Abstract: A polyurethane glass sealant is made by reacting a poly(1,2-butylene oxide) polymer with a chain extender and a polyisocyanate. The poly(1,2-butylene oxide) polymer may be used as a mixture with up to 50% by weight of other polyols, including castor oil. The sealant is especially useful as a secondary sealant for an insulated glass unit (IGU).

Abstract: The invention relates to isocyanate-free elastomer adhesives based on hybrid urethane-acrylate epoxies. The hybrid shows properties consistent for structural adhesives with excellent mechanical and thermal stability, and low read-through. The adhesives are suitable for use in industry, e.g., as adhesives for automotive applications.

Abstract: A polyurethane glass sealant is made by reacting a poly(1,2-butylene oxide) polymer with a chain extender and a polyisocyanate. The poly(1,2-butylene oxide) polymer may be used as a mixture with up to 50% by weight of other polyols, including castor oil. The sealant is especially useful as a secondary sealant for an insulated glass unit (IGU).

Abstract: An isocyanate terminated prepolymer has been discovered that has sufficiently low glass transition temperature (Tg), necessary rheological properties and mechanical properties that allows for the making of adhesive compositions useful for bonding substrates into larger structures (e.g., windows in vehicles and buildings) with minimal or no plasticizers. The polyether prepolymer comprises a polyisocyanate reaction product of a polyisocyanate having an isocyanate functionality of greater than 2 and a polyether monol having an average molecular weight (Mw) of 1000 to 2000 g/moles and said prepolymer having: (i) a weight molecular weight average (Mw) of about 2000 to about 30,000 g/mole, (ii) a free isocyanate content of 0.8% to 4% by weight of said prepolymer, and (iii) viscosity of 1000 to 50,000 centipoises.

Abstract: A polyurethane glass sealant is made by reacting a poly(1,2-butylene oxide) polymer with a chain extender and a polyisocyanate. The poly(1,2-butylene oxide) polymer may be used as a mixture with up to 50% by weight of other polyols, including castor oil. The sealant is especially useful as a secondary sealant for an insulated glass unit (IGU).

Abstract: The invention relates to isocyanate-free elastomer adhesives based on hybrid urethane-acrylate epoxies. The hybrid shows properties consistent for structural adhesives with excellent mechanical and thermal stability, and low read-through. The adhesives are suitable for use in industry, e.g., as adhesives for automotive applications.

Abstract: Embodiments of the invention provide for polyurethane-based sealants. The sealants include a reaction product of a reaction system which includes at least one isocyanate, and at least one polyester polyol. The polyester polyol includes a reaction product of a polyester reaction mixture which includes one or more hydrophobic monomers, one or more organic diacids or methyl esters thereof, and one or more diols.

Abstract: An isocyanate terminated prepolymer has been discovered that has sufficiently low glass transition temperature (Tg), necessary rheological properties and mechanical properties that allows for the making of adhesive compositions useful for bonding substrates into larger structures (e.g., windows in vehicles and buildings) with minimal or no plasticizers. The polyether prepolymer comprises a polyisocyanate reaction product of a polyisocyanate having an isocyanate functionality of greater than 2 and a polyether monol having an average molecular weight (Mw) of 1000 to 2000 g/moles and said prepolymer having: (i) a weight molecular weight average (Mw) of about 2000 to about 30,000 g/mole, (ii) a free isocyanate content of 0.8% to 4% by weight of said prepolymer, and (iii) viscosity of 1000 to 50,000 centipoises.

Abstract: A polyurethane glass sealant is made by reacting a poly(1,2-butylene oxide) polymer with a chain extender and a polyisocyanate. The poly(1,2-butylene oxide) polymer may be used as a mixture with up to 50% by weight of other polyols, including castor oil. The sealant is especially useful as a secondary sealant for an insulated glass unit (IGU).

Abstract: Embodiments of the invention provide for polyurethane-based sealants. The sealants include a reaction product of a reaction system which includes at least one isocyanate, and at least one polyester polyol. The polyester polyol includes a reaction product of a polyester reaction mixture which includes one or more hydrophobic monomers, one or more organic diacids or methyl esters thereof, and one or more diols.

Abstract: Embodiments of the invention include insulated units and methods of producing the insulating units. The insulating units include a first surface, a structural seal disposed on at least portions of the first surface, and a second surface disposed on the structural seal. The structural seal includes the reaction product of at least one first isocyanate, at least one isocyanate reactive side, and at least one adhesion promoter including a reaction product of at least one secondary aminoalkoxy silane and at least one second isocyanate.

Abstract: Embodiments of the invention include insulated units and methods of producing the insulating units. The insulating units include a first surface, a structural seal disposed on at least portions of the first surface, and a second surface disposed on the structural seal. The structural seal includes the reaction product of at least one first isocyanate, at least one isocyanate reactive side, and at least one adhesion promoter including a reaction product of at least one secondary aminoalkoxy silane and at least one second isocyanate.

Abstract: Insulated glass units are sealed with polyurethane made using a natural oil-based polyol (NOBP). In one embodiment the NOBP is made using a monol-rich monomer containing high levels of mono-hydroxy functional fatty acid methyl esters. Insulated glass sealants based on these compounds provide enhanced resistance to UV and oxidative degradation as compared to conventional products while still providing the required barrier and mechanical properties.

Abstract: A prepolymer and products made from the preopolymer is described. The prepolymer includes the reaction product of at least one isocyanate and at least one natural oil based polyol. The natural oil based polyol includes at least two natural oil moieties separated by a molecular structure having an average of at least about 19 ether groups between any 2 of the natural oil moieties or by a polyether molecular structure having an equivalent weight of at least about 480.

Abstract: Provided is a method for manufacturing a fixed abrasive material suitable for use in CMP planarization pads from an aqueous polymer dispersion that also includes abrasive particles that involves frothing the polymer dispersion, applying the froth to a substrate, mold or carrier and curing the froth to form a fixed abrasive material having an open cell structure containing between about 5 and 85 wt % abrasive particles and a dry density of about 350 kg/m3 to 1200 kg/m3.

Abstract: Provided are materials and methods for the chemical mechanical planarization of material layers using a down force of less than about 2.5 psi while maintaining a material removal rate generally similar to that obtained using higher down forces while simultaneously improving the selectivity of the process with respect to a primary material formed over a barrier material. The materials and methods disclosed herein are suitable for use in meatallization operations during semiconductor device fabrication, in particular in processes in which the primary material is a softer metal such as copper and the barrier material is a harder material such as a metal nitride.

Abstract: Provided are materials and methods for the chemical mechanical planarization of material layers such as oxide or metal formed on semiconductor substrates during the manufacture of semiconductor devices using a fixed abrasive planarization pad having an open cell foam structure from which free abrasive particles are produced by conditioning and combined with a carrier liquid to form an in situ slurry on the polishing surface of the planarization pad that, in combination with relative motion between the semiconductor substrate and the planarization pad, tends to remove the material layer from the surface of the semiconductor substrate. Depending on the composition of the material layer, the rate of material removal from the semiconductor substrate may be controlled by manipulating the pH or the oxidizer content of the carrier liquid.

Abstract: Provided are materials and methods for the chemical mechanical planarization of material layers using a down force of less than about 2.5 psi while maintaining a material removal rate generally similar to that obtained using higher down forces while simultaneously improving the selectivity of the process with respect to a primary material formed over a barrier material. The materials and methods disclosed herein are suitable for use in metallization operations during semiconductor device fabrication, in particular in processes in which the primary material is a softer metal such as copper and the barrier material is a harder material such as a metal nitride.

Abstract: Provided are materials and methods for the chemical mechanical planarization of material layers such as oxide or metal formed on semiconductor substrates during the manufacture of semiconductor devices using a fixed abrasive planarization pad having an open cell foam structure from which free abrasive particles are produced by conditioning and combined with a carrier liquid to form an in situ slurry on the polishing surface of the planarization pad that, in combination with relative motion between the semiconductor substrate and the planarization pad, tends to remove the material layer from the surface of the semiconductor substrate. Depending on the composition of the material layer, the rate of material removal from the semiconductor substrate may be controlled by manipulating the pH or the oxidizer content of the carrier liquid.

Abstract: Provided is a method for manufacturing a fixed abrasive material suitable for use in CMP planarization pads from an aqueous polymer dispersion that also includes abrasive particles that involves frothing the polymer dispersion, applying the froth to a substrate, mold or carrier and curing the froth to form a fixed abrasive material having an open cell structure containing between about 5 and 85 wt % abrasive particles and a dry density of about 350 kg/m3 to 1200 kg/m3.