Abstract: The present invention concerns the field of communication networks having a structure similar to an aeronautical telecommunications network (ATN). In particular, the invention relates in particular to how to simply simulate a large number of subscribers exchanging information via an ATN with equipment under test so as to test the ability of the equipment to exchange, via an ATN, information with a large number of subscribers. The inventive architecture comprises in particular a modified ATN stack enabling several separate communication channels to be opened on the ATN for a common application, said application being simultaneously implemented by several simulated entities. The modification of the ATN stack concerns in particular the assignment, by the corresponding ASE layers, of AEq identifiers to the applications implemented by the simulated entities. This modification also concerns the association of a network identifier TSEL with an AEq identifier from a modified ASE layer.

Abstract: The invention concerns a method for making a card with tips for testing semiconductor chips with microsphere bond pads. A first adhesive coat is vacuum deposited on a flexible polyimide film, followed by a second metal coat. A combination of UV photolithography and electroforming of a metal material enables to obtain the implantation of the tips. The pattern of the strip conductors is obtained by a second UV lithography operation whereby the second metal layer and the first adhesive coat are etched. An insulating protective resist is deposited on the active conductive zone. The flexible film is mounted on a truncated maintaining component whereof the vertical translational and planar rotational movements are made possible by a guide supported on a spring suspension. The defective alignment between the plane of the tips and the plane of the tips and the printed circuit plane is corrected by a correcting system with three support points adjustable with screws.

Abstract: The invention concerns a method for making a card with tips for testing semiconductor chips with microsphere bond pads. A first adhesive coat is vacuum deposited on a flexible polyimide film, followed by a second metal coat. A combination of UV photolithography and electroforming of a metal material enables to obtain the implantation of the tips. The pattern of the strip conductors is obtained by a second UV lithography operation whereby the second metal layer and the first adhesive coat are etched. An insulating protective resist is deposited on the active conductive zone. The flexible film is mounted on a truncated maintaining component whereof the vertical translational and planar rotational movements are made possible by a guide supported on a spring suspension. The defective alignment between the plane of the tips and the plane of the tips and the printed circuit plane is corrected by a correcting system with three support points adjustable with screws.

Abstract: Putative Adrenomedullin Receptor polypeptides and polynucleotides and methods for producing such polypeptides by recombinant techniques are disclosed. Also disclosed are methods for utilizing Putative Adrenomedullin Receptor polypeptides and polynucleotides in the design of protocols for the treatment of infections such as bacterial, fungal protozoan and viral infections, particularly infections caused by HIV-1 or HIV-2; pain; cancers; diabetes, obesity; anorexia; bulimia; asthma; Parkinson's disease; acute heart failure; hypotension; hypertension, urinary retention, osteoporosis; angina pectoris; myocardial infarction, ulcers; asthma; allergies; benign prostatic hypertrophy; psychotic and neurological disorders, including anxiety, schizophrenia, manic depression, delirium, dementia, severe mental retardation and dyskinesias, such as Huntington's disease or Gilles dela Tourett's syndrome; and pre-eclampsia, among others and diagnostic assays for such conditions.