Abstract: A composite article (30), comprising at least one fibrous layer (12), and at least one thermoplastic epoxy web layer (14) located in direct planar contact with the at least one fibrous layer (12), the at least one thermoplastic epoxy web layer (14) being adapted to substantially phase separate during a molding and/or curing process.

Abstract: Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.

Abstract: A composite article (30), comprising at least one fibrous layer (12), and at least one thermoplastic epoxy web layer (14) located in direct planar contact with the at least one fibrous layer (12), the at least one thermoplastic epoxy web layer (14) being adapted to substantially phase separate during a molding and/or curing process.

Abstract: A composite article (30), comprising at least one fibrous layer (12), and at least one thermoplastic epoxy web layer (14) located in direct planar contact with the at least one fibrous layer (12), the at least one thermoplastic epoxy web layer (14) being adapted to substantially phase separate during a molding and/or curing process.

Abstract: The present teachings contemplate relatively high glass transition temperature (Tg) polymers and/or other reaction products. A method may include reacting a diepoxide with a bisphenol in amounts and under conditions to produce a material that has a Tg as measured by differential scanning calorimetry according to ASTM E1358-08(2014) of at least about 90° C. at least about 100° C. (at least about 110° C., or at least about 120° C.

Abstract: The present invention contemplates a method for forming a reformable epoxy resin material into a fiber format and: (i) weaving the reformable epoxy resin material (10) with a reinforcing fiber (12) to form a woven material; (ii) stitching a secondary material (14) with reformable epoxy resin material; and optionally (iii) forming a web or mesh with the reformable epoxy resin material.

Abstract: The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact.

Abstract: The invention relates to a structural adhesive formulation, which is heat activatable at a heat activation temperature; meltable without heat activation at an application temperature above its melting point and below the heat activation temperature; and solid at ambient temperature; wherein upon heat activation the structural adhesive formulation is capable of expansion with a volumetric expansion of up to about 250 vol.-%; wherein the heat activatable structural adhesive formulation comprises (a) an epoxy resin component; (b) an adhesion promoter component; (c) a cross-linking component; (d) a blowing component; (e) optionally, an impact modifier component; (f) optionally, a thixotropic filler component; and (g) optionally, a non-thixotropic filler component. The structural adhesive formulation is particularly useful for application by means of a hot melt applicator, preferably a hand held hot melt gun.

Abstract: A composite article (30), comprising at least one fibrous layer (12), and at least one thermoplastic epoxy web layer (14) located in direct planar contact with the at least one fibrous layer (12), the at least one thermoplastic epoxy web layer (14) being adapted to substantially phase separate during a molding and/or curing process.

Abstract: The present teachings contemplate relatively high glass transition temperature (Tg) polymers and/or other reaction products. A method may include reacting a diepoxide with a bisphenol in amounts and under conditions to produce a material that has a Tg as measured by differential scanning calorimetry according to ASTM E1358-08(2014) of at least about 90° C. at [east about 100° C. (at least about 110° C., or at least about 120° C.

Abstract: Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.

Abstract: The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact.

Abstract: The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact.

Abstract: The present invention contemplates a method for forming a reformable epoxy resin material into a fiber format and: (i) weaving the reformable epoxy resin material (10) with a reinforcing fiber (12) to form a woven material; (ii) stitching a secondary material (14) with reformable epoxy resin material; and optionally (iii) forming a web or mesh with the reformable epoxy resin material.

Abstract: The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact.