Abstract: Systems and methods are provided for connection of an optical fiber to a substrate. The substrate may comprise waveguide(s), guide pin(s), and a substrate body. The guide pin(s) define a first and second end and comprise a capture feature proximate the second end. The substrate body comprises a receiving feature configured to receive and connect the first end of guide pin(s), and the second end of guide pin(s) extends outwardly from the substrate body. The system also comprises a connector configured to receive the optical fiber and including a receiver portion that has a locking feature and defines a recess configured to receive the guide pin(s). The capture feature is configured to engage with the locking feature. When the capture feature is engaged with the locking feature, the optical fiber is aligned with the optical waveguide(s) and restrained from movement relative to the substrate.

Abstract: An optical assembly includes stacked planar lightwave circuit (PLC) members each having a plurality of waveguides in a respective plane, to provide optical connections to two-dimensional arrays of external optical waveguides (e.g., optical fiber cores), with one array including non-coplanar groups of waveguides having group members that are alternately arranged in a lateral direction. An optical assembly may provide optical connections between array of cores having a different pitch and/or orientation to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

Abstract: Waveguide substrate connection systems and methods are provided herein. An example waveguide assembly comprises a first substrate having a first waveguide, a second substrate having a second waveguide, an adhesive, and one or more spacers. A height for the one or more spacers is less than 10 ?m. The adhesive and the one or more spacers provide a composite material configured to assist in securing the first substrate and the second substrate together to align the first waveguide and the second waveguide. When the first substrate and the second substrate are attached together via the adhesive, the one or more spacers are configured to maintain a desired gap spacing therebetween so as to optimize coupling efficiency between the first waveguide and the second waveguide. The desired gap spacing corresponds to the height for the one or more spacers.

Abstract: Systems and methods are provided for aligning a substrate with an optical fiber. A system comprises an optical fiber and a substrate with one or more optical waveguides, guide pin(s), and a substrate body comprising a receiving feature configured to receive and connect with the guide pin(s). The system also comprises an adapter having a pair of opposing walls defining a spacing therebetween. The adapter is configured to receive and connect to the substrate body in between the pair of opposing walls. The system also comprises a plug defining a hole(s) that is configured to receive the guide pin(s). The plug is configured to receive and connect the optical fiber. Connection of the adapter and the substrate body and connection of the adapter and the plug restrain movement of the optical fiber relative to the substrate.

Abstract: An optical assembly includes stacked first and second planar lightwave circuit (PLC) members each having a plurality of waveguides in respective first and second planes, to provide optical connections between a two-dimensional array and a one-dimensional array of external optical waveguides (e.g., optical fiber cores). Inner faces of first and second PLC members are arranged facing one another and with the first and second planes (corresponding to the pluralities of first and second waveguides, respectively) being non-parallel. An optical assembly may provide optical connections between arrays of cores having a different pitch to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

Abstract: Optical components and optical connectors for optical communication are disclosed. In one embodiment, an optical component includes a substrate having a lens surface, a fiber coupling surface, and an array of lenses at the lens surface. The optical component further includes an array of optical fibers bonded to the fiber coupling surface such that the array of optical fibers is aligned with the array of lenses in a plane defined by the fiber coupling surface.

Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.

Abstract: An optical assembly includes stacked first and second planar lightwave circuit (PLC) members each having a plurality of waveguides in respective first and second planes, to provide optical connections between a two-dimensional array and a one-dimensional array of external optical waveguides (e.g., optical fiber cores). Inner faces of first and second PLC members are arranged facing one another and with the first and second planes (corresponding to the pluralities of first and second waveguides, respectively) being non-parallel. An optical assembly may provide optical connections between arrays of cores having a different pitch to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

Abstract: An optical assembly includes stacked planar lightwave circuit (PLC) members each having a plurality of waveguides in a respective plane, to provide optical connections to two-dimensional arrays of external optical waveguides (e.g., optical fiber cores), with one array including non-coplanar groups of waveguides having group members that are alternately arranged in a lateral direction. An optical assembly may provide optical connections between array of cores having a different pitch and/or orientation to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

Abstract: An optical connection substrate that includes a fiber cavity recessed into a first surface of the optical connection substrate, where the fiber cavity has a plurality of cavity walls and a cavity floor. The optical connection substrate also includes a plurality of fiber receiving grooves recessed into the first surface and a plurality of integrated waveguides disposed within a substrate body. The plurality of cavity walls have an interface cavity wall and the plurality of fiber receiving grooves extend from the interface cavity wall toward the plurality of integrated waveguides in alignment with the plurality of integrated waveguides.

Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.

Abstract: An optical-electrical substrate for providing electrical and optical connections to a photonic integrated circuit (PIC) includes a glass body with glass optical waveguides along an upper surface, and electrically conductive vias extending through a portion of the glass body from an intermediate surface to a lower surface. The intermediate surface is arranged at an elevation positioned between the upper and lower surfaces, and may optionally support redistribution layers and an electrical integrated circuit. An optical-electrical substrate may be fabricated by defining glass optical waveguides along an upper surface of a glass body, and forming electrically conductive vias through the glass body from the intermediate surface to the lower surface.

Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.

Abstract: Detachable optical connectors for optical chips and methods of their fabrication are disclosed. In one embodiment, an optical connector includes a ferrule that supports ferrule waveguides. The optical connector further includes a waveguide support coupled to the ferrule and that supports transition waveguides that are optically coupled to the ferrule waveguides. Ends of the ferrule waveguides are exposed at one end of the ferrule to define a first pitch while ends of the second waveguides are exposed at a chip coupling surface of the waveguide support. The transition waveguides provide at least one type of transition for the guided light traveling within the ferrule waveguides to enable either edge coupling, surface coupling or evanescent coupling to chip waveguides of an optical chip. The transition can include a change in mode-field diameter, direction of the guided light, and/or pitch.

Abstract: The methods of singulating an optical waveguide sheet that supports sheet optical waveguides include irradiating the optical waveguide sheet with a focused laser beam comprising ultrafast light pulses to form within the body of the optical waveguide sheet modified regions, which along with unmodified regions, that define a singulation line. The modified regions define modified sections that are spaced apart by the unmodified sections, which reside at locations of the sheet optical waveguides. The optical waveguide sheet is separated along the singulation line to form an optical waveguide substrate with substrate waveguides formed by sections of the sheet optical waveguides. The optical waveguide substrate has an end face with both smooth and rough sections. The substrate waveguides have end surfaces that terminate at the smooth sections, thereby enabling low-loss optical coupling to other optical components.

Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.

Abstract: Integrated circuit packages (100) having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article (120) including a glass substrate (122), an optical channel (132), and redistribution layers. The integrated circuit package (100) further includes an integrated circuit chip (160) positioned on the glass substrate (122) and in optical communication with the optical channel (132) and in electrical continuity with the redistribution layers (136).

Abstract: An optical connection substrate that includes a fiber cavity recessed into a first surface of the optical connection substrate, where the fiber cavity has a plurality of cavity walls and a cavity floor. The optical connection substrate also includes a plurality of fiber receiving grooves recessed into the first surface and a plurality of integrated waveguides disposed within a substrate body. The plurality of cavity walls have an interface cavity wall and the plurality of fiber receiving grooves extend from the interface cavity wall toward the plurality of integrated waveguides in alignment with the plurality of integrated waveguides.

Abstract: The methods of singulating an optical waveguide sheet that supports sheet optical waveguides include irradiating the optical waveguide sheet with a focused laser beam comprising ultrafast light pulses to form within the body of the optical waveguide sheet modified regions, which along with unmodified regions, that define a singulation line. The modified regions define modified sections that are spaced apart by the unmodified sections, which reside at locations of the sheet optical waveguides. The optical waveguide sheet is separated along the singulation line to form an optical waveguide substrate with substrate waveguides formed by sections of the sheet optical waveguides. The optical waveguide substrate has an end face with both smooth and rough sections. The substrate waveguides have end surfaces that terminate at the smooth sections, thereby enabling low-loss optical coupling to other optical components.

Abstract: The low-loss ion exchanged (IOX) waveguide disclosed herein includes a glass substrate having a top surface and comprising an alkali-aluminosilicate glass with between 3 and 15 mol % of Na2O and a concentration of Fe of 20 parts per million (ppm) or less. The glass substrate includes a buried Ag—Na IOX region, wherein this region and a surrounding portion of glass substrate define the IOX waveguide. The IOX waveguide has an optical loss OL?0.05 dB/cm and a birefringence magnitude |B|?0.001. The glass substrate with multiple IOX waveguides can be used as an optical backplane for systems having optical functionality and can find use in data center and high-performance data transmission applications.