Patents by Inventor LAURA KOCUBINSKI

LAURA KOCUBINSKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10375463
    Abstract: Described is a personal acoustic device that includes at least one earphone, such as an earbud, and a radio frequency (RF) antenna module in electrical communication with a wireless transceiver module inside the earphone to support wireless communication between the device and a remote wireless device. The RF antenna module includes an antenna element disposed in or on a remote housing and further includes an RF coaxial cable having one end in electrical communication with the antenna element and an opposite end in communication with the wireless transceiver module. Improved transmission and reception performance are achieved through increased separation of the antenna module from a user's head and body as compared to an antenna element disposed in the earphone. In addition, the size of the earphone can be reduced relative to an earphone having an antenna element.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: August 6, 2019
    Assignee: BOSE CORPORATION
    Inventors: Laura Kocubinski, Mari Shakthi Muthuswamy
  • Patent number: 9543243
    Abstract: Embodiments of the invention provide low-noise arrangements for very-large-scale integration (VLSI) differential input/output (I/O) structures (I/O pins, solder bumps, vias, etc.). Novel geometries are described for arranging differential pairs of I/O structures in perpendicular or near-perpendicular “quads.” The geometries effectively place one differential pair on or near the perpendicular bisector of its adjacent differential pair, such that field cancellation and differential reception can substantially eliminate noise without the need for added spacing or shields. By exploiting these effects, embodiments can suppress noise, independent of I/O structure spacing, and arbitrarily small spacings are permitted. Such arrangements can be extended into running chains, and even further into arrays of parallel chains. The parallel chains can be separated by supply structures (e.g.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: January 10, 2017
    Assignee: Oracle International Corporation
    Inventors: Robert P. Masleid, Donald Arthur Draper, Eben Kunz, Laura Kocubinski
  • Publication number: 20160134262
    Abstract: Embodiments of the invention provide low-noise arrangements for very-large-scale integration (VLSI) differential input/output (I/O) structures (I/O pins, solder bumps, vias, etc.). Novel geometries are described for arranging differential pairs of I/O structures in perpendicular or near-perpendicular “quads.” The geometries effectively place one differential pair on or near the perpendicular bisector of its adjacent differential pair, such that field cancellation and differential reception can substantially eliminate noise without the need for added spacing or shields. By exploiting these effects, embodiments can suppress noise, independent of I/O structure spacing, and arbitrarily small spacings are permitted. Such arrangements can be extended into running chains, and even further into arrays of parallel chains. The parallel chains can be separated by supply structures (e.g.
    Type: Application
    Filed: November 7, 2014
    Publication date: May 12, 2016
    Inventors: ROBERT P. MASLEID, DONALD ARTHUR DRAPER, EBEN KUNZ, LAURA KOCUBINSKI