Patents by Inventor Laurent Ulmer

Laurent Ulmer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit on high performance chip
    Patent number: 8048766
    Abstract: A method of fabricating a die containing an integrated circuit, including active components and passive components, includes producing a first substrate containing at least one active component of active components and a second substrate containing critical components of the passive components, such as perovskites or MEMS, and bonding the two substrates by a layer transfer. The method provides an improved monolithic integration of devices such as MEMS with transistors.
    Type: Grant
    Filed: June 23, 2004
    Date of Patent: November 1, 2011
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Jean-Pierre Joly, Laurent Ulmer, Guy Parat
  • Integrated circuit on high performance chip
    Publication number: 20060252229
    Abstract: A method of fabricating a die containing an integrated circuit, including active components and passive components, includes producing a first substrate containing at least one active component of active components and a second substrate containing critical components of the passive components, such as perovskites or MEMS, and bonding the two substrates by a layer transfer. The method provides an improved monolithic integration of devices such as MEMS with transistors.
    Type: Application
    Filed: June 23, 2004
    Publication date: November 9, 2006
    Inventors: Jean-Pierre Joly, Laurent Ulmer, Guy Parat