aperture angle in the range of 5 to 30°. The ball head (20) has the shape of a sphere section of less than a hemisphere. The length of the stem (10) is less than the diameter of the ball head (20). The longitudinal axis of the stem (10) can coincide with the axis of the ball head (20).

Abstract: A cooling apparatus for power semiconductors, which apparatus is essentially box-shaped, has two extruded cooling sections (14, 15) joined to each other. One of the cooling profiles (14) forms a first heat-conducting side wall (16), and the other cooling profile (15) forms a second heat-conducting side wall (17), opposite the first side wall (16), of the cooling apparatus (1). The side walls (16, 17) have cooling partitions (18, 19) formed on the inner sides of the latter, which cooling partitions bound cooling channels through which a cooling fluid can be conducted. Power semiconductors (4, 5) are to be attached to the outer sides of the side walls (16, 17) in a heat-conducting manner. In order to achieve the largest possible cooling surface of the cooling apparatus, the cooling partitions (18) formed on the first side wall (16) project between the cooling partitions (19) formed on the second side wall (17).

Abstract: A cooling apparatus for power semiconductors, which apparatus is essentially box-shaped, has two extruded cooling sections (14, 15) joined to each other. One of the cooling profiles (14) forms a first heat-conducting side wall (16), and the other cooling profile (15) forms a second heat-conducting side wall (17), opposite the first side wall (16), of the cooling apparatus (1). The side walls (16, 17) have cooling partitions (18, 19) formed on the inner sides of the latter, which cooling partitions bound cooling channels through which a cooling fluid can be conducted. Power semiconductors (4, 5) are to be attached to the outer sides of the side walls (16, 17) in a heat-conducting manner. In order to achieve the largest possible cooling surface of the cooling apparatus, the cooling partitions (18) formed on the first side wall (16) project between the cooling partitions (19) formed on the second side wall (17).