Abstract: In a basic variant of a soldering device whereby a laser device is used for melting solder material (3), a protective device is provided which protects the laser lens system (22) from suctioned liquid solder material. Protection of the laser lens system can be achieved by a transverse flow from an inlet channel (23) into an outlet channel (24) and/or by a diaphragm (39) arranged in front of the laser lens system.

Abstract: A method for applying a solder to a substrate by positioning solder in a solid state, melting it and then impacting it against a substrate by the action of compressed gas. The method utilizes a holder having a capillary bore whose diameter, at the substrate end, has a contraction whose diameter (D2) is smaller than the diameter (D3) of the solder globule, an energy source connected to the capillary, and a compressed gas source connected to the capillary.

Abstract: A method for applying a solder to a substrate by positioning solder in a solid state, melting it and then impacting it against a substrate by means of compressed gas. The method utilizes a holder having a capillary bore whose diameter, at the substrate end, has a contraction whose diameter (D2) is smaller than the diameter (D3) of the solder globule, an energy source connected to the capillary, and a compressed gas source connected to the capillary.

Abstract: In order to apply solder material (20) to a workpiece (1), compressed gas is guided through a bore hole (5) of a capillary (3). A pressure sensor (13) situated in the bore hole (5) measures the dynamic pressure of the compressed gas. As soon as the tip (12) of the capillary approaches the workpiece (1), the dynamic pressure increases and is used as a measure for the distance between the tip (12) of the capillary (3) and the workpiece (1), enabling the feed motion of the capillary to be controlled.

Abstract: The invention relates to a device for applying pieces of material to a workpiece. Said device comprises a plurality of capillaries which respectively bring a piece of material (6) to a work station (3) in one working cycle. The piece of material is placed on the work station. A filling station fills a circular conveyer with a number of pieces of material (6) corresponding to the number of capillaries (4). An extracting station (19) is arranged in the transport path from the filling station (18) to the machining station (4?), said extracting station (19) extracting individual fragments of material (6) in a selective manner.

Abstract: The device for positioning a tool (1) in relation to a workpiece (6) controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) through two cameras (10, 11), the first (1) of which takes an image essentially along a spatial axis (y), the other (11) being oriented essentially vertically with respect to a surface (8) of the workpiece.

Abstract: In order to apply solder material (20) to a workpiece (1), compressed gas is guided through a bore hole (5) of a capillary (3). A pressure sensor (13) situated in the bore hole (5) measures the dynamic pressure of the compressed gas. As soon as the tip (12) of the capillary approaches the workpiece (1), the dynamic pressure increases and is used as a measure for the distance between the tip (12) of the capillary (3) and the workpiece (1), enabling the feed motion of the capillary to be controlled.

Abstract: The device for positioning a tool (1) in relation to a workpiece (6) controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) through two cameras (10, 11), the first (1) of which takes an image essentially along a spatial axis (y), the other (11) being oriented essentially vertically with respect to a surface (8) of the workpiece.

Abstract: The invention is a method for applying a solder to a substrate by positioning it in its solid physical condition, melting it and then impacting it against a substrate by means of compressed gas. The device for applying a solder (7) to a substrate (10, 11) comprises a holder (1) having a capillary bore (2) whose diameter, at the substrate end (3), has a contraction (4) whose diameter (D2) is smaller than the diameter (D3) of the solder globule (7).

Abstract: In a basic variant of a soldering device whereby a laser device is used for melting solder material (3), a protective device is provided which protects the laser lens system (22) from suctioned liquid solder material.

Abstract: The invention relates to a device for applying pieces of material to a workpiece. Said device comprises a plurality of capillaries which respectively bring a piece of material (6) to a work station (3) in one working cycle. The piece of material is placed on the work station. A filling station fills a circular conveyer with a number of pieces of material (6) corresponding to the number of capillaries (4). An extracting station (19) is arranged in the transport path from the filling station (18) to the machining station (4′), said extracting station (19) extracting individual fragments of material (6) in a selective manner.