Abstract: A data storage circuit includes an array of memory cells; a logic processing circuit configured to carry out a logic operation having N binary data as operands stored in N input memory cells, with N?2, the second input/output nodes of the input memory cells being linked by a common bit line, the logic processing circuit comprising: a transimpedance amplifier stage configured to supply an analogue read signal from the voltage of the common bit line; a comparator intended to compare the analogue read signal with a first adjustable reference voltage in order to generate a digital output signal corresponding to the result of the logic operation; a control unit configured to adjust the reference voltage to an amplitude selected from among N distinct predetermined amplitudes, depending on the type of logic operation.

Abstract: A data storage circuit includes a matrix of memory cells such that each memory cell comprises: a read circuit associated with at least one memory cell, comprising: a capacitive transimpedance amplifier stage configured to read a datum stored in a memory cell; the capacitive transimpedance amplifier stage comprising: an operational amplifier; a feedback capacitive impedance mounted between the output and the first input of the operational amplifier; a sequencer circuit configured to, following the reading of a datum corresponding to the second logic state, apply a control signal to the first input/output node having an amplitude lower than the first reference signal and maintain the selection transistor in an on state so as to replace, in the selected elementary storage component, a level of charges corresponding to the second logic state.

Abstract: A resistive memory cell may be provided with a first electrode and a second electrode arranged on either side of a dielectric layer and facing an interface between a first region and a second region, The first and second region may have different compositions in terms of doping and/or dielectric constant, so as to confine the zone of reversible creation of a conductive filament at the interface.

Abstract: A matrix includes a plurality of volatile switches, each of the volatile switches including an active layer made of an OTS material, the plurality of volatile switches being divided into two groups in such a way as to form a message, each of the volatile switches of the first group having been initialized beforehand by an initialization voltage, none of the volatile switches of the second group having been initialized beforehand, the message being formed by the initialized or non-initialized states of each of the switches of the matrix.

Abstract: A data storage circuit includes a matrix array of memory cells. The memory cells are configurable and non-volatile. Each one is intended to operate in either one of two operating configurations; the first operating configuration corresponding to a ferroelectric random-access memory; and the second operating configuration corresponding to a metal-oxide resistive random-access memory. Each memory cell comprises: a stack of thin layers in the following order: a first layer made of an electrically conductive material forming a lower electrode, a second layer made of a dielectric and ferroelectric material and a third layer made of electrically conductive material forming an upper electrode.

Abstract: A computer for executing a computation algorithm involving a digital variable as per at least two operating phases is provided. The computer includes a memory stage having: a first set of memories for storing a first sub-word of each digital variable; with each memory of the first set being non-volatile and having a first read endurance and a first write cyclability; a second set of memories for storing a second sub-word of each digital variable; with each memory of the second set having a second read endurance and a second write cyclability; with the first read endurance being greater than the second read endurance and the first write cyclability being less than the second write cyclability.

Abstract: A method for co-manufacturing a FeRAM and an OxRAM includes depositing a layer of first electrode carried out identically for a zone Z1 and a zone Z2; depositing a layer of hafnium dioxide-based active material carried out identically for Z1 and Z2; depositing a first conductive layer carried out identically for Z1 and Z2; making a mask at Z2, leaving Z1 free; removing the layer at Z1, with Z2 being protected by the mask; removing the mask at Z2; and depositing a second conductive layer in contact with the layer at Z2 and in contact with the layer at Z1, the material of the layer being chosen to create oxygen vacancies in the active layer and depositing a third conductive layer carried out identically for Z1 and Z2.

Abstract: A memory circuit includes a plurality of memory cells, each memory cell including a resistive memory element and a selection transistor of the FDSOI type connected in series with the resistive memory element. The selection transistor includes a channel region, a buried insulating layer, a back gate separated from the channel region by the buried insulating layer. The memory circuit further includes a circuit for biasing the back gate of the selection transistors, the biasing circuit being configured to apply a forward back-bias to the selection transistor of at least one memory cell during a programming or initialisation operation of the at least one memory cell.

Abstract: A matrix includes a plurality of volatile switches, each of the volatile switches including an active layer made of an OTS material, the plurality of volatile switches being divided into two groups in such a way as to form a message, each of the volatile switches of the first group having been initialized beforehand by an initialization voltage, none of the volatile switches of the second group having been initialized beforehand, the message being formed by the initialized or non-initialized states of each of the switches of the matrix.

Abstract: A method for increasing the surface roughness of a metal layer, includes depositing on the metal layer a sacrificial layer made of a dielectric material including nitrogen; exposing a surface of the sacrificial layer to an etching plasma so as to create asperities; and etching the metal layer through the sacrificial layer, so as to transfer the asperities of the sacrificial layer into a part at least of the metal layer.

Abstract: A method for increasing the surface roughness of a layer based on a metal having a catalytic power, includes fixing fluorine or chlorine on the surface of the metal based layer, by exposing the metal based layer to a plasma formed from a reactive gas containing fluorine or chlorine; exposing the surface of the metal based layer to a humid environment to produce an acid, by reaction of hydrogen from the humid environment with the fluorine or the chlorine fixed on the surface of the metal based layer, the acid reacting with the metal to form residues, the whole of the residues forming a pattern on the surface of the metal based layer, and etching the metal based layer through the residues, so as to transfer the pattern into the metal based layer.

Abstract: Resistive memory cell provided with a first electrode and a second electrode arranged on either side of a dielectric layer and facing an interface between a first region and a second region, said first and second region having different compositions in terms of doping and/or dielectric constant, so as to confine the zone of reversible creation of a conductive filament at said interface.

Abstract: A method of production of a field-effect transistor from a stack of layers forming a semiconductor-on-insulator type substrate, the stack including a superficial layer of an initial thickness, made of a crystalline semiconductor material and covered with a protective layer, the method including: defining, by photolithography, a gate pattern in the protective layer; etching the gate pattern into the superficial layer to leave a thickness of the layer of semiconductor material in place, the thickness defining a height of a conduction channel of the field-effect transistor; forming a gate in the gate pattern; forming, in the superficial layer and on either side of the gate, source and drain zones, while preserving, in the zones, the initial thickness of the superficial layer.

Abstract: A resistive non-volatile memory cell includes a first electrode, a second electrode and an oxide layer disposed between the first electrode and the second electrode, the memory cell being capable of reversibly switching between: —a high resistance state obtained by applying a first bias voltage between the first electrode and the second electrode; and—a low resistance state obtained by applying a second bias voltage between the first electrode and the second electrode; the oxide layer including a switching zone forming a conduction path prioritised for the current passing through the memory cell when the memory cell is in the low resistance state. The oxide layer includes a first zone doped with aluminium or silicon, the aluminium or silicon being present in the first zone with an atomic concentration that is selected so as to locate the switching zone outside the first zone.

Abstract: A method of fabrication of a ferroelectric memory including a first electrode, a second electrode and a layer of active material made of hafnium dioxide HfO2 positioned between the first electrode and the second electrode, where the method includes depositing a first electrode layer; depositing the layer of active material; doping the layer of active material; depositing a second electrode layer; wherein the method includes sub-microsecond laser annealing of the layer of doped active material.

Abstract: A device for selecting a storage cell, includes a first electrode, a second electrode and an oxide layer disposed between the first electrode and the second electrode, wherein the oxide layer is doped with a first element from column IV of the periodic table.

Abstract: A photosensitive transistor device, on a semiconductor on insulator substrate, the photosensitive zone being formed in a substrate support layer and being arranged so that the concentration of photogenerated charges in the photosensitive zone can be increased towards a given zone facing the channel zone of the transistor.

Abstract: A method of fabrication of a ferroelectric memory including a first electrode, a second electrode and a layer of active material made of hafnium dioxide HfO2 positioned between the first electrode and the second electrode, where the method includes depositing a first electrode layer; depositing the layer of active material; doping the layer of active material; depositing a second electrode layer; wherein the method includes sub-microsecond laser annealing of the layer of doped active material.

Abstract: A device for selecting a storage cell, includes a first electrode, a second electrode and an oxide layer disposed between the first electrode and the second electrode, wherein the oxide layer is doped with a first element from column IV of the periodic table.

Abstract: Field-effect transistor, the source and drain regions whereof are formed from a crystalline structure comprising: a first layer comprising two main faces parallel to one another and two lateral faces parallel to one another, the main faces being perpendicular to the lateral faces, a second layer overlapping the first layer, the second layer comprising a first main face and a second main face parallel to one another and two lateral faces, the first main face being in contact with the first layer, the lateral faces forming an angle ? in the range 50° to 59°, and preferably a 53° angle, with the first main face.