Patents by Inventor Lauriann T. Carney

Lauriann T. Carney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package
    Patent number: 5886396
    Abstract: A semiconductor die (32) is disposed on a heat sink (22) in an electronic package (10). During assembly, a leadframe (20) is connected to the heat sink (22) by down-set tabs (14, 28), which are offset from the heat sink (22) and disposed within the boundary (19) in which the final package (10) will be molded. Individual heat sinks (22) are pre-out prior to molding the final packages (10). In one roach, pins (36) are used to connect down-set tabs (14, 28) to heat sink (22).
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: March 23, 1999
    Assignee: Motorola, Inc.
    Inventors: Lauriann T. Carney, William M. Strom
  • Lead frame assembly for surface mount integrated circuit power package
    Patent number: 5587883
    Abstract: A lead frame package for housing an integrated circuit. A lead frame (11) having a plurality of leads (13) extending from at least three sides of the package. Lead frame (11) is formed having a first region (18), a transition region (19), and a second region (21). A distance between a heat sink (12) and the lead frame (11) may vary. The offset is chosen to compensate for a predetermined distance between the heat sink (12) and the lead frame (11) such that the lead frame (11) aligns to lead frame handling equipment. A single lead frame manufacturing setup can then be used. A slot (22) is formed in the lead frame (11) extending through the second region (21) and the transition region (19) into first area (18) providing a path for injecting an encapsulation material into a mold.
    Type: Grant
    Filed: November 13, 1995
    Date of Patent: December 24, 1996
    Assignee: Motorola, Inc.
    Inventors: Timothy L. Olson, Lauriann T. Carney, Gary C. Johnson, William M. Strom