Patents by Inventor Lars Markwort
Lars Markwort has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9355919Abstract: A method of inspecting a bonded wafer 3 arrangement comprises: directing measuring radiation through the bonded wafer arrangement 3; imaging at least a portion of the bonded wafer arrangement onto a detector 19 using the measuring radiation having traversed the bonded wafer arrangement, wherein an object side numerical aperture ? of the imaging 16, 18 is less than 0.05; and simultaneously detecting, using the detector 19, at least a portion of the measuring radiation having traversed the bonded wafer arrangement at a multitude of different spaced apart locations 23 within the field of view; wherein the detected radiation has an intensity spectrum such that an intensity of the detected radiation having wavelengths less than 700 nm is less than 10% of a total intensity of the detected radiation and an intensity of the detected radiation having wavelengths greater than 1200 nm is less than 10% of the total intensity of the detected radiation.Type: GrantFiled: August 23, 2011Date of Patent: May 31, 2016Assignee: Nanda Technologies GmbHInventors: Markus Estermann, Christoph Kappel, Reza Kharrazian, Lars Markwort
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Patent number: 9236225Abstract: Ion sources, systems and methods are disclosed.Type: GrantFiled: April 13, 2015Date of Patent: January 12, 2016Assignee: Carl Zeiss Microscopy, LLCInventors: Billy W. Ward, John A. Notte, IV, Louis S. Farkas, III, Randall G. Percival, Raymond Hill, Klaus Edinger, Lars Markwort, Dirk Aderhold, Ulrich Mantz
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Patent number: 9182357Abstract: A wafer inspection system comprises a camera having a field of view, an object mount configured to position at least a portion of surface 5 of an object 3 at an object plane 15 relative to the camera and within the field of view of the camera and at least one surface portion 41 carrying a multitude of retroreflectors 95 disposed at a greater ?d distance from the camera than the object plane and within the field of view of the camera.Type: GrantFiled: December 23, 2010Date of Patent: November 10, 2015Assignee: Nanda Technologies GmbHInventors: Lars Markwort, Ernst Hegels
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Publication number: 20150213997Abstract: Ion sources, systems and methods are disclosed.Type: ApplicationFiled: April 13, 2015Publication date: July 30, 2015Inventors: Billy W. Ward, John A. Notte, IV, Louis S. Farkas, III, Randall G. Percival, Raymond Hill, Klaus Edinger, Lars Markwort, Dirk Aderhold, Ulrich Mantz
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Patent number: 9012867Abstract: Ion sources, systems and methods are disclosed.Type: GrantFiled: May 23, 2014Date of Patent: April 21, 2015Assignee: Carl Zeiss Microscopy, LLCInventors: Billy W. Ward, John A. Notte, IV, Louis S. Farkas, Randall G. Percival, Raymond Hill, Klaus Edinger, Lars Markwort, Dirk Aderhold, Ulrich Mantz
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Publication number: 20140306121Abstract: Ion sources, systems and methods are disclosed.Type: ApplicationFiled: May 23, 2014Publication date: October 16, 2014Applicant: Carl Zeiss Microscopy, LLCInventors: Billy W. Ward, John A. Notte, IV, Louis S. Farkas, III, Randall G. Percival, Raymond Hill, Klaus Edinger, Lars Markwort, Dirk Aderhold, Ulrich Mantz
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Patent number: 8778702Abstract: A wafer inspection method comprises imaging a full surface of the wafer at an imaging resolution insufficient to resolve individual microstructures which are repetitively arranged on the wafer. A mask 109 is applied to the recorded image and unmasked portions 111 of the image are further processed by averaging. The unmasked portions 111 are selected such that they include memory portions of the wafer.Type: GrantFiled: August 16, 2010Date of Patent: July 15, 2014Assignee: Nanda Technologies GmbHInventors: Lars Markwort, Reza Kharrazian, Christoph Kappel, Pierre-Yves Guittet
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Patent number: 8748845Abstract: Ion sources, systems and methods are disclosed.Type: GrantFiled: January 24, 2012Date of Patent: June 10, 2014Assignee: Carl Zeiss Microscopy, LLCInventors: Billy W. Ward, John A. Notte, Louis S. Farkas, Randall G. Percival, Raymond Hill, Klaus Edinger, Lars Markwort, Dirk Aderhold, Ulrich Mantz
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Patent number: 8501503Abstract: A method of manufacturing a plurality of semiconductor wafers comprising micro-inspecting at least one location within at least one micro-inspected pattern field and determining at least one parameter value representing a property of the wafer at the micro-inspected location, macro-inspecting a plurality of locations within the at least one micro-inspected pattern field and determining, for each macro-inspected location of the macro-inspected pattern field, at least one parameter value representing the property of the wafer at the macro-inspected location based on the light intensity recorded for the macro-inspected location and on the at least one parameter value representing the property of the wafer at the micro-inspected location of this pattern field.Type: GrantFiled: April 26, 2012Date of Patent: August 6, 2013Assignee: Nanda Technologies GmbHInventors: Lars Markwort, Pierre-Yves Guittet
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Publication number: 20130157391Abstract: A method of inspecting a bonded wafer 3 arrangement comprises: directing measuring radiation through the bonded wafer arrangement 3; imaging at least a portion of the bonded wafer arrangement onto a detector 19 using the measuring radiation having traversed the bonded wafer arrangement, wherein an object side numerical aperture ? of the imaging 16, 18 is less than 0.05; and simultaneously detecting, using the detector 19, at least a portion of the measuring radiation having traversed the bonded wafer arrangement at a multitude of different spaced apart locations 23 within the field of view; wherein the detected radiation has an intensity spectrum such that an intensity of the detected radiation having wavelengths less than 700 nm is less than 10% of a total intensity of the detected radiation and an intensity of the detected radiation having wavelengths greater than 1200 nm is less than 10% of the total intensity of the detected radiation.Type: ApplicationFiled: August 23, 2011Publication date: June 20, 2013Applicant: NANDA TECHNOLOGIES GmbHInventors: Markus Estermann, Christoph Kappel, Reza Kharrazian, Lars Markwort
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Patent number: 8460946Abstract: A method of inspecting a semiconductor substrate having a back surface and including at least one piece of metal embedded in the substrate comprises directing measuring light towards the back surface of the substrate and detecting a portion of the measuring light received back from the substrate. The method also includes determining a distance between the piece of metal and the back surface based upon the detected measuring light received back from the substrate.Type: GrantFiled: April 18, 2011Date of Patent: June 11, 2013Assignees: Nanda Technologies GmbH, IMECInventors: Lars Markwort, Pierre-Yves Guittet, Sandip Halder, Anne Jourdain
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Patent number: 8368881Abstract: An inspection system includes optics, an object support for mounting an object in a region of an object plane of the optics, a bright-field light source, and a dark-field light source. The inspection system also includes an image detector having a radiation sensitive substrate disposed in a region of an image plane of the optics and a beam dump.Type: GrantFiled: October 20, 2011Date of Patent: February 5, 2013Assignee: Nanda Technologies GmbHInventors: Lars Markwort, Rajeshwar Chhibber
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Patent number: 8345232Abstract: An inspection system includes imaging optics for imaging an object plane into an image plane. The imaging optics include an objective lens having positive optical power, a first lens group having negative optical power, and a second lens group having positive optical power. The optical elements are arranged along a common unfolded optical axis with a pupil plane of the imaging optics located between the first lens group and the second lens group.Type: GrantFiled: October 29, 2010Date of Patent: January 1, 2013Assignee: Nanda Technologies GmbHInventors: Lars Markwort, Rajeshwar Chhibber, Klaus Eckerl, Norbert Harendt
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Publication number: 20120276664Abstract: A method of manufacturing a plurality of semiconductor wafers comprising micro-inspecting at least one location within at least one micro-inspected pattern field and determining at least one parameter value representing a property of the wafer at the micro-inspected location, macro-inspecting a plurality of locations within the at least one micro-inspected pattern field and determining, for each macro-inspected location of the macro-inspected pattern field, at least one parameter value representing the property of the wafer at the macro-inspected location based on the light intensity recorded for the macro-inspected location and on the at least one parameter value representing the property of the wafer at the micro-inspected location of this pattern field.Type: ApplicationFiled: April 26, 2012Publication date: November 1, 2012Inventors: Lars Markwort, Pierre-Yves Guittet
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Publication number: 20120268585Abstract: A wafer inspection system comprises a camera having a field of view, an object mount configured to position at least a portion of surface 5 of an object 3 at an object plane 15 relative to the camera and within the field of view of the camera and at least one surface portion 41 carrying a multitude of retroreflectors 95 disposed at a greater ?d distance from the camera than the object plane and within the field of view of the camera.Type: ApplicationFiled: December 23, 2010Publication date: October 25, 2012Inventors: Lars Markwort, Ernst Hegels
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Publication number: 20120142122Abstract: A wafer inspection method comprises imaging a full surface of the wafer at an imaging resolution insufficient to resolve individual microstructures which are repetitively arranged on the wafer. A mask 109 is applied to the recorded image and unmasked portions 111 of the image are further processed by averaging. The unmasked portions 111 are selected such that they include memory portions of the wafer.Type: ApplicationFiled: August 16, 2010Publication date: June 7, 2012Inventors: Lars Markwort, Reza Kharrazian, Christoph Kappel, Pierre-Yves Guittet
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Publication number: 20120141693Abstract: Ion sources, systems and methods are disclosed.Type: ApplicationFiled: January 24, 2012Publication date: June 7, 2012Applicant: ALIS CORPORATIONInventors: Billy W. Ward, John A. Notte, IV, Louis S. Farkas, III, Randall G. Percival, Raymond Hill, Klaus Edinger, Lars Markwort, Dirk Aderhold, Ulrich Mantz
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Publication number: 20120133760Abstract: An inspection system includes optics, an object support for mounting an object in a region of an object plane of the optics, a bright-field light source, and a dark-field light source. The inspection system also includes an image detector having a radiation sensitive substrate disposed in a region of an image plane of the optics and a beam dump.Type: ApplicationFiled: October 20, 2011Publication date: May 31, 2012Applicant: Nanda Technologies GmbHInventors: Lars Markwort, Rajeshwar Chhibber, Klaus Eckerl, Norbert Harendt
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Publication number: 20120094401Abstract: A method of inspecting a semiconductor substrate having a back surface and including at least one piece of metal embedded in the substrate comprises directing measuring light towards the back surface of the substrate and detecting a portion of the measuring light received back from the substrate. The method also includes determining a distance between the piece of metal and the back surface based upon the detected measuring light received back from the substrate.Type: ApplicationFiled: April 18, 2011Publication date: April 19, 2012Applicants: IMEC, Nanda Technologies GmbHInventors: Lars Markwort, Pierre-Yves Guittet, Sandip Halder, Anne Jourdain
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Patent number: 8110814Abstract: Ion sources, systems and methods are disclosed.Type: GrantFiled: February 2, 2009Date of Patent: February 7, 2012Assignee: ALIS CorporationInventors: Billy W. Ward, John A. Notte, IV, Louis S. Farkas, III, Randall G. Percival, Raymond Hill, Klaus Edinger, Lars Markwort, Dirk Aderhold, Ulrich Mantz