Patents by Inventor Laurent Tomasini

Laurent Tomasini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fastening a semiconductor chip on a lead frame, and electronic component
    Patent number: 11127602
    Abstract: A method of attaching a semiconductor chip to a lead frame, including A) providing a semiconductor chip, B) applying a solder metal layer sequence on the semiconductor chip, C) providing a lead frame, D) applying a metallization layer sequence on the lead frame, E) applying the semiconductor chip on the lead frame via the solder metal layer sequence and the metallization layer sequence, and F) heating the arrangement produced under E) to attach the semiconductor chip to the lead frame, wherein the solder metal layer sequence includes a first metallic layer including an indium-tin alloy, a barrier layer arranged above the first metallic layer, and a second metallic layer including gold arranged between the barrier layer and the semiconductor chip.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: September 21, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Mathias Wendt, Klaus Müller, Laurent Tomasini
  • METHOD OF FASTENING A SEMICONDUCTOR CHIP ON A LEAD FRAME, AND ELECTRONIC COMPONENT
    Publication number: 20200234976
    Abstract: A method of attaching a semiconductor chip to a lead frame, including A) providing a semiconductor chip, B) applying a solder metal layer sequence on the semiconductor chip, C) providing a lead frame, D) applying a metallization layer sequence on the lead frame, E) applying the semiconductor chip on the lead frame via the solder metal layer sequence and the metallization layer sequence, and F) heating the arrangement produced under E) to attach the semiconductor chip to the lead frame, wherein the solder metal layer sequence includes a first metallic layer including an indium-tin alloy, a barrier layer arranged above the first metallic layer, and a second metallic layer including gold arranged between the barrier layer and the semiconductor chip.
    Type: Application
    Filed: February 28, 2018
    Publication date: July 23, 2020
    Inventors: Mathias Wendt, Klaus Müller, Laurent Tomasini