Abstract: An inertial sensor, comprising a substrate and a rocker that is connected to the substrate via a spring apparatus, the spring apparatus having at least two springs for suspending the rocker on the substrate, the two springs being disposed with an offset from one another with reference to their longitudinal axis.

Abstract: A micromechanical structure, in particular a sensor arrangement, includes at least one micromechanical functional layer, a CMOS substrate region arranged below the at least one micromechanical functional layer, and an arrangement of one or more contact elements. The CMOS substrate region has at least one configurable circuit arrangement. The arrangement of one or more contact elements is arranged between the at least one micromechanical functional layer and the CMOS substrate region and is electrically connected to the micromechanical functional layer and the circuit arrangement. The configurable circuit arrangement is designed in such a way that the one or more contact elements are configured to be selectively connected to electrical connection lines in the CMOS substrate region.

Abstract: Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.

Abstract: A micromechanical structure, in particular a sensor arrangement, includes at least one micromechanical functional layer, a CMOS substrate region arranged below the at least one micromechanical functional layer, and an arrangement of one or more contact elements. The CMOS substrate region has at least one configurable circuit arrangement. The arrangement of one or more contact elements is arranged between the at least one micromechanical functional layer and the CMOS substrate region and is electrically connected to the micromechanical functional layer and the circuit arrangement. The configurable circuit arrangement is designed in such a way that the one or more contact elements are configured to be selectively connected to electrical connection lines in the CMOS substrate region.

Abstract: A micromechanical component comprising a substrate, a seismic mass, and first and second detection means, the substrate having a main extension plane and the first detection means being provided for detection of a substantially translational first deflection of the seismic mass along a first direction substantially parallel to the main extension plane, and the second detection means further being provided for detection of a substantially rotational second deflection of the seismic mass about a first rotation axis parallel to a second direction substantially perpendicular to the main extension plane. The seismic mass can be embodied as an asymmetrical rocker, with the result that accelerations can be sensed as rotations. Detection can be accomplished via capacitive sensors.

Abstract: Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.

Abstract: A capacitive micromechanical acceleration sensor has a substrate and a micromechanical functional layer situated above the substrate. A seismic mass, a suspension and fixed electrodes are situated in the micromechanical functional layer. The fixed electrodes are electrically connected to one another on a first and second side, respectively, of the suspension using buried conductor tracks. The fixed electrodes are connected to one another between the first and second side of the suspension using first and second conductors in the micromechanical functional layer.

Abstract: A micromechanical z-sensor includes a sensitivity, a torsion spring, and a seismic additional mass, the torsion spring having a spring width, and the seismic additional mass including webs having a web width. The web width is selected smaller than the spring width.

Abstract: A micromechanical acceleration sensor having a substrate, a suspension, a seismic mass, and stationary capacitive electrodes, in which the seismic mass is suspended over the substrate with the help of the suspension, the seismic mass has a mass center of gravity, the suspension has at least two anchors on the substrate, the two anchors are situated on opposite sides of the mass center of gravity, the distance between the two anchors being small compared to a horizontal extension of the seismic mass, the two anchors determine a central axis, the seismic mass have recesses which are situated on opposite sides of the central axis and are laterally open outward on the sides facing away from the central axis, and the stationary electrodes at least engage in the recesses of the seismic mass.

Abstract: An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer.

Abstract: An acceleration sensor includes a substrate and a first mass element, which is connected to the substrate in such a way that the first mass element is rotatable about an axis, the first mass element being connected to a second mass element in such a way that the second mass element is movable along a first direction parallel to the axis, and the first mass element being connected to a third mass element in such a way that the third mass element is movable along a second direction perpendicular to the axis.

Abstract: An inertial sensor, comprising a substrate and a rocker that is connected to the substrate via a spring apparatus, the spring apparatus having at least two springs for suspending the rocker on the substrate, the two springs being disposed with an offset from one another with reference to their longitudinal axis.

Abstract: An acceleration sensor includes a substrate, a rocker mass, a z spring connected to the rocker mass, which allows the rocker mass to rotate about an axis, and at least one additional spring system connected to the substrate and the rocker mass. The additional spring system allows the rocker mass to deflect in an x or y direction oriented parallel or perpendicular to the axis. The z spring or the additional spring system allows the rocker mass to deflect in a y or x direction oriented parallel or perpendicular to the axis.

Abstract: A sensor having a substrate, a cap and a seismic mass is proposed, the substrate having a main extension plane, the seismic mass being deflectable perpendicular to the main extension plane, a first stop of the cap covering a first area of the seismic mass perpendicular to the main extension plane in a first coverage region and a second stop of the cap covering a second area of the seismic mass perpendicular to the main extension plane in a second coverage region, and furthermore the first and second coverage regions parallel to the main extension plane being essentially equal in size. The distances of the coverage regions from a pivot axis of the mass designed as a rocker are equal so that the torques caused by electronic forces offset one another.

Abstract: A capacitive micromechanical acceleration sensor has a substrate and a micromechanical functional layer situated above the substrate. A seismic mass, a suspension and fixed electrodes are situated in the micromechanical functional layer. The fixed electrodes are electrically connected to one another on a first and second side, respectively, of the suspension using buried conductor tracks. The fixed electrodes are connected to one another between the first and second side of the suspension using first and second conductors in the micromechanical functional layer.

Abstract: A micromechanical component comprising a substrate, a seismic mass, and first and second detection means, the substrate having a main extension plane and the first detection means being provided for detection of a substantially translational first deflection of the seismic mass along a first direction substantially parallel to the main extension plane, and the second detection means further being provided for detection of a substantially rotational second deflection of the seismic mass about a first rotation axis parallel to a second direction substantially perpendicular to the main extension plane. The seismic mass can be embodied as an asymmetrical rocker, with the result that accelerations can be sensed as rotations. Detection can be accomplished via capacitive sensors.

Abstract: A micromechanical system includes a substrate, a first planar electrode, a second planar electrode, and a third planar electrode. The second planar electrode is movably positioned at a distance above the first planar electrode and the third planar electrode is positioned at a distance above the second electrode.

Abstract: A micromechanical component may include fixed electrodes and a seismic mass, the seismic mass being connected via a suspension element to a carrier substrate and being movable with respect to it. The seismic mass may include counterelectrodes, which are interconnected via a first electrically conductive connection. The fixed electrodes may include measuring electrodes and decoupled electrodes, the measuring electrodes being provided to function for an electrical evaluation, and the counterelectrodes situated across from the decoupled electrodes being provided to function as a frequency band-altering mechanical element.

Abstract: An acceleration sensor includes a seismic mass which is suspended on springs above a substrate and is deflectable in a direction perpendicular to a surface of the substrate. In order to reduce deflections of the seismic mass along the surface of the substrate because of interference accelerations, which lead to a falsification of the measurements of the deflection of the seismic mass perpendicular to the surface of the substrate, the springs include two bending bars which are interconnected via crosspieces.

Abstract: An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer.